Patents by Inventor Akihiro Kubo
Akihiro Kubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11953843Abstract: A powder container includes a powder chamber for containing powder for forming images, a powder outlet formed in a face of the powder container, and a shutter assembly to open and close the powder outlet and including first and second shutters. The first shutter is movable between a sealing position to close the powder outlet and an open position to open the powder outlet and includes a pressed member to cancel retention of the first shutter at the sealing position. The second shutter includes a pressing projection that interferes with the pressed member of the first shutter and is movable between a shielding position to cover the pressed member without interference between the pressing projection and the pressed member and a releasing position to press the pressed member with the pressing projection.Type: GrantFiled: July 13, 2022Date of Patent: April 9, 2024Assignee: RICOH COMPANY, LTD.Inventors: Kentaro Nodera, Emi Kita, Akihiro Takayama, Susumu Tateyama, Shinnosuke Koshizuka, Tatsuya Kubo, Teppei Kikuchi
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Publication number: 20240097147Abstract: A positive electrode sheet for air batteries according to an embodiment of this invention comprises a waved fibrous carbon and has a BET method specific surface area in a range of 300 to 1200 m2/g, a 5 to 1000 nm-diameter pore surface area in a range of 200 to 600 m2/g, a 0.1 to 10 ?m-diameter pore volume in a range of more than 2.0 to no more than 10.0 cm3/g, a 2 to 1000 nm-diameter pore volume in a range of 1.0 to 5.0 cm3/g, and a sheet density in a range of 0.05 to 0.23 g/cm3.Type: ApplicationFiled: January 14, 2022Publication date: March 21, 2024Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCEInventors: Akihiro NOMURA, Yoshimi KUBO, Emiko FUJII
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Publication number: 20230381825Abstract: A substrate cleaning apparatus includes a holder configured to hold a substrate; a circular ring-shaped body; grooves formed in a radial shape at an upper portion of the circular ring-shaped body, each groove having a bottom located on the circular ring-shaped body; a sliding surface which is a top surface of the circular ring-shaped body between the respective grooves, and configured to be slid on a bottom surface of the substrate; a supporting body configured to support and rotate the circular ring-shaped body in a circumferential direction; a cleaning liquid supply configured to allow a cleaning liquid to be absorbed into the circular ring-shaped body; and a relatively moving mechanism configured to move the substrate and the supporting body relative to each other in a state that the sliding surface being rotated and having absorbed the cleaning liquid presses the bottom surface of the substrate.Type: ApplicationFiled: May 24, 2023Publication date: November 30, 2023Inventors: Yoshiki Okamoto, Akihiro Kubo, Yasushi Takiguchi
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Patent number: 11554389Abstract: A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof.Type: GrantFiled: January 20, 2021Date of Patent: January 17, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Akihiro Kubo, Yasushi Takiguchi, Teruhiko Kodama, Yoshiki Okamoto
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Patent number: 11532487Abstract: A substrate processing apparatus includes a polishing member having a polishing surface configured to perform a polishing of a main surface of a substrate; a first dressing member having a first dressing surface configured to perform a dressing of the polishing surface; a second dressing member having a second dressing surface configured to perform a dressing of the first dressing surface; a holding member configured to hold the polishing member and the second dressing member; and a driving unit configured to, by moving the holding member, switch a first state in which the first dressing surface and the polishing surface come into contact with each other to perform the dressing of the polishing surface and a second state in which the first dressing surface and the second dressing surface come into contact with each other to perform the dressing of the first dressing surface.Type: GrantFiled: May 12, 2020Date of Patent: December 20, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Akihiro Kubo, Yasushi Takiguchi, Teruhiko Kodama, Yoshiki Okamoto, Hayato Hosaka
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Publication number: 20210308828Abstract: A dressing apparatus includes a bus member which is equipped with a ceiling plate and a circular or polygonal cylindrical skirt portion provided at a bottom surface of the ceiling plate and which is configured to accommodate a polishing pad from thereabove. The bus member includes a dual fluid nozzle configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad; a dress board configured to come into contact with the polishing surface of the polishing pad; and a rinse nozzle configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad and the dress board. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion.Type: ApplicationFiled: June 15, 2021Publication date: October 7, 2021Inventors: Yoshiki Okamoto, Yasushi Takiguchi, Akihiro Kubo, Hayato Hosaka, Ryuto Ozasa
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Publication number: 20210220878Abstract: A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof.Type: ApplicationFiled: January 20, 2021Publication date: July 22, 2021Inventors: Akihiro Kubo, Yasushi Takiguchi, Teruhiko Kodama, Yoshiki Okamoto
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Patent number: 11059145Abstract: A dressing apparatus 200 includes a bus member 203 which is equipped with a ceiling plate 201 and a circular or polygonal cylindrical skirt portion 202 provided at a bottom surface of the ceiling plate 201 and which is configured to accommodate a polishing pad 131 from thereabove. The bus member 203 includes a dual fluid nozzle 204 configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad 131; a dress board 205 configured to come into contact with the polishing surface of the polishing pad 131; and a rinse nozzle 206 configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad 131 and the dress board 205. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion 202.Type: GrantFiled: August 9, 2018Date of Patent: July 13, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Yoshiki Okamoto, Yasushi Takiguchi, Akihiro Kubo, Hayato Hosaka, Ryuto Ozasa
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Publication number: 20210039221Abstract: A substrate warpage correction method according to this disclosure corrects warpage of a substrate without performing a process on a front surface of the substrate. The substrate warpage correction method includes a surface roughening of performing a surface roughening process on a rear surface of the substrate using a surface roughening processing apparatus configured to be able to perform the surface roughening process on the rear surface of the substrate, to form grooves in the rear surface to thereby correct the warpage of the substrate.Type: ApplicationFiled: February 26, 2019Publication date: February 11, 2021Inventors: Nozomu KANETAKE, Akihiro KUBO, Teruhiko KODAMA, Taro YAMAMOTO, Yasushi TAKIGUCHI, Yoshiki OKAMOTO, Hayato HOSAKA
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Publication number: 20200365417Abstract: A substrate processing apparatus includes a polishing member having a polishing surface configured to perform a polishing of a main surface of a substrate; a first dressing member having a first dressing surface configured to perform a dressing of the polishing surface; a second dressing member having a second dressing surface configured to perform a dressing of the first dressing surface; a holding member configured to hold the polishing member and the second dressing member; and a driving unit configured to, by moving the holding member, switch a first state in which the first dressing surface and the polishing surface come into contact with each other to perform the dressing of the polishing surface and a second state in which the first dressing surface and the second dressing surface come into contact with each other to perform the dressing of the first dressing surface.Type: ApplicationFiled: May 12, 2020Publication date: November 19, 2020Inventors: Akihiro Kubo, Yasushi Takiguchi, Teruhiko Kodama, Yoshiki Okamoto, Hayato Hosaka
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Patent number: 10840079Abstract: A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.Type: GrantFiled: November 28, 2017Date of Patent: November 17, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Yasushi Takiguchi, Taro Yamamoto, Yoshiki Okamoto, Hayato Hosaka, Teruhiko Kodama, Akihiro Kubo, Ryuto Ozasa, Yuji Ariuchi, Shinsuke Kimura
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Patent number: 10400139Abstract: The present invention provides a coating composition which cures at low temperatures to form a cured film having high solvent resistance.Type: GrantFiled: August 19, 2016Date of Patent: September 3, 2019Assignee: NIPPON PAINT HOLDINGS CO., LTD.Inventors: Isamu Onishi, Akihiro Kubo, Yukiko Toyota, Yoshinori Kushi
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Patent number: 10328546Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.Type: GrantFiled: April 27, 2017Date of Patent: June 25, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Akihiro Kubo, Masahiro Fukuda, Taro Yamamoto, Kenji Yada, Masashi Enomoto, Noboru Nakashima
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Publication number: 20190047118Abstract: A dressing apparatus 200 includes a bus member 203 which is equipped with a ceiling plate 201 and a circular or polygonal cylindrical skirt portion 202 provided at a bottom surface of the ceiling plate 201 and which is configured to accommodate a polishing pad 131 from thereabove. The bus member 203 includes a dual fluid nozzle 204 configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad 131; a dress board 205 configured to come into contact with the polishing surface of the polishing pad 131; and a rinse nozzle 206 configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad 131 and the dress board 205. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion 202.Type: ApplicationFiled: August 9, 2018Publication date: February 14, 2019Inventors: Yoshiki Okamoto, Yasushi Takiguchi, Akihiro Kubo, Hayato Hosaka, Ryuto Ozasa
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Patent number: 10202050Abstract: A power rail-support unit includes: a base portion that is integrally fixed on a track; a guide rail on which a guide wheel of a side portion of a vehicle travelling on the track abuts; a first fixing portion that is configured to fix the guide rail on the base portion; a second fixing portion that is connected to the guide rail so as to be independent of the first fixing portion; a bracket that is supported on the guide rail; and a power rail that is supported by the bracket so as to be arranged at a predetermined relative position relative to the guide rail, and that slides on and makes contact with a collector of the vehicle.Type: GrantFiled: February 17, 2015Date of Patent: February 12, 2019Assignee: MITSUBISHI HEAVY INDUSTRIES ENGINEERING, LTD.Inventors: Akihiro Kubo, Kosaku Murase, Eisuke Okano
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Publication number: 20180258318Abstract: The present invention provides a coating composition which cures at low temperatures to form a cured film having high solvent resistance.Type: ApplicationFiled: August 19, 2016Publication date: September 13, 2018Applicant: NIPPON PAINT HOLDINGS CO., LTD.Inventors: Isamu ONISHI, Akihiro KUBO, Yukiko TOYOTA, Yoshinori KUSHI
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Patent number: 10074542Abstract: There is provided a substrate processing method which includes polishing a rear surface of a substrate before a pattern exposure such that the rear surface is subjected to a roughening treatment; and bypassing a roughness alleviating treatment with respect to the polished rear surface of the substrate.Type: GrantFiled: September 16, 2016Date of Patent: September 11, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Akihiro Kubo, Teruhiko Kodama
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Publication number: 20180151343Abstract: A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.Type: ApplicationFiled: November 28, 2017Publication date: May 31, 2018Inventors: Yasushi TAKIGUCHI, Taro YAMAMOTO, Yoshiki OKAMOTO, Hayato HOSAKA, Teruhiko KODAMA, Akihiro KUBO, Ryuto OZASA, Yuji ARIUCHI, Shinsuke KIMURA
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Publication number: 20170225289Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.Type: ApplicationFiled: April 27, 2017Publication date: August 10, 2017Inventors: Akihiro KUBO, Masahiro FUKUDA, Taro YAMAMOTO, Kenzi YADA, Masashi ENOMOTO, Noboru NAKASHIMA
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Patent number: D855664Type: GrantFiled: May 2, 2018Date of Patent: August 6, 2019Assignee: YANMAR CO., LTD.Inventors: Kiyoyuki Okuyama, Kenji Komori, Akihiro Kubo