Patents by Inventor Akihiro Sasaki
Akihiro Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150170454Abstract: A data processing device is provided between a cash processing terminal cluster in a local network and an external network outside the local network. The data processing device includes a data acquisition section that acquires, in the local network, serial numbers obtained from banknotes read by a cash processing terminal configuring the cash processing terminal cluster, and results of recognition of the banknotes by the cash processing terminal; a storage controller that associates the serial numbers and the recognition results with each other and stores the serial numbers and the recognition results in a storage section; and a comparison section that, in cases in which the serial numbers and banknote recognition results have been acquired from any cash processing terminal configuring the cash processing terminal cluster, compares the banknote recognition results against the stored recognition results associated with the serial numbers.Type: ApplicationFiled: June 14, 2013Publication date: June 18, 2015Applicant: Oki Electric Industry Co., Ltd.Inventors: Akihiro Sasaki, Youichi Norota
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Publication number: 20150154473Abstract: There is provided an information processing device disposed between a cash processing terminal group in a local network and an outside network existing outside the local network, the information processing device including: an information acquisition unit that acquires, in the local network, a serial number obtained as a result of a currency bill being read by a cash processing terminal configuring the cash processing terminal group; a storage control unit that stores the serial number in a storage unit; and a determination unit which, in a case in which a serial number obtained as a result of a currency bill being read by any cash processing terminal configuring the cash processing terminal group has been acquired, determines whether or not that serial number matches the serial number stored in the storage unit.Type: ApplicationFiled: May 14, 2013Publication date: June 4, 2015Applicant: Oki Electric Industry Co., Ltd.Inventors: Masaru Shimakata, Akihiro Sasaki
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Publication number: 20150148945Abstract: A data processing device is provided between a cash processing terminal cluster in a local network and an external network outside the local network. The data processing device includes a data acquisition section that acquires, in the local network, serial numbers obtained from banknotes read by a cash processing terminal configuring the cash processing terminal cluster, a storage controller that stores the serial numbers in a storage section, a condition acquisition section that acquires conditions of decommissioned note serial number, and a serial number notification section that acquires a serial number satisfying the conditions from the storage section and provides notification of the serial number to any of cash processing terminal configuring the cash processing terminal cluster or to a cash processing terminal in a local network different to the local network.Type: ApplicationFiled: June 14, 2013Publication date: May 28, 2015Applicant: Oki Electric Industry Co., Ltd.Inventors: Yoshinari Kobayashi, Akihiro Sasaki
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Publication number: 20150144970Abstract: According to an exemplary embodiment, there is provided a light emitting device including a ceramic substrate, first to fourth connectors, a plurality of semiconductor light emitting elements, and a first metal layer. The ceramic substrate is provided with a first main surface including first to fourth sides and first to fourth corner portions, and the first main surface includes a mounting region, and first to fourth connector region provided respectively between the first to fourth corner portion and the mounting region. The plurality of semiconductor light emitting elements is provided on the mounting region. The first to fourth connectors are respectively provided on the first to fourth connector regions. A first metal layer is provided between the plurality of semiconductor light emitting elements and the ceramic substrate, and including first to fourth connector electrode portions electrically connected respectively to the first to fourth connectors.Type: ApplicationFiled: July 18, 2014Publication date: May 28, 2015Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATIONInventors: Nobuhiko Betsuda, Akihiro Sasaki, Hideki Okawa, Kazuo Shimokawa
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Patent number: 8975732Abstract: According to one embodiment, a semiconductor device includes, a chip including a first chip electrode on a first surface on one side, and a second chip electrode on a second surface on the other side, an electrically conductive frame provided on a side periphery of the chip, a rewiring configured to electrically connect the second chip electrode and the electrically conductive frame on the other side of the chip, and an insulation side portion provided between the electrically conductive frame and the side periphery of the chip.Type: GrantFiled: March 13, 2013Date of Patent: March 10, 2015Assignee: Kabushiki Kaisha ToshibaInventors: Akira Tojo, Kazuhito Higuchi, Tomohiro Iguchi, Masako Fukumitsu, Daisuke Hiratsuka, Akihiro Sasaki, Masayuki Uchida
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Publication number: 20150060930Abstract: According to an embodiment, a light emitting device includes a heat radiation plate, a semiconductor light emitting element, a mounting substrate section including a ceramic substrate, and first and second metal layers, and a bonding layer. The ceramic substrate is provided between the heat radiation plate and the semiconductor light emitting element. The mounting substrate section contacts the ceramic substrate between the heat radiation plate and the ceramic substrate, and includes a first surface on a side of the heat radiation plate and a side surface intersecting a plane perpendicular to a direction from the heat radiation plate to the semiconductor light emitting element. The bonding layer is provided between the heat radiation plate and the second metal layer, and bonds the heat radiation plate and the second metal layer so as to cover the first surface and to contact a part of the side surface.Type: ApplicationFiled: February 28, 2014Publication date: March 5, 2015Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATIONInventors: Akihiro Sasaki, Katsuhisa Matsumoto, Nobuhiko Betsuda
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Publication number: 20150060894Abstract: According to an embodiment, a light emitting device including a substrate, a plurality of semiconductor light emitting elements and a wavelength conversion layer is provided. The semiconductor light emitting elements are provided on the substrate. The wavelength conversion layer covers the semiconductor light emitting elements and converts a wavelength of light emitted from the semiconductor light emitting elements. A first distance between an upper surface of the wavelength conversion layer in a first region between two adjacent semiconductor light emitting elements in the semiconductor light emitting elements and the substrate is shorter than a second distance between the upper surface of the wavelength conversion layer and the substrate in a second region on the two adjacent semiconductor light emitting elements.Type: ApplicationFiled: February 27, 2014Publication date: March 5, 2015Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATIONInventors: Hirotaka Tanaka, Kiyoshi Nishimura, Kazuo Shimokawa, Akihiro Sasaki, Akiyoshi Habutsu
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Publication number: 20140332340Abstract: A banknote processing device is provided that is capable of securing a reject route that does not overlap with a route for conveying banknotes from a banknote storage section to a banknote identification section. The banknote processing device includes: a dispensing port that dispenses banknotes; a banknote identification section that identifies whether or not banknotes are normal; and a storage-only storage section that stores banknotes that the banknote identification section has identified as abnormal. Out of a first route on the dispensing port side between the banknote identification section and the storage-only storage section and a second route on the opposite side to the first route, one, or two or more, banknote storage sections capable of storing and feeding out banknotes are provided only on the second route side.Type: ApplicationFiled: November 1, 2012Publication date: November 13, 2014Applicant: OKI ELECTRIC INDUSTRY CO., LTD.Inventors: Akira Adachi, Akihiro Sasaki
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Publication number: 20140291110Abstract: The banknote processing device includes plural dispensing ports that dispense banknotes; a banknote classification section that classifies banknotes; and a controller that selects a conveyance destination of banknotes classified by the banknote classification section from the plural dispensing ports, and effects control to convey the banknotes to a selected dispensing port.Type: ApplicationFiled: November 1, 2012Publication date: October 2, 2014Applicant: OKI ELECTRIC INDUSTRY CO., LTD.Inventors: Akira Adachi, Akihiro Sasaki
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Publication number: 20140153238Abstract: According to one embodiment, there is provided a light-emitting device including a light-emitting section, a thermal radiation member, and a heat conduction layer. The light-emitting section includes a mounting substrate section and a light-emitting element section. The mounting substrate section includes a substrate, a first metal layer, and a second metal layer. The substrate includes a first principal plane including a mounting region and a second principal plane. The first metal layer includes mounting patterns provided in the mounting region. The light-emitting element section includes semiconductor light-emitting elements and a wavelength conversion layer. The semiconductor light-emitting elements are connected to the mounting patterns. The luminous exitance of the light-emitting element section is equal to or higher than 101 m/mm2 and equal to or lower than 1001 m/mm2. The thermal radiation member has an area equal to or larger than five times the area of the mounting region.Type: ApplicationFiled: August 30, 2013Publication date: June 5, 2014Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATIONInventors: Kiyoshi Nishimura, Kazuo Shimokawa, Nobuhiko Betsuda, Akihiro Sasaki, Miho Watanabe, Hirotaka Tanaka, Takuya Honma, Katsuhisa Matsumoto, Hideki Okawa
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Publication number: 20140138732Abstract: A light-emitting module that can prevent a short circuit of an LED element due to mounting is to be provided. According to one embodiment, a light-emitting module includes an LED element, a DPC substrate, and solder joining sections. The LED element is a face-down type. The DPC substrate includes a mounting surface on which the LED element is mounted. First and second wiring patterns including first and second land section are formed on the mounting surface. The LED element and the first and second land sections of the DPC substrate are joined by the first and second solder joining sections. At least the second land section is formed further on the inner side than the side surfaces of the LED element.Type: ApplicationFiled: February 28, 2013Publication date: May 22, 2014Applicant: Toshiba Lighting & Technology CorporationInventors: Akihiro SASAKI, Nobuhiko Betsuda
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Publication number: 20140063822Abstract: According to one embodiment, a wiring board includes a base assuming a flat plate shape, a wiring pattern provided in a position on one surface of the base and apart from a peripheral edge of the base, a first metal layer provided on the opposite side of the base side of the wiring pattern, and a second metal layer configured to cover the first metal layer and a sidewall of the wiring pattern.Type: ApplicationFiled: December 10, 2012Publication date: March 6, 2014Applicant: Toshiba Lighting & Technology CorporationInventors: Akihiro SASAKI, Kazuo SHIMOKAWA, Takuya HONMA, Nobuhiko BETSUDA, Kiyoshi NISHIMURA
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Publication number: 20130241040Abstract: According to one embodiment, a semiconductor device includes, a chip including a first chip electrode on a first surface on one side, and a second chip electrode on a second surface on the other side, an electrically conductive frame provided on a side periphery of the chip, a rewiring configured to electrically connect the second chip electrode and the electrically conductive frame on the other side of the chip, and an insulation side portion provided between the electrically conductive frame and the side periphery of the chip.Type: ApplicationFiled: March 13, 2013Publication date: September 19, 2013Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Akira Tojo, Kazuhito Higuchi, Tomohiro Iguchi, Masako Fukumitsu, Daisuke Hiratsuka, Akihiro Sasaki, Masayuki Uchida
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Publication number: 20080104438Abstract: A microcomputer is put into a sleep mode immediately when tasks become ready for the sleep mode so as to eliminate wasted power. Multiple application tasks are executed. Each application task provides notification regarding entry into sleep-ready state. When any application task provides notification, a status management section program sets a flag indicating that the application task goes to the sleep-ready state. The status management section checks flags of all the application tasks to determine whether all the application tasks go to the sleep-ready state, whereupon the microcomputer is put into the sleep mode.Type: ApplicationFiled: October 19, 2007Publication date: May 1, 2008Applicant: DENSO CORPORATIONInventors: Kouichirou Yokoyama, Shuichi Nitta, Shinichi Senoo, Masaya Hirota, Akihiro Sasaki
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Publication number: 20080075760Abstract: The moisturized nonwoven fabric of the invention contains 1% or more of a water-soluble component to a weight of a pre-moisturized nonwoven fabric and an increase ratio of an equilibrium moisture regain (equilibrium water content) is 0.5% or more as compared with an equilibrium moisture regain of the moisturized nonwoven fabric after the water-soluble component is removed. Therefore, this moisturized nonwoven fabric is excellent in use feel such as skin touch and wiping property and functionalities such as water absorption property and water retention property. Further, this moisturized nonwoven fabric is excellent in functionalities such as moisturizing liquid transferring capability and skin moisturizing effect.Type: ApplicationFiled: February 27, 2007Publication date: March 27, 2008Applicants: KOCHI Prefecture, Kawano Paper Co., Ltd., Sanshoshigyo Co., Ltd.Inventors: Shinji Suzuki, Noriyasu Ike, Kiyotsugu Sawamura, Hiromu Matsumoto, Eri Tamura, Jun Morisawa, Hiroto Takiguchi, Masaaki Ariyoshi, Kenji Taniguchi, Hideaki Yoshida, Hitoshi Tsuruta, Masaaki Sasaoka, Akihiro Sasaki
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Patent number: 7346006Abstract: A transmission system is provided which includes a transmitter working to transmit data on a frame basis and a receiver. If two frames having the same data are inputted in sequence to the receiver, the receiver decides that it is unnecessary to decode a following one of the frames and stops receiving or decoding it. This results in decreases in operation load and power consumption of the receiver.Type: GrantFiled: February 13, 2003Date of Patent: March 18, 2008Assignee: DENSO CORPORATIONInventors: Gorou Inoue, Akihiro Sasaki, Kentaro Asai
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Publication number: 20050251305Abstract: The objective is to provide an electronic control apparatus capable of overwriting data in a nonvolatile memory, even during control operation. An ECU (10) includes a CPU (100), a flash EEPROM 101, and a calibration RAM (102). When calibration is performed, data in a calibration area of the flash EEPROM (101) is stored into the calibration RAM (102). A memory area of the calibration RAM (102) is overlapped over the calibration area to perform calibration. The data in the calibration area is written into the calibration RAM (102). When the calibration is completed, a super-user mode is entered in which the data stored in the calibration RAM (102) is written into the flash EEPROM (101) by use of a control register (113).Type: ApplicationFiled: May 28, 2003Publication date: November 10, 2005Inventors: Junkei Sato, Akihiro Sasaki
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Patent number: 6959181Abstract: Data formulated according to a user's request signal is transmitted from a transmitter device to a receiver device under a wireless or a wired system. The transmitter device includes a transmission controller that formulates the data to be transmitted and memorizes the request signal as a backup signal. If the data transmission is not completed due to a power source trouble such as a voltage drop, the data to be transmitted is automatically formulated again based on the backup signal and sent out to the receiver. If the data transmission is successful, the backup signal is eliminated from a memory. Thus, the data requested by the user is transmitted without fail even if the transmitter becomes temporarily inoperative.Type: GrantFiled: September 30, 2002Date of Patent: October 25, 2005Assignee: Denso CorporationInventors: Terutaka Maruyama, Akihiro Sasaki, Takashi Harada
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Patent number: 6773866Abstract: A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 35 &mgr;m film made by imidating ring closure on a silicon substrate has a light transmittance at a wavelength of 365 nm of at least 1% and a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.Type: GrantFiled: December 12, 2001Date of Patent: August 10, 2004Assignees: Hitachi Chemical DuPont Microsystems L.L.C., Hitachi Chemical DuPont Microsystems Ltd.Inventors: Akihiro Sasaki, Noriyoshi Arai, Makoto Kaji, Toshiki Hagiwara, Brian C. Auman
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Publication number: 20030156551Abstract: A transmission system is provided which includes a transmitter working to transmit data on a frame basis and a receiver. If two frames having the same data are inputted in sequence to the receiver, the receiver decides that it is unnecessary to decode a following one of the frames and stops receiving or decoding it. This results in decreases in operation load and power consumption of the receiver.Type: ApplicationFiled: February 13, 2003Publication date: August 21, 2003Inventors: Gorou Inoue, Akihiro Sasaki, Kentaro Asai