Abstract: A photosensitive resin composition according to the present disclosure, contains an acid-modified vinyl group-containing resin (A), a thermosetting resin (B), a photopolymerization initiator (C), and a photopolymerizable compound (D), in which the photopolymerizable compound includes a photopolymerizable compound having a polyoxyalkylene chain and an ethylenically unsaturated group.

Abstract: A first aspect of the present invention is carbon fiber wherein the surface of a monofilament has a center line average roughness Ra of 6.0 nm or more and 13 nm or less, and the monofilament has a long diameter/short diameter ratio of 1.11 or more and 1.245 or less. A second aspect of the present invention is carbon fiber precursor acrylic fiber wherein the surface of a monofilament has a center line average roughness Ra of 18 nm or more and 27 nm or less, and the monofilament has a long diameter/short diameter ratio of 1.11 or more and 1.245 or less. The carbon fiber according to the first aspect is obtained by stabilizing and carbonizing under specific conditions the carbon fiber precursor acrylic fiber according to the second aspect.

Abstract: The pressure-sensitive adhesive layer forming organopolysiloxane composition of this disclosure is hydrosilylation reaction curable, wherein 1 mass % or more of a resin component is (b2) an organopolysiloxane resin having a weight average molecular weight (Mw) as measured in terms of standard polystyrene by GPC using toluene that is less than 4000, and the value obtained by dividing Tg+120(° C.) of the pressure-sensitive adhesive layer obtained by curing by Tg?+120(° C.) of the composition (pressure-sensitive adhesive layer), in which component (b2) is substituted by a resin with Mw 4000 or higher is less than 1.0. When used as a pressure-sensitive adhesive layer and when a specific resin component/polymer component ratio is selected to achieve a pressure-sensitive adhesive strength, the glass transition temperature (Tg) of the pressure-sensitive adhesive layer can be further reduced, resulting in a strong pressure-sensitive adhesive force and a low Tg at the same time.

Abstract: An object of the present invention is to provide a wheel drive device capable of suppressing a temperature increase in an electric motor and a power conversion device and suppressing occurrence of a failure of an electric component. Provided are: an electric motor having a stator 60 and a rotor 40; a stator holder 80 that holds the stator 60; a power conversion device 100 that converts power supplied to the electric motor; and a wheel which accommodates the electric motor, the stator holder 80, and the power conversion device 100 on the inner peripheral side. The stator holder 80 includes a flow path 90 through which a cooling medium flows. The flow path 90 is arranged between the stator 60 and the power conversion device 100.

Abstract: A vehicle control device includes: an actuator drive controller configured to control a drive of an actuator; a main motor drive controller configured to control a drive of a main motor; and a stuck determiner. The stuck determiner determines a stuck of the actuator based on a detection value of a sensor unit that detects a physical quantity changed according to a drive state of the actuator. The main motor drive controller is configured to perform an engaging surface pressure reduction control for reducing an engaging surface pressure between a parking gear and a parking lever by driving the main motor, when the stuck determiner determines that the actuator is stuck in releasing a parking lock of the vehicle.

Abstract: A drive control device includes a rotation speed calculation unit configured to calculate a rotation speed of a motor based on a rotation position detection signal of the motor, an energization stop time period calculation unit configured to calculate an energization stop time period for stopping energization to all phases of coils of the motor based on a target rotation speed and the rotation speed of the motor, and an energization signal generation unit configured to generate an energization signal for controlling energization to the coils of the motor to switch energization to the coils of the motor and to stop energization to all the coils of the motor in the energization stop time period.

Abstract: A stretch detection system of a power transmission mechanism is connectable to a conveyor system including a motor, a rotation mechanism driven by the motor, and the power transmission mechanism driven by rotation of the rotation mechanism. The stretch detection system converts a signal of a current of the motor into a frequency domain signal, and calculates an integral value by performing integration on the frequency domain signal obtained by the frequency domain signal conversion unit, by using, as an integration range, at least one of regions of a sideband wave having a frequency determined using a rotation frequency of the rotation mechanism. A stretch diagnosis unit diagnoses a state of stretch of the power transmission mechanism by using the integral value calculated by the integral value calculation unit. Further, an output unit outputs a diagnosis result of the stretch diagnosis unit.

Abstract: Provided are methods of treating SpA, uses for treating SpA and compositions for treating SpA. The methods involve administering a MIF inhibitor to a subject in need thereof. The MIF inhibitor can be a compound or an anti-MIF antibody.

Abstract: A curing-reactive organopolysiloxane composition is provided. The composition generally forms a pressure-sensitive adhesive layer which is curable by a hydrosilylation reaction, has excellent adhesiveness and handleability, and is capable of maintaining high transparency over an extended period of time without developing problems such as discoloration or coloration, even when subjected to long-term aging at a high temperature and even when exposed to high-energy rays such as UV rays over an extended period of time. The curing-reactive organopolysiloxane composition can be cured via hydrosilylation reaction. A content of platinum-based metal among a solid content is in the range of from 0.1 to 50 ppm. An adhesive force of a cured layer with a thickness of 50 ?m obtained by curing the composition is not less than 0.02N/25 mm. A pressure-sensitive adhesive layer obtained by curing the composition, and an electronic part or a display device using the same, are also provided.

Abstract: A component supply device includes: a picker base on which a component is to be loaded; a supplier that picks up the component loaded on the picker base and supplies the component to a predetermined position; a detector that detects the component loaded on the picker base; and a hardware processor that determines a state of the component loaded on the picker base, on a basis of information detected by the detector, wherein the hardware processor determines whether the component is a component that is pickable or a component that is unpickable by the supplier on a basis of the state of the component, and calculates an operation amount for adjusting the component that is unpickable to a pickable state and adjusts only a state of the component that is unpickable by an adjuster on a basis of the calculated operation amount.

Abstract: There is provided a photosensitive resin composition that contains (A) a photopolymerizable compound having an ethylenically unsaturated group, (X) organic particles, and (B) a photopolymerization initiator, in which the photopolymerizable compound (A) having an ethylenically unsaturated group contains (A1) a photopolymerizable compound having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group. There is provided a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition. There is provided a multilayer printed wiring board and a semiconductor package. There is further provided a method for producing the multilayer printed wiring board.

Abstract: A price calculation device 200 includes a condition information acquisition unit 221 that acquires condition information representing the condition of a user who is receiving a service, a situation information acquisition unit 222 that acquires situation information representing the situation of the user, and a calculation unit 223 that calculates the price of the service on the basis of the condition information acquired by the condition information acquisition unit 221 and the situation information acquired by the situation information acquisition unit 222.

Abstract: There is provided a photosensitive resin composition comprising (A) a photopolymerizable compound having an ethylenically unsaturated group and an acid substituent, (B) a curing agent, (C) a photopolymerization initiator, and (D) a photopolymerizable compound, wherein the photopolymerizable compound (D) is a polyfunctional monomer which has a skeleton (X) derived from a polyhydric alcohol and having three or more bonding groups (a), each bonded to another structure and corresponding to a hydroxy group from which the hydrogen atom has been removed, and which has three or more (meth)acryloyl groups bonded directly or indirectly to the bonding groups (a), and wherein at least one (meth)acryloyl group of the three or more (meth)acryloyl groups is bonded to the bonding group(s) (a) via a linking group. There are also provided a dry film using the photosensitive resin composition, a printed wiring board, and a method for producing the printed wiring board.

Abstract: The present invention is one which prevents the occurrence of cracks in piezo elements and reduces the thermal effects on the control board, and comprises a fluid control valve driven by a piezo actuator, a fluid sensor which measures the pressure or flow rate of the fluid, a control board which controls the fluid control valve based on the measured value measured by the fluid sensor, and a discharge resistor provided on a component different from the control board.

Abstract: A method for producing a silicone-based adhesive is disclosed. The method comprises: (1) applying a silicone composition (I) to one surface of a peelable substrate, and then forming a silicone layer (I) by curing or drying the silicone composition (I); and (2) applying a silicone composition (II) to a surface of the silicone layer (I), and then forming the silicone-based adhesive by curing the silicone composition (II). The silicone composition (I) contains a silicone resin. The silicone composition (II) either does not contain the silicone resin or if contained, its content amount is lower than that in the silicone composition (I). The method is useful for producing a silicone-based adhesive with low peel resistance from a peelable substrate even with a low modulus.

Abstract: A picking device includes: a workpiece holder in which a plurality of workpieces is stacked; a light receiver that receives reflected light from a workpiece stacked in the workpiece holder; a mover that relatively moves the light receiver with respect to the workpiece in such a manner that a distance between the light receiver and the workpiece is adjustable; an arm that picks the workpiece; a first hardware processor that calculates a distance between the light receiver and at least one workpiece among the plurality of workpieces; a second hardware processor that specifies a workpiece as a picking target among the plurality of workpieces or a region where the workpiece exists; and a third hardware processor that adjusts a distance between the light receiver and the workpiece calculated by the first hardware processor by controlling the mover in the region specified by the second hardware processor.

Abstract: The purpose of the present invention is to provide a device monitoring technique having little restriction even on application to an already-existing device or facilitating monitoring even when a device to be monitored is in variable speed operation or under load variation. One of the representative device monitoring devices of the present invention monitors a device system using, as a power source, an AC electric motor driven by an inverter and is provided with a torque current estimation unit and a state estimation unit. The torque current estimation unit acquires information about AC currents of at least two phases and excitation current of the AC electric motor and calculates a torque current estimated value of the AC electric motor on the basis of the AC currents and the excitation current. The state estimation unit estimates the state of the device system from information including at least one of the feature amounts extracted from the torque current estimated value.

Abstract: Provided is a transmission device monitoring system including: a diagnostic frequency estimation unit that extracts a plurality of diagnostic frequency candidate groups from a frequency region separated by a specific frequency or more using at least current information on a motor, a gear ratio of a transmission device, and the number of stages of the transmission device, and estimates a frequency satisfying a specific relationship from frequencies obtained in the plurality of diagnostic frequency candidate groups as a diagnostic frequency; and an abnormality diagnosis unit that diagnoses abnormality of the transmission device using at least the one diagnostic frequency estimated by the diagnostic frequency estimation unit.

Abstract: Provided is a photosensitive resin composition containing: a photopolymerizable compound (A) having an ethylenically unsaturated group; a photopolymerization initiator (B); and an inorganic filler (F), in which the photopolymerizable compound (A) having an ethylenically unsaturated group includes a photopolymerizable compound (A1) having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group, and the inorganic filler (F) includes an inorganic filler surface-treated with a coupling agent without at least one functional group selected from the group consisting of an amino group and a (meth)acryloyl group. The present disclosure also provides a photosensitive resin composition for photo via formation, and a photosensitive resin composition for interlayer insulating layer.

Abstract: Provided is: a curing reactive silicone composition having sufficient toughness and pressure sensitive adhesive strength to temporarily secure various substrate even in an uncured state, having heat meltability and excellent moldability of a sheet or the like, and that can be quickly cured by high energy irradiation to achieve high adhesive strength; a method of manufacturing a sheet thereof a cured product thereof that can achieve high adhesive strength by crimping; and applications thereof. The curing reactive silicone composition comprises: (A) an MQ resin; (B) a chain organopolysiloxane having at least two groups containing an aliphatic unsaturated carbon-carbon bond, and a degree of siloxane polymerization within a range of 80 to 3000; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst activated by a high energy beam. The amount of component (A) is more than 55 mass % and less than 90 mass % of the sum of components (A) to (C).