Patents by Inventor Akinobu Inoue
Akinobu Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955410Abstract: An electronic component includes: a first lead frame; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second lead frame; and an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member. A first oxide film is provided on a surface of the first lead frame. A second oxide film is provided on a surface of the second lead frame. The first lead frame and the second lead frame are electrically connected to each other by the connection member.Type: GrantFiled: July 27, 2022Date of Patent: April 9, 2024Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yukinori Hatori, Yasushi Araki, Akinobu Inoue, Tsukasa Nakanishi
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Publication number: 20220367326Abstract: An electronic component includes: a first lead frame; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second lead frame; and an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member. A first oxide film is provided on a surface of the first lead frame. A second oxide film is provided on a surface of the second lead frame. The first lead frame and the second lead frame are electrically connected to each other by the connection member.Type: ApplicationFiled: July 27, 2022Publication date: November 17, 2022Inventors: Yukinori Hatori, Yasushi Araki, Akinobu Inoue, Tsukasa Nakanishi
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Patent number: 11444006Abstract: An electronic component includes: a first lead frame; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second lead frame; and an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member. A first oxide film is provided on a surface of the first lead frame. A second oxide film is provided on a surface of the second lead frame. The first lead frame and the second lead frame are electrically connected to each other by the connection member.Type: GrantFiled: June 26, 2020Date of Patent: September 13, 2022Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yukinori Hatori, Yasushi Araki, Akinobu Inoue, Tsukasa Nakanishi
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Publication number: 20200411419Abstract: An electronic component includes: a first lead frame; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second lead frame; and an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member. A first oxide film is provided on a surface of the first lead frame. A second oxide film is provided on a surface of the second lead frame. The first lead frame and the second lead frame are electrically connected to each other by the connection member.Type: ApplicationFiled: June 26, 2020Publication date: December 31, 2020Inventors: Yukinori Hatori, Yasushi Araki, Akinobu Inoue, Tsukasa Nakanishi
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Patent number: 9087781Abstract: A semiconductor device includes a wiring substrate, a semiconductor chip whose connection terminal is connected to the wiring substrate, an underfill resin formed from a clearance between the wiring substrate and the semiconductor chip to a periphery area of the semiconductor chip, wherein the underfill resin in the periphery area is formed at a same height as an upper surface of the semiconductor chip, an auxiliary member fixed on the semiconductor chip by an adhesive layer, and including a protruding portion which protrudes to an outside from the semiconductor chip, and the protruding portion arranged at least on the underfill resin via the adhesive layer, and a sealing resin sealing the underfill resin and at least side faces of the auxiliary member, wherein respective coefficients of thermal expansion of the auxiliary member and the adhesive layer are larger than a coefficient of thermal expansion of the semiconductor chip.Type: GrantFiled: May 13, 2013Date of Patent: July 21, 2015Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Akinobu Inoue, Haruo Sorimachi
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Publication number: 20130307163Abstract: A semiconductor device includes a wiring substrate, a semiconductor chip whose connection terminal is connected to the wiring substrate, an underfill resin formed from a clearance between the wiring substrate and the semiconductor chip to a periphery area of the semiconductor chip, wherein the underfill resin in the periphery area is formed at a same height as an upper surface of the semiconductor chip, an auxiliary member fixed on the semiconductor chip by an adhesive layer, and including a protruding portion which protrudes to an outside from the semiconductor chip, and the protruding portion arranged at least on the underfill resin via the adhesive layer, and a sealing resin sealing the underfill resin and at least side faces of the auxiliary member, wherein respective coefficients of thermal expansion of the auxiliary member and the adhesive layer are larger than a coefficient of thermal expansion of the semiconductor chip.Type: ApplicationFiled: May 13, 2013Publication date: November 21, 2013Applicant: Shinko Electric Industries Co., Ltd.Inventors: Akinobu INOUE, Haruo SORIMACHI
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Patent number: 8355262Abstract: An electronic component is provided between at least two wiring boards. An electrode of the electronic component is electrically connected to at least one of the wiring boards. Also, the wiring boards and are electrically connected to each other. Additionally, the gap between the wiring boards and is sealed with a resin. The electronic component built-in substrate is featured in that a bonding pad formed on one of the wiring boards and is electrically connected to an electrode of the electronic component by a bonding wire, and that at least a connection portion between the electrode of the electronic component and the bonding wire is coated with a protection material.Type: GrantFiled: December 17, 2007Date of Patent: January 15, 2013Assignee: Shinko Electric Industries Co., Ltd.Inventors: Akinobu Inoue, Haruo Sorimachi
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Patent number: 7911042Abstract: A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.Type: GrantFiled: December 7, 2007Date of Patent: March 22, 2011Assignee: Shinko Electric Industries Co., Ltd.Inventors: Yuya Yoshino, Akinobu Inoue, Atsunori Kajiki, Sadakazu Akaike, Norio Yamanishi, Takashi Tsubota
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Patent number: 7872359Abstract: An electronic component contained substrate in which an electronic component is mounted between a pair of wiring substrates, wherein the wiring substrates are connected electrically via solder balls, an opening portion opened larger than a planar shape of the electronic component is formed in the other wiring substrate, which faces to one wiring substrate on which the electronic component is mounted, in a position that opposes the electronic component, and a space between a pair of wiring substrates is sealed with a sealing resin.Type: GrantFiled: December 21, 2007Date of Patent: January 18, 2011Assignee: Shinko Electric Industries Co., Ltd.Inventor: Akinobu Inoue
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Patent number: 7772687Abstract: In an electronic component contained substrate in which electronic components are mounted between a pair of wiring substrates in a plural-stage stacked fashion, one wiring substrate and other wiring substrate are connected electrically mutually via solder balls, a first electronic component is mounted on one wiring substrate and then a second electronic component is mounted on the first electronic component, an opening portion for containing the second electronic component therein is provided in the other wiring substrate, the second electronic component is contained and mounted in the opening portion and is connected electrically to the other wiring substrate by a wire bonding, and a space between the pair of wiring substrates is sealed with a sealing resin.Type: GrantFiled: December 21, 2007Date of Patent: August 10, 2010Assignee: Shinko Electric Industries Co., Ltd.Inventor: Akinobu Inoue
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Patent number: 7514772Abstract: A resin layer in which adhesion to a conductive film is higher than that of a sealing resin to the conductive film is disposed on the sealing resin in which it is difficult to form the conductive film, and wiring patterns electrically connected to electronic components are disposed on the resin layer.Type: GrantFiled: April 25, 2006Date of Patent: April 7, 2009Assignee: Shinko Electric Industries Co., Ltd.Inventors: Tomoki Kobayashi, Toshiji Shimada, Akinobu Inoue, Atsunori Kajiki, Hiroyuki Kato, Hiroshi Shimizu
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Publication number: 20080174978Abstract: It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two wiring boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least one of the wiring boards. Also, the wiring boards 10 and 20 are electrically connected to each other. Additionally, the gap between the wiring boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a bonding pad 12 formed on one of the wiring boards 10 and 20 is electrically connected to an electrode 32 of the electronic component 30 by a bonding wire 60, and that at least a connection portion between the electrode 32 of the electronic component 30 and the bonding wire 60 is coated with a protection material 70.Type: ApplicationFiled: December 17, 2007Publication date: July 24, 2008Inventors: Akinobu Inoue, Haruo Sorimachi
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Publication number: 20080174977Abstract: An electronic component contained substrate in which an electronic component is mounted between a pair of wiring substrates, wherein the wiring substrates are connected electrically via solder balls, an opening portion opened larger than a planar shape of the electronic component is formed in the other wiring substrate, which faces to one wiring substrate on which the electronic component is mounted, in a position that opposes the electronic component, and a space between a pair of wiring substrates is sealed with a sealing resin.Type: ApplicationFiled: December 21, 2007Publication date: July 24, 2008Inventor: Akinobu INOUE
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Publication number: 20080165513Abstract: It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least one of the board 10. Also, the boards 10 and 20 are electrically connected to each other. Additionally, the gap between the boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a solder ball 40 for electrically connecting the boards 10 and 20 to each other is provided on a surface of the electronic component 30, which faces the other board 20.Type: ApplicationFiled: December 17, 2007Publication date: July 10, 2008Inventors: Akinobu Inoue, Sadakazu Akaike, Atsunori Kajiki, Yuya Yoshino, Takashi Tsubota, Norio Yamanishi
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Publication number: 20080157329Abstract: In an electronic component contained substrate in which electronic components are mounted between a pair of wiring substrates in a plural-stage stacked fashion, one wiring substrate and other wiring substrate are connected electrically mutually via solder balls, a first electronic component is mounted on one wiring substrate and then a second electronic component is mounted on the first electronic component, an opening portion for containing the second electronic component therein is provided in the other wiring substrate, the second electronic component is contained and mounted in the opening portion and is connected electrically to the other wiring substrate by a wire bonding, and a space between the pair of wiring substrates is sealed with a sealing resin.Type: ApplicationFiled: December 21, 2007Publication date: July 3, 2008Inventor: Akinobu INOUE
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Publication number: 20080157296Abstract: A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.Type: ApplicationFiled: December 7, 2007Publication date: July 3, 2008Inventors: Yuya Yoshino, Akinobu Inoue, Atsunori Kajiki, Sadakazu Akaike, Norio Yamanishi, Takashi Tsubota
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Patent number: 7261596Abstract: A semiconductor device is disclosed that comprises a board, a ground terminal disposed on the board, a connection terminal disposed on the board, a semiconductor chip mounted on the board, and a shield member electrically connected to the ground terminal. The semiconductor chip, the ground terminal, and the connection terminal are disposed on one side of the board, and the shield member is disposed directly on and covers the other side of the board.Type: GrantFiled: December 27, 2005Date of Patent: August 28, 2007Assignee: Shinko Electric Industries Co., Ltd.Inventors: Sadakazu Akaike, Akinobu Inoue, Atsunori Kajiki, Hiroyuki Takatsu, Takashi Tsubota, Norio Yamanishi
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Publication number: 20060244131Abstract: A resin layer in which adhesion to a conductive film is higher than that of a sealing resin to the conductive film is disposed on the sealing resin in which it is difficult to form the conductive film, and wiring patterns electrically connected to electronic components are disposed on the resin layer.Type: ApplicationFiled: April 25, 2006Publication date: November 2, 2006Applicant: Shinko Electric Industries Co., Ltd.Inventors: Tomoki Kobayashi, Toshiji Shimada, Akinobu Inoue, Atsunori Kajiki, Hiroyuki Kato, Hiroshi Shimizu
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Publication number: 20060148317Abstract: A semiconductor device is disclosed that comprises a board, a ground terminal disposed on the board, a connection terminal disposed on the board, a semiconductor chip mounted on the board, and a shield member electrically connected to the ground terminal. The semiconductor chip, the ground terminal, and the connection terminal are disposed on one side of the board, and the shield member is disposed directly on and covers the other side of the board.Type: ApplicationFiled: December 27, 2005Publication date: July 6, 2006Inventors: Sadakazu Akaike, Akinobu Inoue, Atsunori Kajiki, Hiroyuki Takatsu, Takashi Tsubota, Norio Yamanishi
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Publication number: 20060125077Abstract: A semiconductor device is provided that includes a semiconductor chip, a substrate on which the semiconductor chip is mounted, a mounting terminal that is arranged on a first side of the substrate, and a testing terminal that is arranged on a second side of the substrate which second side is opposite the first side of the substrate.Type: ApplicationFiled: December 1, 2005Publication date: June 15, 2006Inventors: Sadakazu Akaike, Akinobu Inoue, Atsunori Kajiki, Hiroyuki Takatsu, Takashi Tsubota, Norio Yamanishi