Patents by Inventor Akinori Tanaka

Akinori Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11479780
    Abstract: Epigenomic states of genome DNA are altered at multiple sites to rapidly change traits by providing a fusion protein including a first region that defines a polypeptide capable of binding sequence-specifically to multiple sites on genome DNA and a second region that defines a polypeptide capable of regulating an epigenomic state.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: October 25, 2022
    Assignee: KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
    Inventors: Hidenori Tanaka, Akinori Ikeuchi, Risa Onoda, Hiroki Sugimoto, Nobuhiko Muramoto
  • Patent number: 11476112
    Abstract: Described herein is a technique capable of acquiring, monitoring and recording the progress of the reaction between a substrate and a reactive gas contained in a process gas in a process chamber during the processing of the substrate. According to the technique, there is provided a substrate processing apparatus including: a process chamber accommodating a substrate; a process gas supply system configured to supply a process gas into the process chamber via a process gas supply pipe; an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; a first gas concentration sensor configured to detect a first concentration of a reactive gas contained in the process gas in the process gas supply pipe; and a second gas concentration sensor configured to detect a second concentration of the reactive gas contained in an exhaust gas in the exhaust pipe.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: October 18, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Akinori Tanaka, Hideto Tateno, Sadayoshi Horii
  • Patent number: 11464182
    Abstract: A method of inducing genetic recombination, including: allowing a protein having DNA double-stranded cleavage activity to act in cells of a eukaryotic organism which is a polyploidy inherently possessed by a eukaryotic organism. In eukaryotic organisms, various genetic recombination generates new genome set composition. This is done to obtain a population of eukaryotic organisms that hold the modified genomic set.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: October 11, 2022
    Assignees: KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Nobuhiko Muramoto, Hidenori Tanaka, Hiroki Sugimoto, Norihiro Mitsukawa, Akinori Ikeuchi, Risa Nakamura, Ritsuko Yogo, Satoshi Katahira, Chikara Ohto, Satoshi Kondo
  • Publication number: 20220298627
    Abstract: There is provided a technique capable of reducing a corrosion of a furnace opening shutter. According to one aspect thereof, a substrate processing apparatus includes: a process vessel provided with an opening and a first sealing surface around the opening; and a furnace opening shutter provided with a second sealing surface facing the first sealing surface, and capable of closing the opening. The furnace opening shutter includes: a protective cover provided corresponding to an inner surface of the furnace opening shutter, facing the process vessel and greater than the opening; and a lid provided corresponding to an outer surface of the furnace opening shutter and supporting the protective cover. The second sealing surface is configured by an outer peripheral portion of the protective cover and the lid, and a purge gas is supplied to a gap between the first sealing surface and the second sealing surface.
    Type: Application
    Filed: February 28, 2022
    Publication date: September 22, 2022
    Applicant: Kokusai Electric Corporation
    Inventors: Tatsuya NISHINO, Akinori TANAKA, Akira HORII, Tomoshi TANIYAMA
  • Publication number: 20220264767
    Abstract: An apparatus includes a conduit configured to circulate magnetic fluid, and a magnetic field generator that applies a magnetic field to the magnetic fluid. The conduit includes at least four areas of a first conduit area in which the magnetic fluid receives heat from a heating unit, a second conduit area from the first conduit area to a cooling unit, a third conduit area in which the magnetic fluid is cooled by the cooling unit, and a fourth conduit area from the cooling unit to the heating unit. When the apparatus is used, a volume of the magnetic fluid in one of the first to fourth conduit areas, in which a flow direction of the magnetic fluid coincides with a gravity direction, is larger than that of another conduit area, in which the flow direction of the magnetic fluid does not coincide with the gravity direction.
    Type: Application
    Filed: February 7, 2022
    Publication date: August 18, 2022
    Inventors: Genki Tanaka, Akira Watanabe, Akinori Inagaki
  • Publication number: 20220251335
    Abstract: Described herein is a resin composition containing an inorganic filler, a thermosetting resin, and a thermosetting catalyst. The inorganic filler contains an aggregated inorganic filler; the thermosetting resin contains an epoxy resin; and the thermosetting catalyst contains two or more kinds of thermosetting catalysts having a melting point of 100° C. or higher. Also described are a resin cured product formed of the resin composition, a composite molded product including the resin cured product and a metal, and a semiconductor device including the composite molded product.
    Type: Application
    Filed: April 26, 2022
    Publication date: August 11, 2022
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akinori KIMURA, Toshiyuki TANAKA, Thi Kim Phuong DAO, Tomoki KATOU
  • Publication number: 20220098722
    Abstract: Described herein is a technique capable of suppressing the deposition of the residue and also possible to improve the vaporization efficiency. According to one aspect of the technique, there is provided a vaporizing system including: a vaporization chamber provided with a first end and a second end; a first fluid supplier connected to the vaporization chamber at the second end and configured to supply toward the first end a mixed fluid containing a first carrier gas and a liquid source mixed with each other; and a second fluid supplier connected to the vaporization chamber at the first end and configured to supply a second carrier gas such that the second carrier gas flows along an inner wall of the vaporization chamber when being supplied through the first end.
    Type: Application
    Filed: September 16, 2021
    Publication date: March 31, 2022
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Akinori TANAKA, Yuji SAIKI
  • Publication number: 20220090258
    Abstract: Some embodiments of the present disclosure provide a technique capable of improving a film thickness uniformity on a surface of a substrate and between substrates. According to one or more embodiments, there is provided a technique that includes: a vaporizer configured to generate a source gas by vaporizing a liquid source; a tank in which the source gas ejected from the vaporizer is stored; a flow controller provided at a pipe connecting the vaporizer with the tank; a first valve provided at the pipe; a second valve provided downstream of the tank; a process chamber downstream of the second valve and to which the source gas is supplied; and a controller configured to be capable of controlling the first valve and the second valve to alternately and repeatedly perform accumulation of the source gas from the vaporizer into the tank and release of the source gas from the tank to the process chamber.
    Type: Application
    Filed: September 20, 2021
    Publication date: March 24, 2022
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yuji SAIKI, Tomoshi TANIYAMA, Akinori TANAKA
  • Publication number: 20210365054
    Abstract: A substrate liquid processing apparatus includes: at least one liquid pipe through which a processing liquid flows; a discharge nozzle configured to discharge the processing liquid supplied via the at least one liquid pipe; a valve mechanism configured to regulate a flow of the processing liquid in the at least one liquid pipe; and a liquid detection sensor configured to detect presence or absence of the processing liquid in the at least one liquid pipe, wherein in a state in which the valve mechanism is operating so that the processing liquid in the at least one liquid pipe is located at an upstream of a first pipe measurement site of the at least one liquid pipe, the liquid detection sensor detects the presence or absence of the processing liquid at the first pipe measurement site located at a first measurement point.
    Type: Application
    Filed: May 14, 2021
    Publication date: November 25, 2021
    Inventors: Mikio NAKASHIMA, Akinori TANAKA, Nobuhiro OGATA, Isamu MIYAMOTO
  • Publication number: 20210260612
    Abstract: A controller is configured to control a liquid supply to change a landing position of a liquid on a surface of a substrate continuously by discharging the liquid toward the surface of the substrate from a first liquid discharge nozzle while moving the first liquid discharge nozzle. The controller is also configured to derive discharge position deviation information of the liquid supply by comparing first temperature information based on a spot temperature measured by a temperature measurement device when the first liquid discharge nozzle is moved along a first nozzle path and second temperature information based on the spot temperature measured by the temperature measurement device when the first liquid discharge nozzle is moved along a second nozzle path which is different from the first nozzle path.
    Type: Application
    Filed: February 19, 2021
    Publication date: August 26, 2021
    Inventors: Terufumi Wakiyama, Yuichi Douki, Akinori Tanaka, Minoru Tashiro, Reo Kitayama, Shu Yamamoto
  • Patent number: 11094568
    Abstract: A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a processing solution to the substrate, a flow rate measuring part configured to measure a flow rate of the processing solution supplied to the nozzle, a flow path opening/closing part configured to open and close a supply flow path of the processing solution to the nozzle, and a controller configured to output a close signal causing the flow path opening/closing part to perform a closing operation that closes the supply flow path. The controller is configured to detect an operation abnormality of the flow path opening/closing part based on an accumulated amount of the flow rate measured by the flow rate measuring part after outputting the close signal.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: August 17, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kenji Nakamizo, Satoshi Morita, Akinori Tanaka, Hiroshi Komiya, Mikio Nakashima, Kousuke Fukuda, Youichi Masaki, Ryoji Ando, Ikuo Sunaka
  • Publication number: 20210181033
    Abstract: According to one aspect of the technique, there is provided a substrate temperature sensor configured to measure a temperature of a substrate, wherein the substrate temperature sensor is provided in a protective pipe passing through a notch provided at least in a bottom plate of a substrate retainer inserted into a process chamber in a state where the substrate is mounted on the substrate retainer.
    Type: Application
    Filed: February 25, 2021
    Publication date: June 17, 2021
    Inventors: Tokunobu AKAO, Hitoshi MURATA, Akinori TANAKA, Masaaki UENO
  • Publication number: 20210172825
    Abstract: According to one aspect of the technique, there is provided a method of manufacturing a semiconductor device, including checking a leak from a process furnace before a substrate is processed. The checking includes: (a) measuring, by a partial pressure sensor provided at an exhaust pipe, an oxygen partial pressure value of a residual oxygen after the process furnace is vacuum-exhausted; (b) comparing the oxygen partial pressure value measured by the partial pressure sensor with a threshold value; and (c) when the oxygen partial pressure value is higher than the threshold value in (b), performing at least one among: purging the process furnace and evacuating the process furnace.
    Type: Application
    Filed: February 19, 2021
    Publication date: June 10, 2021
    Inventors: Akinori TANAKA, Shinji YASHIMA, Masahiro MIYAKE
  • Patent number: 10310419
    Abstract: An image forming apparatus includes an image bearing member to form a toner image on a recording material with a liquid developer containing a toner and a carrier liquid, wherein the carrier liquid contains a first substance, charged to an opposite polarity to a charge polarity of the toner, for imparting an electrical polarity to the toner, and a second substance, higher in volume resistivity than the first substance, a cleaning portion to collect the liquid developer remaining on the image bearing member after the toner image is transferred onto the recording material, a toner separating device to separate the collected liquid developer into the toner and the carrier liquid, and a carrier separating device to separate the carrier liquid into the carrier liquid containing the first substance and the carrier liquid containing the second substance by applying an electric field to the carrier liquid.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: June 4, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Teppei Nagata, Akinori Tanaka
  • Publication number: 20190003047
    Abstract: Described herein is a technique capable of preventing an occurrence of the metal contamination in a vaporizer for vaporizing a liquid source. According to the technique described herein, there is provided a vaporizer including: a vaporization vessel constituted by a quartz body; and an atomizer made of a fluorine resin and configured to atomize a liquid source using a carrier gas (atomization gas) and to supply the atomized liquid source into the vaporization vessel.
    Type: Application
    Filed: September 7, 2018
    Publication date: January 3, 2019
    Inventors: Hideto TATENO, Akinori TANAKA, Daisuke HARA, Masahisa OKUNO, Takuya JODA, Takashi TSUKAMOTO, Sadayoshi HORII, Toru KAKUDA
  • Publication number: 20180308730
    Abstract: A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a processing solution to the substrate, a flow rate measuring part configured to measure a flow rate of the processing solution supplied to the nozzle, a flow path opening/closing part configured to open and close a supply flow path of the processing solution to the nozzle, and a controller configured to output a close signal causing the flow path opening/closing part to perform a closing operation that closes the supply flow path. The controller is configured to detect an operation abnormality of the flow path opening/closing part based on an accumulated amount of the flow rate measured by the flow rate measuring part after outputting the close signal.
    Type: Application
    Filed: April 24, 2018
    Publication date: October 25, 2018
    Inventors: Kenji NAKAMIZO, Satoshi MORITA, Akinori TANAKA, Hiroshi KOMIYA, Mikio NAKASHIMA, Kousuke FUKUDA, Youichi MASAKI, Ryoji ANDO, Ikuo SUNAKA
  • Publication number: 20180204720
    Abstract: Described herein is a technique capable of acquiring, monitoring and recording the progress of the reaction between a substrate and a reactive gas contained in a process gas in a process chamber during the processing of the substrate. According to the technique, there is provided a substrate processing apparatus including: a process chamber accommodating a substrate; a process gas supply system configured to supply a process gas into the process chamber via a process gas supply pipe; an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; a first gas concentration sensor configured to detect a first concentration of a reactive gas contained in the process gas in the process gas supply pipe; and a second gas concentration sensor configured to detect a second concentration of the reactive gas contained in an exhaust gas in the exhaust pipe.
    Type: Application
    Filed: March 12, 2018
    Publication date: July 19, 2018
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Akinori TANAKA, Hideto TATENO, Sadayoshi HORII
  • Publication number: 20180204742
    Abstract: A substrate processing apparatus, includes: a process chamber accommodating a substrate; a vaporizer vaporizing a liquid precursor to generate reaction gas and deliver a processing gas containing the reaction gas and a carrier gas, the vaporizer including: a vaporization vessel; and a heater heating the liquid precursor introduced into the vessel; a carrier gas flow rate controller controlling flow rate of the carrier gas supplied to the vaporizer; a liquid precursor flow rate controller controlling flow rate of the liquid precursor; a processing gas supply pipe introducing the processing gas delivered from the vaporizer into the process chamber; and a gas concentration sensor detecting a gas concentration of the reaction gas contained in the processing gas delivered from the vaporizer into the processing gas supply pipe.
    Type: Application
    Filed: March 13, 2018
    Publication date: July 19, 2018
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Hideto TATENO, Daisuke HARA, Masahisa OKUNO, Takuya JODA, Takashi TSUKAMOTO, Akinori TANAKA, Toru KAKUDA, Sadayoshi HORII
  • Publication number: 20180087709
    Abstract: A configuration including a process chamber for processing a substrate, a gas supply system including supply pipe for supplying a source gas into the process chamber, and an exhaust system including exhaust pipe for discharging an exhaust gas containing the source gas from the process chamber, in which at least one of the supply pipe and the exhaust pipe includes an inner pipe constituting a first flow path of the source gas or the exhaust gas, a member provided outside the inner pipe and constituting a second flow path between the member and an outer wall of the inner pipe, and an outer pipe provided surrounding the inner pipe in order to provide a space between the outer pipe and an outside of the member.
    Type: Application
    Filed: September 15, 2017
    Publication date: March 29, 2018
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Mikio OHNO, Akinori TANAKA
  • Patent number: D813065
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: March 20, 2018
    Assignees: HITACHI KOKUSAI ELECTRIC INC., HORIBA ADVANCED TECHNO CO., LTD.
    Inventors: Hideto Tateno, Akinori Tanaka, Kimihiko Arimoto