Abstract: To obtain a physical-quantity detection device that reduces a variation in mounting position in a main passage. A physical-quantity detection device 20 of the present invention is inserted into and disposed in a main passage 22, and includes a flange 211 fixed to a seat surface 103 of the main passage 22, and the flange 211 includes a press-fitting portion 281 for positioning with respect to a seat surface 103 side.

Abstract: To obtain a physical-quantity detection device that reduces a variation in mounting position in a main passage. A physical-quantity detection device 20 of the present invention is inserted into and disposed in a main passage 22, and includes a flange 211 fixed to a seat surface 103 of the main passage 22, and the flange 211 includes a press-fitting portion 281 for positioning with respect to a seat surface 103 side.

Abstract: To provide a high-reliable transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed, the combined sensor is configured to be thicker than the substrate and the chip pad, a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material, and the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad.

Abstract: To provide a resin-sealed sensor device in which a sensor element that detects an inertial force such as acceleration or angular velocity is mounted on a pad, and the entire thereof is molded by resin, the resin-sealed sensor device with a high reliability by suppressing or resolving a sensor output error by reducing or resolving inclination or deformation of the sensor element or the pad at the time of resin injection, in a resin-sealed sensor device 100 including: a circuit unit 10 that includes a sensor element 1 for detection of a physical quantity, a semiconductor chip 2, a pad 3 of which shape in a plan view has any shape among a rectangle, a circle and an ellipse, and supported leads 5A to 5D and an outer conductor lead 4 to be connected to the pad 3; and a molded resin body 20 that seals the circuit unit 10, each of the supported leads 5A to 5D is arranged in each divided regions to be formed by dividing the shape into four virtual regions when an intersection point O between two axes L1 and L2, perpe

Abstract: To provide a high-reliable transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed, the combined sensor is configured to be thicker than the substrate and the chip pad, a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material, and the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad.

Abstract: A cable connection structure includes a multi-core coaxial cable connected to a board. The multi-core coaxial cable includes a plurality of parallel-arranged coaxial cables each including a center conductor and an inner insulator, an outer conductor and an outer insulator sequentially formed on an outer periphery of the center conductor. The board includes a signal electrode connected to the center conductor and a ground electrode connected to the outer conductor. The cable connection structure further includes a positioning member lying between the signal electrode and the ground electrode for positioning the center conductor while the inner insulator is attached to the positioning member.

Abstract: A flat cable includes a plurality of conductors arranged in parallel and exposed at both end portions in a longitudinal direction thereof, an insulation film covering the plurality of conductors except the exposed both end portions, and a reinforcing member that covers the plurality of conductors along a width direction of the plurality of conductors, is provided on a surface of the insulation film in a part of a region including an edge of the insulation film, and includes a metal plate and an insulative covering layer for covering the metal plate.

Abstract: A flat cable includes a plurality of conductors arranged in parallel, an insulating member covering the plurality of conductors, a first reinforcing member on a surface of an end portion of the insulating member, and a second reinforcing member on an opposite side of the first reinforcing member across the conductor and the insulating member. The first reinforcing member includes a reinforcing metal plate including an end portion bent toward the second reinforcing member, a covering member covering at least a portion of a periphery of the reinforcing metal plate, and an adhesive interposed between the reinforcing metal plate and the covering member and between the covering member and the insulating member to bond the reinforcing metal plate to the covering member and the covering member to the insulating member. The second reinforcing member has a rigidity greater than that of the covering member of the first reinforcing member.

Abstract: A flat cable includes a plurality of conductors arranged in parallel, an insulating member covering the plurality of conductors, a first reinforcing member on a surface of an end portion of the insulating member, and a second reinforcing member on an opposite side of the first reinforcing member across the conductor and the insulating member. The first reinforcing member includes a reinforcing metal plate including an end portion bent toward the second reinforcing member, a covering member covering at least a portion of a periphery of the reinforcing metal plate, and an adhesive interposed between the reinforcing metal plate and the covering member and between the covering member and the insulating member to bond the reinforcing metal plate to the covering member and the covering member to the insulating member. The second reinforcing member has a rigidity greater than that of the covering member of the first reinforcing member.

Abstract: A flat cable includes a plurality of conductors arranged in parallel and exposed at both end portions in a longitudinal direction thereof, an insulation film covering the plurality of conductors except the exposed both end portions, and a reinforcing member that covers the plurality of conductors along a width direction of the plurality of conductors, is provided on a surface of the insulation film in a part of a region including an edge of the insulation film, and includes a metal plate and an insulative covering layer for covering the metal plate.

Abstract: A cable connection structure includes a multi-core coaxial cable connected to a board. The multi-core coaxial cable includes a plurality of parallel-arranged coaxial cables each including a center conductor and an inner insulator, an outer conductor and an outer insulator sequentially formed on an outer periphery of the center conductor. The board includes a signal electrode connected to the center conductor and a ground electrode connected to the outer conductor. The cable connection structure further includes a positioning member lying between the signal electrode and the ground electrode for positioning the center conductor while the inner insulator is attached to the positioning member.

Abstract: In a production of a semiconductor device, after a step in which a thermosetting resin is thermally cured to seal a semiconductor chip with the resin and before a step in which a characteristic of the semiconductor chip is inspected, the thermosetting resin is baked at a temperature higher than the resin sealing temperature in said resin sealing step.

Abstract: A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for electrically connection with the interconnections, external terminals placed on the lands, and a stress-relaxation layer intervening between the lands and the semiconductor chip. The semiconductor chips are placed on a mounting board via the external terminals. The distance between farthest ones of external terminal positioned at an outermost end portions of said second semiconductor chip is smaller than that of the first semiconductor chip.

Abstract: A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for electrically connection with the interconnections, external terminals placed on the lands, and a stress-relaxation layer intervening between the lands and the semiconductor chip. The semiconductor chips are placed on a mounting board via the external terminals. The distance between farthest ones of external terminal positioned at an outermost end portions of said second semiconductor chip is smaller than that of the first semiconductor chip.

Abstract: A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for electrically connection with the interconnections, external terminals placed on the lands, and a stress-relaxation layer intervening between the lands and the semiconductor chip. The semiconductor chips are placed on a mounting board via the external terminals. The stress-relaxation layer of a first semiconductor chip is thicker than the stress-relaxation layer of a second semiconductor chip having a distance from a center thereof to an external terminal positioned at an outermost end portion thereof smaller than that of the first semiconductor chip.

Abstract: In a production of a semiconductor device, after a step in which a thermosetting resin is thermally cured to seal a semiconductor chip with the resin and before a step in which a characteristic of the semiconductor chip is inspected, the thermosetting resin is baked at a temperature higher than the resin sealing temperature in said resin sealing step.

Abstract: In a small semiconductor device having external terminals on a semiconductor element and a semiconductor module mounted with the small semiconductor device, disconnection of the external terminals is prevented when a temperature change occurs under the conditions that the semiconductor device is mounted on a printed circuit board. To achieve this a projection is formed on a land which is an external terminal bonding area of the semiconductor device, and a protruded portion of the projection is bonded to the external terminal. An intervening portion of a protective film made of resin material is formed between the lands and semiconductor element.

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for electrically connection with the interconnections, external terminals placed on the lands, and a stress-relaxation layer intervening between the lands and the semiconductor chip. The semiconductor chips are placed on a mounting board via the external terminals. The stress-relaxation layer of a first semiconductor chip is thicker than the stress-relaxation layer of a second semiconductor chip having a distance from a center thereof to an external terminal positioned at an outermost end portion thereof smaller than that of the first semiconductor chip.

Abstract: A semiconductor device which can improve the connection reliability of solder bumps and productivity in manufacturing. Insulating tape having wiring patterns on its surface is bonded to a lead frame. Semiconductor elements are loaded and circuit formed surfaces and sides of the semiconductor elements are sealed with sealing resin. After arrangements of individual semiconductor devices are formed, the lead frame is separated into individual metal plates to form individual semiconductor devices. Such simultaneous production of a plurality of semiconductor devices enhances productivity, and improves flatness of the insulating tape, whereby the connection reliability of solder bumps is improved.