Abstract: A monitoring device includes: an instruction unit configured to instruct a vehicle to acquire appearance data of a monitoring object designated by a user; a detection unit configured to receive the appearance data from the vehicle and to detect whether a state of the monitoring object has changed based on the appearance data; and a monitoring result notifying unit configured to notify the user of a monitoring result of the monitoring object when the detection unit detects that the state of the monitoring object has changed.

Abstract: The present invention relates to a phosphate adsorbing agent for blood processing comprising a porous formed article comprising an organic polymer resin and an inorganic ion adsorbent and having the most frequent pore size of 0.08 to 0.70 ?m measured with a mercury porosimeter. The present invention also relates to a blood processing system and a blood processing method involving the phosphate adsorbing agent for blood processing.

Abstract: A semiconductor device according to an embodiment includes: an oxide insulating layer; an oxide semiconductor layer; a gate electrode; a gate insulating layer; and a first insulating layer, wherein the semiconductor device is divided into a first to a third regions, a thickness of the gate insulating layer in the first region is 200 nm or more, the gate electrode contacts the first insulating layer in the first region, the oxide semiconductor layer contacts the first insulating layer in the second region, an amount of impurities contained in the oxide semiconductor layer in the second region is greater than an amount of impurities contained in the oxide semiconductor layer in the first region, and an amount of impurities contained in the oxide insulating layer in the third region is greater than an amount of impurities contained in the oxide insulating layer in the second region.

Abstract: A method for manufacturing semiconductor device according to an embodiment includes: forming an oxide semiconductor layer above a substrate; forming a gate insulating layer above the oxide semiconductor layer; forming a metal oxide layer containing aluminum as a main component above the gate insulating layer; performing a heat treatment in a state where the metal oxide layer is formed above the gate insulating layer; removing the metal oxide layer after the heat treatment; and forming a gate electrode above the gate insulating layer.

Abstract: There is provided a surface-treated steel sheet (1) comprising: a tin-plated steel sheet (10) obtained by tin-plating a steel sheet (11); a phosphate compound layer (20) containing tin phosphate formed on the tin-plated steel sheet (10); and an aluminum-oxygen compound layer (30) on the phosphate compound layer (20), a main constituent of the aluminum-oxygen compound layer (30) being an aluminum-oxygen compound; wherein, when the 3d5/2 spectrum of tin in the aluminum-oxygen compound layer (30) is determined using an X-ray photoelectron spectroscopy, the ratio of the integration value of the profile derived from tin oxide to the integration value of the profile derived from tin phosphate (tin oxide/tin phosphate) is 6.9 or more.

Abstract: Provided are a resin composition including a compound represented by Formula (1) and a resin, a film and a filter including the resin composition, a liquid crystal display device and a solid-state imaging element including the filter, and a compound suitable as a light absorbing component of the resin composition and the filter. In Formula (1), Dye represents a colorant structural part obtained by removing n1 hydrogen atoms from a squarylium compound having a specific structure. Q1 is a structural part in which energy levels of a highest occupied molecular orbital and a lowest unoccupied molecular orbital satisfy a specific condition. L1 represents a divalent linking group and n1 represents an integer of 1 to 4.

Abstract: To provide a 4-methyl-1-pentene polymer being excellent in storage stability when dissolved in a solvent and solubility, and being excellent in at least one of heat resistance, and a coating appearance when a coating film is stretched, for example, when such a film is bended or used in a flexible application. A 4-methyl-1-pentene polymer (A) being a copolymer of 4-methyl-1-pentene and at least one selected from linear ?-olefins having 6 to 20 carbon atoms, the 4-methyl-1-pentene polymer (A) satisfying the following requirements (I) and (II): (I) an endotherm end temperature (TmE) in a melting (endothermic) curve measured by DSC is 230° C. or lower; and (II) an exotherm start temperature (TcS) in a crystallization (exothermic) curve measured by DSC is 210° C. or lower.

Abstract: The drive route generation device according to the present disclosure is configured to execute a process of acquiring a designated point, a process of acquiring a designation condition for a drive route to be generated, a process of selecting one or a plurality of specific spots from a plurality of spots based on the position information and the designation condition for the plurality of spots, and a process of generating, as a drive route, a circulation route that comes back to a designated point via one or a plurality of specific spots using the designated point as a departure point.

Abstract: A vehicle according to the present disclosure includes a first riding space and a second riding space, each of which is a riding position on one side and the other side of a right side and a left side with respect to a front-rear direction, respectively, and is configured to: acquire a traveling route; identify a side where a landscape viewed from the vehicle is good from among the right side and the left side with respect to a traveling direction; identify a preferential space in which a degree of preferential treatment of a passenger riding in the first riding space or the second riding space is high; and determine the forward direction and the backward direction when the vehicle travels on the traveling route such that the preferential space is set to the side where the landscape viewed from the vehicle is good.

Abstract: An order reception system according to the present disclosure includes one or more processors. The one or more processors are configured to perform receiving a reservation from a user to provide a dish to a dish providing place, receiving the reservation to provide a dish, calculating a lead time required for providing the dish and an arrival time at which the user arrives at the dish providing place, and instructing the dish providing place to start preparing to provide the dish based on the arrival time and the lead time.

Abstract: According to one embodiment, a semiconductor device includes a first semiconductor element, a first element insulating part, and an insulating sealing member. The first semiconductor element includes a first semiconductor chip and a first chip electrode electrically connected to the first semiconductor chip. The first semiconductor chip has a first surface crossing a first direction, a second surface crossing the first direction and distant from the first surface, and a third surface between the first and second surfaces. The first chip electrode is disposed on the first surface. The first element insulating part includes a first portion and a second portion continuous to the first portion. The insulating sealing member includes a third portion and a fourth portion continuous to the third portion. The first portion is between the first surface and the third portion, and the second portion is between the third surface and the fourth portion.

Abstract: According to one embodiment, a semiconductor module includes a first circuit component, a first connection member, and a first wire. The first circuit component includes a first substrate, a first conductive layer, a first switching device, and a first diode. The first substrate has an insulation property. The first connection member is provided on a first electrode of the first switching device and the fourth electrode of the first diode, and has a conductive property. The first wire connects the first conductive layer and the first connection member.

Abstract: According to one embodiment, a semiconductor device includes a first semiconductor element, a first element insulating part, and an insulating sealing member. The first semiconductor element includes a first semiconductor chip and a first chip electrode electrically connected to the first semiconductor chip. The first semiconductor chip has a first surface crossing a first direction, a second surface crossing the first direction and distant from the first surface, and a third surface between the first and second surfaces. The first chip electrode is disposed on the first surface. The first element insulating part includes a first portion and a second portion continuous to the first portion. The insulating sealing member includes a third portion and a fourth portion continuous to the third portion. The first portion is between the first surface and the third portion, and the second portion is between the third surface and the fourth portion.

Abstract: A semiconductor device includes a first semiconductor chip, a second semiconductor chip, a metal substrate, an insulating substrate, a first bonding member, and a second bonding member. The metal substrate is spaced from the first and the second semiconductor chips in a first direction crossing a direction from the first semiconductor chip to the second semiconductor chip. The insulating substrate is provided between the first semiconductor chip and the metal substrate and between the second semiconductor chip and the metal substrate. The first bonding member is provided between the metal substrate and the insulating substrate. Part of the first bonding member is located between the first semiconductor chip and the metal substrate. The second bonding member is provided between the metal substrate and the insulating substrate. Part of the second bonding member is located between the second semiconductor chip and the metal substrate.

Abstract: According to one embodiment, a semiconductor module includes a first circuit component, a first connection member, and a first wire. The first circuit component includes a first substrate, a first conductive layer, a first switching device, and a first diode. The first substrate has an insulation property. The first connection member is provided on a first electrode of the first switching device and the fourth electrode of the first diode, and has a conductive property. The first wire connects the first conductive layer and the first connection member.

Abstract: A semiconductor module according to an embodiment has first and second wiring portions, first semiconductor devices and second semiconductor devices. The second wiring portion is provided to oppose the first wiring portion. The third wiring portion is provided to oppose the first wiring portion. The first semiconductor devices are provided between the first wiring portion and the second wiring portion. Each of the first semiconductor devices has a first switching element, and an input terminal or an output terminal of the first switching element is electrically connected with the first wiring portion. The second semiconductor devices are provided between the first wiring portion and the third wiring portion. Each of the second semiconductor devices has a second switching element, and an output or input terminal of the second switching element is electrically connected with the first wiring portion in a manner contrary to the first switching element.

Abstract: A data processing device is provided between a cash processing terminal cluster in a local network and an external network outside the local network. The data processing device includes a data acquisition section that acquires, in the local network, serial numbers obtained from banknotes read by a cash processing terminal configuring the cash processing terminal cluster, and results of recognition of the banknotes by the cash processing terminal; a storage controller that associates the serial numbers and the recognition results with each other and stores the serial numbers and the recognition results in a storage section; and a comparison section that, in cases in which the serial numbers and banknote recognition results have been acquired from any cash processing terminal configuring the cash processing terminal cluster, compares the banknote recognition results against the stored recognition results associated with the serial numbers.

Abstract: Provided is an art by which serial numbers read by a cash processing terminal can be easily searched or analyzed, and the time and effort of recording the serial numbers of counterfeit banknotes in the cash processing terminal is reduced. An information processing device (100) set up between a cash processing terminal group in a local network and an external network that is external thereto is provided.

Abstract: According to one embodiment, there is provided a light-emitting device including a light-emitting section, a thermal radiation member, and a heat conduction layer. The light-emitting section includes a mounting substrate section and a light-emitting element section. The mounting substrate section includes a substrate, a first metal layer, and a second metal layer. The substrate includes a first principal plane including a mounting region and a second principal plane. The first metal layer includes mounting patterns provided in the mounting region. The light-emitting element section includes semiconductor light-emitting elements and a wavelength conversion layer. The semiconductor light-emitting elements are connected to the mounting patterns. The luminous existence of the light-emitting element section is equal to or higher than 10 lm/mm2 and equal to or lower than 100 lm/mm2. The thermal radiation member has an area equal to or larger than five times the area of the mounting region.

Abstract: Provided is an art by which serial numbers read by a cash processing terminal can be easily searched or analysed, and the time and effort of recording the serial numbers of counterfeit banknotes in the cash processing terminal is reduced. An information processing device (100) set up between a cash processing terminal group in a local network and an external network that is external thereto is provided.