Abstract: A vehicular bumper mounting structure including a support for mounting a hollow, transversely extending bumper beam of high tension steel to a side member of the vehicle body. The support includes a support body and an arm member adapted to be mounted to an upper side or a lower side of the support in an overlapping relation thereto. At least one of the support body and the arm member has at an end thereof an extension extending beyond a rear side portion of the bumper beam. Consequently, if a large collision energy is exerted to the bumper beam, which is hollow and hence light in weight, the collision energy is transmitted to at least one of the support body and arm member before the entire bumper beam having a box cross section is largely deformed, whereby the collision energy transmitted to the support can be transmitted to the vehicle body quickly.

Abstract: An adhesive tape for electronic parts, comprising (a) a heat resistant base film, and (b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising(i) a resol type phenol resin, and(ii) an acrylonitrile/butadiene copolymer,in a proportion of from 100 to 500 parts by weight of said resol phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer, said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol.

Abstract: An adhesive tape for electronic parts, comprising (a) a heat resistant base film, and (b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising(i) a resol type phenol resin, and(ii) an acrylonitrile/butadiene copolymer, in a proportion of from 100 to 500 parts by weight of said resol type phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer, said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol.

Abstract: Adhesive tapes suitable for use in wire-bonded semiconductor devices are disclosed. They are each composed of a heat-resistant substrate formed of at least one layer, a copper foil provided on one side of the substrate, and a semi-cured adhesive layer and a protective film provided successively on the other side of the substrate. Semiconductor devices fabricated using such adhesive tapes are also disclosed.