Abstract: A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

Abstract: There is provided a substrate processing method which includes polishing a rear surface of a substrate before a pattern exposure such that the rear surface is subjected to a roughening treatment; and bypassing a roughness alleviating treatment with respect to the polished rear surface of the substrate.

Abstract: A substrate liquid treatment apparatus comprises a chuck (13) that holds and rotates a wafer, a back surface purging nozzle (15) that discharges a purge gas toward the back surface of the wafer, and a periphery purging nozzle 16 that discharges the purge gas onto the back surface of the wafer. The back surface purging nozzle has a slit-like opening part extending from a central side to a peripheral side of the substrate in a plan view. Vertical distance between the slit-like opening part and the substrate held by the substrate holding unit increases as approaching an end of the opening part on the central side of the substrate. The periphery purging nozzle discharges the purge gas, toward a central part of the substrate, toward a region on the back surface of the substrate, which region is located radially outside an end of the slit-like opening part of the back surface purging nozzle and radially inside an peripheral edge of the substrate.

Abstract: A power rail-support unit includes: a base portion that is integrally fixed on a track; a guide rail on which a guide wheel of a side portion of a vehicle travelling on the track abuts; a first fixing portion that is configured to fix the guide rail on the base portion; a second fixing portion that is connected to the guide rail so as to be independent of the first fixing portion; a bracket that is supported on the guide rail; and a power rail that is supported by the bracket so as to be arranged at a predetermined relative position relative to the guide rail, and that slides on and makes contact with a collector of the vehicle.

Abstract: A vehicle pick-up and delivery device includes: two mainline tracks including a pair of first guide portions which guide a pair of first guide wheels provided on a vehicle on an outer side of each of the first guide wheels; a pick-up and delivery travel path on which the vehicle is capable of traveling and which is provided between the two mainline tracks and is configured to pick up and deliver the vehicle between the two mainline tracks; a second guide portion which is provided inside the pick-up and delivery travel path and guides a second guide wheel disposed below the vehicle; and a switching unit which is provided on the mainline tracks and is capable of switching a direction of the vehicle between a direction along the mainline tracks and a direction along the pick-up and delivery travel path.

Abstract: A substrate liquid treatment apparatus comprises a chuck (13) that holds and rotates a wafer, a back surface purging nozzle (15) that discharges a purge gas toward the back surface of the wafer, and a periphery purging nozzle 16 that discharges the purge gas onto the back surface of the wafer. The back surface purging nozzle has a slit-like opening part extending from a central side to a peripheral side of the substrate in a plan view. Vertical distance between the slit-like opening part and the substrate held by the substrate holding unit increases as approaching an end of the opening part on the central side of the substrate. The periphery purging nozzle discharges the purge gas, toward a central part of the substrate, toward a region on the back surface of the substrate, which region is located radially outside an end of the slit-like opening part of the back surface purging nozzle and radially inside an peripheral edge of the substrate.

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

Abstract: A vehicle pick-up and delivery device includes: two mainline tracks including a pair of first guide portions which guide a pair of first guide wheels provided on a vehicle on an outer side of each of the first guide wheels; a pick-up and delivery travel path on which the vehicle is capable of traveling and which is provided between the two mainline tracks and is configured to pick up and deliver the vehicle between the two mainline tracks; a second guide portion which is provided inside the pick-up and delivery travel path and guides a second guide wheel disposed below the vehicle; and a switching unit which is provided on the mainline tracks and is capable of switching a direction of the vehicle between a direction along the mainline tracks and a direction along the pick-up and delivery travel path.

Abstract: In a heat treatment method in which a semiconductor wafer is carried into a heat treatment chamber constituted of a heat plate and a cover body covering the heat plate and processed, until the wafer is carried into the heat treatment chamber, an opening and closing operation of the cover body is performed to maintain the accumulated heat temperature of the heat treatment chamber at a prescribed processing temperature.

Abstract: In a heat treatment method in which a semiconductor wafer is carried into a heat treatment chamber constituted of a heat plate and a cover body covering the heat plate and processed, until the wafer is carried into the heat treatment chamber, an opening and closing operation of the cover body is performed to maintain the accumulated heat temperature of the heat treatment chamber at a prescribed processing temperature.

Abstract: A peritoneal dialysis solution comprising at least one cation, a chloride ion contained at a concentration differing from a concentration of total cation so that the concentration of chloride ion will be lower than the concentration of total cation, and organic acids contained so as to maintain electrical neutrality depending on a difference in concentration between the total cation and chloride ion, the concentration of organic acids satisfies a predetermined equation. Also, disclosed is a method for adjusting a peritoneal dialysis solution, comprising providing a difference in concentration between total cation and chloride ion, adding organic acids so as to maintain electrical neutrality, and adjusting dialyzing performance depending on a degree of the difference in concentration and/or kind of organic acid added.

Abstract: Proposed in this application is a device for attenuating vibrations in a drive shaft of a motor vehicle of a type, in which driving force of an engine is transmitted to both left and right drive shafts through a clutch, a transmission mechanism, and differential gears. This vibration attenuating device is constructed with a vibration absorbing device having a resilient member and a weight combined together as an integral whole, and both members are provided at one of the drive shafts having a length longer than the other to the end part thereof where wheel is to be fitted.