Abstract: A control gate electrode is formed on a semiconductor substrate via a first gate dielectric film. A second gate dielectric film including a charge storage layer is formed on an upper surface of the semiconductor substrate and on one side surface of the control gate electrode. A memory gate electrode is formed on the second gate dielectric film. A cap film formed of a dielectric material is formed on an upper surface of the control gate electrode, and a silicide film is formed on an upper surface of the memory gate electrode. An upper surface of the cap film and an upper surface of the silicide film are exposed from a sidewall spacer SW and an interlayer dielectric film.

Abstract: A method of manufacturing a semiconductor device capable of detecting occurrence of a Hi-K disappearance is provided. The method of manufacturing a semiconductor device includes a step of manufacturing a test pattern including a reference resistance, a gate leakage resistance through which a gate leakage current flows and connected in series with the reference resistance, and a step of measuring a change in voltage at a connection node between the reference resistance and the gate leakage resistance caused by the flow of the gate leakage current.

Abstract: The method extracts an extract containing sea cucumber saponins. The extract is separated from sea cucumber meat exclusively by a specific heat treatment without conducting any chemical treatment with the use of an enzyme, ethanol, etc. The method includes: a step for heating sea cumbers from a starting temperature to a target heating temperature by a first temperature gradient; and a step for decreasing the temperature by a second temperature gradient that is gentler than the first temperature gradient to thereby extract the sea cucumber extract. The sea cucumber extract is stored as a sea cucumber extract material in the form of a liquid concentrate, etc. Then an appropriate amount of the sea cucumber extract material is added to, for example, another sea cucumber extract material having been separated and extracted from sea cucumbers with a lower saponin content.

Abstract: The fiber-reinforced resin intermediate material according to the present invention is formed by attaching a resin powder to an outer surface of a reinforcing fiber substrate formed of reinforcing fibers and heating it to melt the resin powder to the outer surface of the reinforcing fiber substrate so as to have an uneven shape derived from the resin powder and also have an opened void space.

Abstract: A first semiconductor chip and a second semiconductor chip are stacked such that a first inductor and a second inductor face each other. An insulating sheet is disposed between the first semiconductor chip and the second semiconductor chip. The sealing member seals the first semiconductor chip, the second semiconductor chip, and the insulating sheet. The sealing member is disposed both between the insulating sheet and the first semiconductor chip and between the insulating sheet and the second semiconductor chip.

Abstract: A semiconductor device has a coil and wirings under the coil. In addition, a distance between the upper face of the wirings and the bottom face of the coil is 7 ?m or larger, and the wirings have a plurality of linear wiring parts each wiring width of which is 1 ?m or smaller. In addition, the linear wiring parts do not configure a loop wiring, and the coil and the linear wiring parts are overlapped with each other in planar view.

Abstract: The method extracts an extract containing sea cucumber saponins. The extract is separated from sea cucumber meat exclusively by a specific heat treatment without conducting any chemical treatment with the use of an enzyme, ethanol, etc. The method includes: a step for heating sea cumbers from a starting temperature to a target heating temperature by a first temperature gradient; and a step for decreasing the temperature by a second temperature gradient that is gentler than the first temperature gradient to thereby extract the sea cucumber extract. The sea cucumber extract is stored as a sea cucumber extract material in the form of a liquid concentrate, etc. Then an appropriate amount of the sea cucumber extract material is added to, for example, another sea cucumber extract material having been separated and extracted from sea cucumbers with a lower saponin content.

Abstract: A semiconductor device has a coil and wirings under the coil. In addition, a distance between the upper face of the wirings and the bottom face of the coil is 7 ?m or larger, and the wirings have a plurality of linear wiring parts each wiring width of which is 1 ?m or smaller. In addition, the linear wiring parts do not configure a loop wiring, and the coil and the linear wiring parts are overlapped with each other in planar view.

Abstract: The present invention provides a fiber-reinforced resin intermediate material, including not only a thermoplastic resin but also a thermosetting resin, in which defects such as voids are difficult to be generated and which is excellent in shaping ability; and a method for manufacturing the same. The fiber-reinforced resin intermediate material according to the present invention is a fiber-reinforced resin intermediate material formed by attaching a resin to an outer surface part of a reinforcing fiber substrate formed of reinforcing fibers subjected to opening and heating the resin to a temperature equal to or higher than the melting point of the resin to impregnate the reinforcing fiber substrate with the resin, wherein the reinforcing fiber substrate has void space that is opened on an outer surface thereof and the resin is in a semi-impregnated state.

Abstract: A first semiconductor chip and a second semiconductor chip are stacked such that a first inductor and a second inductor face each other. An insulating sheet is disposed between the first semiconductor chip and the second semiconductor chip. The sealing member seals the first semiconductor chip, the second semiconductor chip, and the insulating sheet. The sealing member is disposed both between the insulating sheet and the first semiconductor chip and between the insulating sheet and the second semiconductor chip.

Abstract: The present invention provides a method for manufacturing a fiber-reinforced resin substrate or a resin molded body, the method being capable of effectively performing impregnation of a reinforcing fiber material with a thermoplastic resin and having high productivity and economical efficiency, and an extruder for use in the manufacturing method. The manufacturing method of the invention is a method for manufacturing a fiber-reinforced resin substrate or resin molded body obtained by impregnating a reinforcing fiber material with a thermoplastic resin, including placing the reinforcing fiber material on a molten resin of the thermoplastic resin and pressurizing the same to impregnate the reinforcing fiber material with the molten thermoplastic resin, and subsequently, cooling and solidifying the reinforcing fiber material impregnated with the molten thermoplastic resin.

Abstract: The present invention provides a fiber-reinforced resin intermediate material, including not only a thermoplastic resin but also a thermosetting resin, in which defects such as voids are difficult to be generated and which is excellent in shaping ability; and a method for manufacturing the same. The fiber-reinforced resin intermediate material according to the present invention is a fiber-reinforced resin intermediate material formed by attaching a resin to an outer surface part of a reinforcing fiber substrate formed of reinforcing fibers subjected to opening and heating the resin to a temperature equal to or higher than the melting point of the resin to impregnate the reinforcing fiber substrate with the resin, wherein the reinforcing fiber substrate has void space that is opened on an outer surface thereof and the resin is in a semi-impregnated state.

Abstract: The present invention provides a fiber-reinforced resin intermediate material, including not only a thermoplastic resin but also a thermosetting resin, in which defects such as voids are difficult to be generated and which is excellent in shaping ability; and a method for manufacturing the same. The fiber-reinforced resin intermediate material according to the present invention is a fiber-reinforced resin intermediate material formed by attaching a resin to an outer surface part of a reinforcing fiber substrate formed of reinforcing fibers subjected to opening and heating the resin to a temperature equal to or higher than the melting point of the resin to impregnate the reinforcing fiber substrate with the resin, wherein the reinforcing fiber substrate has void space that is opened on an outer surface thereof and the resin is in a semi-impregnated state.

Abstract: A semiconductor device has a coil and wirings under the coil. In addition, a distance between the upper face of the wirings and the bottom face of the cod is 7 ?m or larger, and the wirings have a plurality of linear wiring parts each wiring width of which is 1 ?m or smaller. In addition, the linear wiring parts do not configure a loop wiring, and the coil and the linear wiring parts are overlapped with each other in planar view. Even if such wirings (linear wiring parts) are arranged under the coil, the characteristics (for example, RF characteristics) of the semiconductor device are not deteriorated. In addition, the area of the semiconductor device can be reduced or high integration of elements can be realized by laminating elements (for example, MOM capacitance elements and the like) having the coil and the linear wiring parts.

Abstract: The fiber-reinforced resin intermediate material according to the present invention is formed by attaching a resin powder to an outer surface of a reinforcing fiber substrate formed of reinforcing fibers and heating it to melt the resin powder to the outer surface of the reinforcing fiber substrate so as to have an uneven shape derived from the resin powder and also have an opened void space.

Abstract: A production method for a fiber-reinforced component according to the present invention includes: a step 1, in which a melt of a thermoplastic resin is formed in a lower die, a mat-shaped material formed from a reinforcing fiber B is placed on the melt, an upper die for pressing is closed on the lower die and is pressed, and an impregnation treatment is performed, and then, the mat-shaped material impregnated with the resin is cooled and solidified, whereby a main body part formed from a fiber-reinforced resin is molded; and a step 2, in which the upper die for pressing is opened, an upper die for injection molding is closed on the lower die to form an injection molding die, and then, injection molding is performed to form an additional part, whereby a fiber-reinforced component having the additional part combined with the main body part is molded.

Abstract: Provided is a support device that supports easier data exchange between PLCs without relying on a type of a PLC of the other communication party. The support device includes: a first input unit for receiving information defining, on a data-by-data basis, variables for data handled by the first programmable logic controller; a second input unit for receiving a source program expressing processing executed on the first programmable logic controller using the defined variables; a third input unit for receiving information that identifies a type of a second programmable logic controller in association with a first variable; and a generation unit that generates the executable program using the information defining the variables and the source program. The generation unit adapts a data structure of first data secured in the memory in correspondence with the first variable in accordance with the type of the second programmable logic controller.

Abstract: The present invention provides a fiber-reinforced resin intermediate material, including not only a thermoplastic resin but also a thermosetting resin, in which defects such as voids are difficult to be generated and which is excellent in shaping ability; and a method for manufacturing the same. The fiber-reinforced resin intermediate material according to the present invention is a fiber-reinforced resin intermediate material formed by attaching a resin to an outer surface part of a reinforcing fiber substrate formed of reinforcing fibers subjected to opening and heating the resin to a temperature equal to or higher than the melting point of the resin to impregnate the reinforcing fiber substrate with the resin, wherein the reinforcing fiber substrate has void space that is opened on an outer surface thereof and the resin is in a semi-impregnated state.

Abstract: A tightening system for tightening a fastening member includes: a driving section producing torque for tightening the fastening member; an extension bar coupled to the driving section and rotating by the torque; a spindle to which the torque is transmitted via the extension bar and which is connected to the extension bar such that the spindle moves forward or backward in a rotational axis direction of the extension bar with respect to the extension bar; a socket provided at a tip of the spindle and engages in the fastening member; a spindle case housing the spindle and helically spline-engaging with the spindle along a rotational axis direction of the spindle; an outer case housing the spindle case; and a switch for switching between held and separated states between the spindle case and the outer case.

Abstract: A fog lamp knob (12) and a fog lamp rotor (16) are mounted from one direction along an axis center line (CL). When the fog lamp knob (12) and the fog lamp rotor (16) are mounted, a drive pin (24) on a fog lamp mobile member (22) is disposed between the fog lamp knob (12) cam surface (15) and the fog lamp rotor (16) cam surface (20).