Abstract: A semiconductor device includes a semiconductor chip, wirings, a substrate electrically connected to the semiconductor chip via the wirings and a plurality of discrete parts provided on a part of the substrate. The part is located closer to the center of the substrate than a wiring disposing area where the wirings are disposed.

Abstract: A semiconductor device is disclosed that includes a substrate, electronic components that are arranged at an electronic components mounting area of the substrate, a ground terminal that is arranged within the electronic components mounting area, transfer molded resin that covers the electronic components while exposing the ground terminal, a shield member that covers the electronic components and is connected to the ground terminal, and conductive adhesive that realizes electrical connection between the ground terminal and the shield member.

Abstract: A method of manufacturing a semiconductor package includes the steps of: forming, on one side of polyimide film (insulating substrate), a first metal wiring layer (first conductive pattern) having a first pad; forming, on the other side of the polyimide film, a fourth metal wiring layer (second conductive pattern) having a second pad; forming, on the polyimide film, a first solder resist layer having an opening of a size sufficient to expose all side surfaces of the first pad; electrically connecting a semiconductor element to the first pad through a first solder bump; filling insulating adhesive into a space between the polyimide film and the semiconductor element; and bonding a second solder bump with the second pad by heating the second solder bump.

Abstract: In an I/O card that can be inserted into a slot of an electronic device and supplied with electricity therefrom, a first connector can engage a connector provided in the slot of the electronic device. A second connector can engage an external connector of an interconnection cable used to connect the I/O card to an external device. A circuit notifies the electronic device that the I/O card has been loaded to the slot thereof when the external connector is connected to the second connector of the I/o card inserted into the slot. The I/O card receives a supply of electricity from the electronic device, the supply being started after the electronic device is notified by the circuit.