Abstract: An alignment system includes an element bearing a plurality of patterns on the surface thereof, the plurality of patterns being arranged in a predetermined direction, a stage for holding the element, scanning means for scanning the plurality of patterns of the element held by the stage in the predetermined direction and making position signals indicative of the positions of the plurality of patterns in the predetermined direction on the element, and operation means for operating and putting out a signal indicative of a position which is in a predetermined relation with the positions of the plurality of patterns in the predetermined direction, on the basis of the position signals.

Abstract: A projection optical apparatus adapted for use in lithographic apparatus for semiconductor device manufacturing purposes and the like. A monitoring light beam of a given polarization is introduced into an imaging optical system of the projection optical apparatus and a polarized component of the monitoring light beam transmitted through the imaging optical system is subjected to photoelectric conversion. A variation of an optical characteristic of the imaging optical system is detected in accordance with the photoelectrically converted output signal.

Abstract: In an exposure apparatus for manufacturing semiconductor devices, a pattern on a photomask is aligned with a plurality of patterns formed on a wafer in a manner that detects and corrects misalignment, including, inter alia, rotational errors, not only between a photomask and a wafer, but also between a photomask and individual chips formed on the wafer, so that pattern matching is attained with very high accuracy. Apparatus for achieving this result employs different arrangements of alignment marks together with optical systems and positional adjustment devices.

Abstract: A projection exposure apparatus used to project a minute pattern formed on a photomask or reticle onto a semiconductive wafer has a stabilized image-forming performance. The apparatus comprises a projection lens system including a plurality number of lens elements spaced apart from each other, means for supplying a gas flow to at least one of spaces through which the gas passes, means for isolating the space(s) supplied with gas from atmosphere and means for changing the refractive index of the isolated space(s).

Abstract: An apparatus for forming the optical image of a photo-pattern placed on a first plane on a second plane comprises projection means having a projection optical system disposed between the first plane and the second plane to form the optical image, focus detecting means including means for detecting the position of the second plane relative to the projection optical system, the in-focus position corresponding to the position of the second plane when the imaging plane of the projection optical system and the second plane are coincident with each other being preset, the focus detecting means putting out a detection signal when the in-focus position is detected by the detecting means, fluctuation detecting means for determining the amount of fluctuation of the imaging plane of the projection optical system caused correspondingly to a variation in the refractive index of the atmosphere, and means responsive to the fluctuation detecting means to control the focus detecting means so that the in-focus position is re-s

Abstract: An apparatus for optically measuring the very small gap between a reference plane and a substrate parallel to the reference plane. A beam of energy converging on the reference plane is reflected by the substrate and a spot of reflected beam is formed on a detecting plane at a different position. An array of detecting elements for detecting the size of the spot on the detecting plane is adjusted in position in such a manner that the center of the spot coincides with the center of any one of the detecting elements, thereby preventing any error of the in-focus detecting position due to the deviation between the center of the spot and the center of the detecting element.

Abstract: A position alignment apparatus aligns a photosensitive substrate and a mask (projection image) at high speed and with high precision. The apparatus has a projection optical system for projecting a pattern image on a mask or reticle onto a photosensitive substrate, a detector for detecting a two-dimensional misalignment of a projected pattern image and a wafer, and means for moving the wafer along orthogonal x- and y-axis directions and for rotating the wafer along a rotational direction within a plane defined by the x- and y-axis directions so as to eliminate the misalignment, wherein the detector has first detecting means with an optical system for detecting at least a misalignment of the wafer along the x-axis direction through the projection lens, and second detecting means with an optical system separate from the projection lens and for detecting at least a misalignment of the wafer along a rotational direction.

Abstract: An alignment apparatus for aligning a semiconductor wafer with an optical mask containing a circuit pattern to be exposed onto the wafer in the fabrication of semiconductor devices by a proximity exposure apparatus.

Abstract: An exposure apparatus for optically transferring a pattern of a circuit such as an integrated circuit on a semiconductor wafer. The positioning control of stepping movement of a movable stage holding the wafer thereon is effected in such a manner that even if a rotational displacement is present in the optical image of a mask pattern with respect to the moving coordinate axes of the stage, the rotational displacement is substantially cancelled in a printed pattern.

Abstract: An inspecting apparatus for precisely detecting foreign substances or scars present on a translucent planar article such as a photomask at a high speed with a laser beam entering from face of the article, comprises first photoelectric means for receiving the scattered light generated in a space on a face of the photomask, second photoelectric means for receiving the scattered light generated in a space on the other face of the photomask, comparator means for comparing the photoelectrically converted signals from the first and second photoelectric means to identify one of predetermined plural magnitude relationships to which the magnitudes of the signals belong, and inspecting means for generating, in response to the detection output signal of the comparator means, a detection signal allowing to identify the approximate difference in the shape of the foreign substance, for example either a tall foreign substance or a short one.

Abstract: A method for inspecting the presence of foreign particles on a mask comprising the steps of forming alignment marks on a wafer onto which the pattern is trially replicated, aligning projected images by means of the alignment marks to form overlapped images of the pattern of a mask to be inspected and the pattern of another mask in which the light and dark areas are inverted on a photosensitive material on the wafer, and inspecting the exposure status of the photosensitive material on the wafer after development to identify defects such as foreign particles attached to the mask to be inspected.

Abstract: An apparatus for detecting foreign matter present on a planar substrate comprises apparatus for scanning the surface of the substrate with an oblique incident light beam, apparatus for photo-electrically detecting the scattered light generator in the trajectory of the light beam scanning on the substrate, and apparatus for eliminating stray light unnecessary for the foreign matter detection.

Abstract: An apparatus for detecting the presence of a foreign substance adhering to a planar substrate comprises irradiating means capable of emitting a light beam incident on one surface of the substrate obliquely relative to the surface, means for displacing the irradiating means and the substrate relative to each other so that the position of incidence of the light beam onto the substrate is scanned on said one surface, metering means capable of receiving a plurality of irregular reflected light beams of the light beam which have been irregularly reflected on said surface toward different directions and producing a plurality of electrical outputs corresponding to the intensity of light of the plurality of irregular reflected light beams, and means for deciding the presence of the foreign substance on the basis of the plurality of electrical outputs.

Abstract: An exposure apparatus for production of ICs of the type that includes a stage on which is placed a semiconductor wafer to be exposed by illumination light projecting means, and means for two-dimensionally moving the stage within a plane intersecting the illumination light at substantially right angles. The improvement comprises illumination detection means provided with a photo reception surface, and means for mounting the illumination detection means on the stage in such a manner that the photo reception surface and the surface of the semiconductor wafer on the stage to be exposed are at substantially equal height relative to the stage.

Abstract: An alignment device for registering an object to a predetermined position with high precision and for calculating inclination of the object with respect to its predetermined position, which is constructed with a moving device for mounting thereon the object and moving the same two-dimensionally, a coordinate measuring device having orthogonally intersecting first and second measuring axes to measure the coordinates of the moving device in both directions of orthogonally intersecting first and second measuring axes of the object, an observing device having a first observing optical system with the center of observation (the first observation center) thereof being substantially on the first measuring axis and a second observing optical system with the center of observation (the second observation center) thereof being substantially on the second measuring axis, and a setting device to set, on the coordinate measuring device, the coordinate values of the first and second observation centers with the substantial

Abstract: An alignment apparatus for bringing two objects, each having at least one reference mark, into a predetermined positional relation is disclosed in which the two objects are scanned by a beam of light emitted from a coherent light source, the light coming from the reference marks is received and converted into electrical signals by means of which the amount of deviation between the two objects is detected and the two objects are adjusted to the predetermined positional relation. Repetitively swept light from the light source is divided into two parts which scan the reference marks at different times and along different directions.

Abstract: An apparatus for photoelectrically detecting the position of each of the edges of a line having the opposite edges thereof formed substantially parallel to each other on an a substrate thereby to measure the width of the line, comprises a source of coherent light, means for condensing the coherent light into a tiny light spot which illuminates the line, means for imparting to the tiny light spot a minute oscillation having an amplitude less than the width of the line, means for providing relative movement of the tiny light spot and the line so that diffracted light may be created at each of the edges of the line, a first photoelectric conversion element for receiving chiefly the diffracted light created at one of the edges of the line, a second photoelectric conversion element for receiving chiefly the diffracted light created at the other edge of the line, and a circuit for producing position signals corresponding to the edges of the line from the output signals from the first and second photoelectric conver

Abstract: An automatic alignment apparatus comprises reference marks formed at the right-hand and left-hand sides of each of a semiconductor wafer and a mask, each of the reference marks comprising two mark elements extending in two different directions. These reference marks are formed such that when the mask and wafer are overlapped with each other, diffracted lights in different directions are produced from adjacent ones of the mark elements on the mask and wafer. A first and a second source of coherent light are provided for illuminating the right-hand and the left-hand marks, respectively, on the mask and wafer with a coherent spot light. First and second scanning means are provided for scanning the right-hand and the left-hand marks, respectively, on the mask and wafer by the spot light so that the diffracted lights are produced from the mark elements of the wafer and mask in one stroke of scanning.