Abstract: A method of manufacturing a semiconductor device having a through electrode, includes forming through holes 36 in a substrate 31, forming a first metal layer 39 from one surface side of the substrate and pasting a protection film 40 on one surface of the substrate, forming through electrodes by filling the through holes with a second metal by means of an electroplating of the second metal 42 applied from other surface of the substrate while using the first metal layer as a power feeding layer, removing the protection film 40, and removing the first metal layer 39 located in areas other than peripheral portions of the through electrodes.

Abstract: A light transmissive cover for a device comprising: a cover member of light transmissive material; and a junction member joined to the cover member, the junction member being a member used to be joined to the body of the device and having a light interrupting film on the inner surface thereof. A device provided with a light transmissive cover, the device being provided with a cover member of light transmissive material joined to the body of device via a junction member so as to cover at least a part of the device, and having a light interrupting film on the inner surface of the junction member is also disclosed. In addition, methods for manufacturing them disclosed.

Abstract: A method of manufacturing a substrate with through electrodes of the present invention, includes the steps of forming a metal post over a temporal substrate in a state that the metal post is peelable from the temporal substrate, placing a normal substrate in which a through hole is provided in a position corresponding to the metal post over the temporal substrate, whereby inserting the metal post on the temporal substrate into the through hole in the normal substrate, and obtaining a through electrode that is formed of the metal post passing through the normal substrate by peeling the temporal substrate from the metal post.

Abstract: In an electrical characteristic measuring probe of the present invention constructed by assembling a plurality of probe parts, each comprising a base portion, a plurality of terminal portions extended outward from one end of the base portion, wiring patterns extended from a plurality of terminal portions onto the base portion respectively, and contact portions connected to the wiring patterns respectively, a plurality of thin plate-like probe parts are aligned such that respective thin-plate surfaces are placed in parallel with each other and the contact portions are directed in the same direction, and a plurality of probe parts and spacers are fixed by fixing means in a state that the spacer is arranged between a plurality of probe parts respectively.

Abstract: A light transmissive cover for a device comprising: a cover member of light transmissive material; and a junction member joined to the cover member, the junction member being a member used to be joined to the body of the device and having a light interrupting film on the inner surface thereof. A device provided with a light transmissive cover, the device being provided with a cover member of light transmissive material joined to the body of device via a junction member so as to cover at least a part of the device, and having a light interrupting film on the inner surface of the junction member is also disclosed. In addition, methods for manufacturing them disclosed.