Abstract: Process tools and methods are disclosed that involve interferometric and other measurements of movements and positions relative to a process position, such as movements and positions of a stage relative to a lithographic optical system. An exemplary apparatus includes a stage that places a workpiece relative to the tool, and that is movable in at least one direction relative to the tool. At least one first interferometer system is situated relative to the stage to determine stage position in a movement direction relative to the process position. A movement-measuring device determines displacement of the tool from the process position. Using data from the interferometer system and movement-measuring device a processor determines a position of the stage relative to the tool. The processor also corrects the determined position for displacement of the tool.

Abstract: An exposure apparatus includes an optical element via which a patterned beam is projected onto a substrate through exposure liquid filled in a space between the optical element and the substrate. The apparatus also includes a member having a flow passage in which exposure liquid flows, the flow passage being in fluidic communication with the space. The apparatus also includes a cleaning system which cleans the member.

Abstract: An exposure apparatus includes an optical element via which a patterned beam is projected onto a substrate through exposure liquid filled in a space between the optical element and the substrate. The apparatus also includes a member having a surface and movable to a position at which the surface of the member faces the optical element. The apparatus also includes a cleaning system which cleans the surface of the member.

Abstract: A liquid immersion exposure apparatus includes an optical element via which a patterned beam is projected onto a substrate in an exposure operation, a liquid supply system having a supply port from which exposure liquid is supplied, and a member which has a surface and which is different from the substrate. In the exposure operation, the liquid supply system supplies the exposure liquid from the supply port to a space between the optical element and the substrate. In a cleaning operation, the member is moved to a position at which the surface of the member faces the optical element, and the liquid supply system supplies the exposure liquid from the supply port to a space between the optical element and the surface of the member.

Abstract: There is provided an exposure apparatus capable of forming a desirable device pattern by removing unnecessary liquid when performing exposure by projecting a pattern onto the substrate via a projection optical system and the liquid. The exposure device projects an image of the pattern onto the substrate P via the projection optical system and the liquid so as to expose the substrate P. The exposure device includes a liquid removing mechanism 40 which removes the liquid remaining on a part 7 arranged in the vicinity of the image plane of the projection optical system.

Abstract: There is provided an exposure apparatus capable of forming a desirable device pattern by removing unnecessary liquid when performing exposure by projecting a pattern onto the substrate via a projection optical system and the liquid. The exposure device projects an image of the pattern onto the substrate P via the projection optical system and the liquid so as to expose the substrate P. The exposure device includes a liquid removing mechanism 40 which removes the liquid remaining on a part 7 arranged in the vicinity of the image plane of the projection optical system.

Abstract: There is provided an exposure apparatus capable of forming a desirable device pattern by removing unnecessary liquid when performing exposure by projecting a pattern onto the substrate via a projection optical system and the liquid. The exposure device projects an image of the pattern onto the substrate P via the projection optical system and the liquid so as to expose the substrate P. The exposure device includes a liquid removing mechanism 40 which removes the liquid remaining on a part 7 arranged in the vicinity of the image plane of the projection optical system.

Abstract: There is provided an exposure apparatus capable of forming a desirable device pattern by removing unnecessary liquid when performing exposure by projecting a pattern onto the substrate via a projection optical system and the liquid. The exposure device projects an image of the pattern onto the substrate P via the projection optical system and the liquid so as to expose the substrate P. The exposure device includes a liquid removing mechanism 40 which removes the liquid remaining on a part 7 arranged in the vicinity of the image plane of the projection optical system.

Abstract: A lens cleaning module is provided for a lithography system having an exposure apparatus including an objective lens. The system includes a scanning stage for supporting a wafer beneath the objective lens. A cleaning module coupling with the lithography system is provided for cleaning the objective lens in a non-manual cleaning process.

Abstract: There is provided an exposure apparatus capable of forming a desirable device pattern by removing unnecessary liquid when performing exposure by projecting a pattern onto the substrate via a projection optical system and the liquid. The exposure device projects an image of the pattern onto the substrate P via the projection optical system and the liquid so as to expose the substrate P. The exposure device includes a liquid removing mechanism 40 which removes the liquid remaining on a part 7 arranged in the vicinity of the image plane of the projection optical system.

Abstract: There is provided an exposure apparatus capable of forming a desirable device pattern by removing unnecessary liquid when performing exposure by projecting a pattern onto the substrate via a projection optical system and the liquid. The exposure device projects an image of the pattern onto the substrate P via the projection optical system and the liquid so as to expose the substrate P. The exposure device includes a liquid removing mechanism 40 which removes the liquid remaining on a part 7 arranged in the vicinity of the image plane of the projection optical system.

Abstract: A mask stage RS1 and a substrate stage WS1 are synchronously moved, and a mask stage RS2 and a substrate stage RS2 are synchronously moved, in a state in which a mask on the mask stage RS1 and a mask on the mask stage RS2 are irradiated with illumination light beams from illumination optical systems IOP1, IOP2 respectively. The reaction force on a base board due to the movement of the stages can be canceled to suppress the vibration of an exposure apparatus by moving the mask stage RS1 and the mask stage RS2 in mutually opposite directions. The throughput can be improved by performing alignment operation on substrate stages WS3, WS4 concurrently with the exposure operation.

Abstract: A method for performing optical adjustments of an exposure apparatus is based on an exposure apparatus having a light source for generating illumination light for exposure, and illumination optics for irradiating a mask with the illumination light generated from the exposure light source so as to imprint a mask pattern on a substrate base.

Abstract: A scanning exposure apparatus and method uses an optical member to change an intensity distribution of exposure light in an illumination region.

Abstract: A specified gas is supplied into a chamber where masks or reticles to be exposed are arranged. Part of the air-gas mixture within the chamber is exhausted into the atmosphere. After that, when the gas within the chamber reaches a specified concentration, part of the air-gas mixture within the chamber is circulated and an appropriate concentration of gas is supplied to the chamber.

Abstract: A mask stage RS1 and a substrate stage WS1 are synchronously moved, and a mask stage RS2 and a substrate stage RS2 are synchronously moved, in a state in which a mask on the mask stage RS1 and a mask on the mask stage RS2 are irradiated with illumination light beams from illumination optical systems IOP1, IOP2 respectively. The reaction force on a base board due to the movement of the stages can be canceled to suppress the vibration of an exposure apparatus by moving the mask stage RS1 and the mask stage RS2 in mutually opposite directions. The throughput can be improved by performing alignment operation on substrate stages WS3, WS4 concurrently with the exposure operation.

Abstract: A specified gas is supplied into a chamber where masks or reticles to be exposed are arranged. Part of the air-gas mixture within the chamber is exhausted into the atmosphere. After that, when the gas within the chamber reaches a specified concentration, part of the air-gas mixture within the chamber is circulated and an appropriate concentration of gas is supplied to the chamber.

Abstract: A light exposure apparatus used for manufacturing semiconductors, liquid crystal display elements or the like is provided with an illuminating optical system for illuminating a mask formed with a pattern with pulse light from a light source, a mask stage for loading the mask, a substrate stage for loading the photo-sensitive substrate, and a driving system for synchronously scanning the mask stage and a substrate stage.

Abstract: A method for performing optical adjustments of an exposure apparatus is based on an exposure apparatus having a light source for generating illumination light for exposure, and illumination optics for irradiating a mask with the illumination light generated from the exposure light source so as to imprint a mask pattern on a substrate base.

Abstract: In a lithographic process for fabrication of integrated circuit chips, a projection exposure machine is used to print a mask pattern onto each of a plurality of shot areas defined on a substrate, where an alignment method for establishing alignment between each shot area on the substrate and the mask pattern is performed. The alignment method comprises the step of forming on the substrate a regular pattern which comprises a plurality of pattern elements regularly distributed over the plurality of shot areas, and the step of performing an alignment operation based on the position of the regular pattern so as to establish alignment between each of the plurality of shot areas and the mask pattern. An exposure apparatus may be used to form the regular pattern on the substrate.