Abstract: This curable resin film forms a first protective film on a surface having bumps of a semiconductor wafer by being attached to the surface and being cured, in which a cured material of the curable resin film has a Young's modulus of equal to or greater than 0.02 MPa and a peak value of a load measured by a probe tack test at 80° C. is equal to or less than 500 g. A first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

Abstract: A semiconductor processing sheet, the sheet comprising a base material and a pressure sensitive adhesive layer laminated on at least one surface of the base material, the pressure sensitive adhesive layer being formed of a pressure sensitive adhesive composition, the pressure sensitive adhesive composition containing a polymer having a salt and an energy ray curable group and an energy ray curable pressure sensitive adhesive component (excluding the above polymer). The semiconductor processing sheet can suppress contamination of an adherent at the time of peeling after energy ray irradiation while exhibiting a sufficient antistatic property.

Abstract: This curable resin film is attached to a surface having bumps of a semiconductor wafer and is cured so as to form a first protective film on the surface, and when the curable resin film is cured by being heated at 160° C. for one hour, a yellow index (YI1) after curing is equal to or lower than 45, or when the curable resin film is cured by being irradiated with ultraviolet rays under conditions of illuminance of 230 mW/cm2, and light intensity of 510 mJ/cm2, a yellow index (YI2) after curing is equal to or lower than 45. The first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

Abstract: The present invention relates to a first protective film-forming sheet formed by stacking a first pressure-sensitive adhesive layer on a first base material and stacking a curable resin layer on the first pressure-sensitive adhesive layer, in which the curable resin layer is a layer to form a first protective film on a bump-provided surface of a semiconductor wafer by being attached to the surface and cured, a sum of a thickness of the curable resin layer and a thickness of a first pressure-sensitive adhesive layer is 110 ?m or more, and the thickness of the curable resin layer is 20 ?m to 100 ?m.

Abstract: A curable resin film of the present invention forms a first protective film (1a) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 ?m, an average diameter of 60 to 500 ?m, and an average pitch of 100 to 800 ?m, heating the attached curable resin film at 100° C. to 200° C. for 0.

Abstract: A sheet having an adhesive resin layer attached thereto includes a base and an adhesive resin layer laminated on the base. The rate of shrinkage of the base in each of an MD direction and a CD direction after the heating of the sheet at 70° C. for 1 minute is ?0.5 to 0.5% and the bending resistance of the base is 80 mm or more.

Abstract: A probe holder (38) that has: a housing part (40) that houses one part of a probe head (34) of an ultrasonic probe; and a belt (42) that, along with the housing part, binds the probe head from the outside. As a result of the belt (42) being fastened and binding the probe head (34), it becomes difficult for the probe head (34) to come out of the probe holder (38), and the probe head (34) is securely held.

Abstract: An ultrasonic diagnostic device (10) has a probe holder (38) that is mounted on a side surface of a device main body (12). The probe holder (38) holds a probe head (34) of an ultrasonic probe. The probe holder (38) can rotate around an axis line that extends in the left-right direction and can be stopped in a desired position. The orientation, with respect to the device main body (12), of the probe head that is held by the probe holder (38) can be altered.

Abstract: Provided is a curable composition which is free of organotin compounds to be environmentally friendly and whose cured product shows high elongation and high elastic recovery to be suitable particularly as a sealant. The present invention relates to a curable composition containing a reactive silyl group-containing organic polymer (A) which has a highly active reactive silyl group at a molecular chain end, and a compound (B) having 2 to 10 ethyloxy groups in its molecule but having no amino group in its molecule, the compound (B) being a C1-C20 saturated hydrocarbon having one alkoxysilyl group, a C1-C20 hydrocarbon having two or more alkoxysilyl groups, or a C1-C20 polycarboxylic acid ester.

Abstract: Provided that a process for manufacturing an elastic roller having a mandrel and a coating film. The process comprise a first step of forming a coating film on an outer peripheral surface of a first mandrel, and a second step of forming a coating film on an outer peripheral surface of a second mandrel. The process further comprises a cleaning step between the steps. The cleaning step comprising: making a cleaning member arranged coaxially with the central axis of a circular coating head, in a downstream side in a moving direction of the first mandrel with respect to the circular coating head, making the cleaning member relatively approach the circular coating head; bringing a surface to be cleaned into contact with the cleaning member; rotating the cleaning member while the surface comes in contact with the cleaning member; and inserting the cleaning member into the center hole.

Abstract: A solar-thermal conversion member includes a ?-FeSi2 phase material. The solar-thermal conversion member exhibits a high absorptance for visible light at wavelengths of several hundred nm and a low absorptance for infrared light at wavelengths of several thousand nm and, as a consequence, efficiently absorbs visible light at wavelengths of several hundred nm and converts the same into heat and exhibits little thermal radiation due to thermal emission at temperatures of several hundred ° C. The solar-thermal conversion member may therefore efficiently absorb sunlight, provide heat, and prevent thermal radiation due to thermal emission.

Abstract: A semiconductor processing sheet, the sheet comprising a base material and a pressure sensitive adhesive layer laminated on at least one surface of the base material, the pressure sensitive adhesive layer being formed of a pressure sensitive adhesive composition, the pressure sensitive adhesive composition containing a polymer having a salt and an energy ray curable group and an energy ray curable pressure sensitive adhesive component (excluding the above polymer). The semiconductor processing sheet can suppress contamination of an adherent at the time of peeling after energy ray irradiation while exhibiting a sufficient antistatic property.

Abstract: Provided that a process for manufacturing an elastic roller having a mandrel and a coating film. The process comprise a first step of forming a coating film on an outer peripheral surface of a first mandrel, and a second step of forming a coating film on an outer peripheral surface of a second mandrel. The process further comprises a cleaning step between the steps. The cleaning step comprising: making a cleaning member arranged coaxially with the central axis of a circular coating head, in a downstream side in a moving direction of the first mandrel with respect to the circular coating head, making the cleaning member relatively approach the circular coating head; bringing a surface to be cleaned into contact with the cleaning member; rotating the cleaning member while the surface comes in contact with the cleaning member; and inserting the cleaning member into the center hole.

Abstract: An input device includes a substrate having a first main surface and a second main surface located opposite to the first main surface; a protective member having an opposed surface opposite to the first main surface; a bonding member configured to bond the first main surface and the opposed surface to each other; a first coloring member disposed between the first main surface and the opposed surface, the first coloring member being in contact with the bonding member; and a second coloring member disposed on the second main surface and having a color different from a color of the first coloring member.

Abstract: The purpose of the present invention is to provide: a polishing pad which has improved dressing properties, while maintaining the hardness; or a polishing pad which does not easily make a scratch on the surface of an object to be polished, while having improved dressing properties. A polishing pad of the present invention is characterized by having a polishing layer that is formed of a polyurethane resin foam or an unfoamed polyurethane resin, and is also characterized in that the polyurethane resin foam or the unfoamed polyurethane resin contains, as starting material components, (A) an isocyanate component, (B) a polyol component and (C) an aromatic compound that has one hydroxyl group and/or an aromatic compound that has one amino group.

Abstract: A sheet having an adhesive resin layer attached thereto includes a base and an adhesive resin layer laminated on the base. The rate of shrinkage of the base in each of an MD direction and a CD direction after the heating of the sheet at 70° C. for 1 minute is ?0.5 to 0.5% and the bending resistance of the base is 80 mm or more.

Abstract: A polishing pad having a polishing layer comprising a thermoset polyurethane foam, wherein about the thermoset polyurethane foam, the Asker C hardness value thereof is 82 or less as a 60-second value, the hardness value being a value after the foam is immersed in water for 24 hours, and further the value of the tensile storage modulus E? (30° C.) thereof at a frequency of 1.6 Hz satisfies the following expression (1): Y<5X?150??(1) wherein Y represents the tensile storage modulus E? (MPa), and X represents the Asker C hardness value (60-second value) after the foam is immersed in water for 24 hours.