Patents by Inventor Akio Takahashi

Akio Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyparaxylylene film, production method therefor and semiconductor device
    Publication number: 20050014388
    Abstract: An organic polymer film of low dielectric constant and high heating resistance which is applicable as an insulating layer of a semiconductor devices is provided, as well as a manufacturing method for the film and a semiconductor device incorporating the film.
    Type: Application
    Filed: July 22, 2002
    Publication date: January 20, 2005
    Inventors: Akio Takahashi, Yuichi Satsu, Harakazu Nakai, Yoshiko Nakai, Igor Kardash, Andrei Pebalk, Sergei Chvalun, Karen Mailyan
  • Alkaline battery
    Publication number: 20050008936
    Abstract: The present invention provides an alkaline battery suitable for use as a primary or secondary battery as a power source of electronic appliances. The battery is excellent in discharge characteristics under a heavy load and in cycle characteristics. The alkaline battery (100) comprises a cathode mix (3) containing ?-nickel oxy-hydroxide, an anode mix (5) containing zinc as a main component of anode active material, and an alkali solution as an electrolyte, wherein the cathode mix (3) includes a mixture of ?-nickel oxy-hydroxide, graphite powder, and a potassium hydroxide solution in a given weight ratio. The ?-nickel oxy-hydroxide is prepared by chemical oxidation and has an approximately spherical shape of particle with a mean particle size in the range of 5 to 50 ?m.
    Type: Application
    Filed: April 15, 2004
    Publication date: January 13, 2005
    Inventors: Akio Takahashi, Shinichiro Morikawa, Naoki Hayashi, Kazuo Honda, Kuniyasu Oya, Kenta Yamamoto, Noriyuki Kobayashi
  • Solvent-free thermosetting resin composition, process for producing the same, and product therefrom
    Patent number: 6821657
    Abstract: A solvent-free thermosetting resin composition which comprises an epoxy resin (a) and a product (b) of the reaction of an organosilicon compound, represented by the general formula (1) (where R is an organic group containing a functional group reactive with an epoxy resin by addition reaction; and R1 is a methyl or ethyl group), with water, the product (b) containing organosilicon compound polycondensates formed in the epoxy resin (a) and having a degree of polycondensation of 2 or higher, and which has a low viscosity at a room temperature (25° C.) and gives a cured resin having intact material properties, especially intact high-temperature mechanical properties; a process for producing the resin composition; and a product obtained by applying the composition.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: November 23, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Akio Takahashi, Yuichi Satsu, Harukazu Nakai, Masao Suzuki, Yuzo Ito, Shuichi Oohara
  • Electroless gold plating solution and method for electroless plating
    Patent number: 6811828
    Abstract: The present invention is aimed to provide an electroless gold plating solution which requires less amount of a reducing agent, retains a sufficient deposition rate for a practical use, and has an excellent stability as a plating solution; and a method for carrying out an electroless gold plating. The present invention provides an electroless gold plating solution comprising a gold salt, a phenyl compound based reducing agent and a water-soluble amine and a method for plating using the gold plating solution.
    Type: Grant
    Filed: March 17, 2003
    Date of Patent: November 2, 2004
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Akio Takahashi, Hiroshi Yamamoto, Sumiko Nakajima, Kiyoshi Hasegawa, Kanji Murakami
  • Apparatus for a vehicle for protection of a colliding object
    Publication number: 20040182629
    Abstract: An apparatus for a vehicle for protection of a colliding object is provided, which includes one of a collision prediction module that delivers a precautionary signal when the collision prediction module predicts a collision of the vehicle with the object and a collision detection module that delivers a collision signal when the collision detection module detects the collision, an air bag which deploys on either a hood of the vehicle or an outside of its windshield when the collision is either predicted by the collision prediction module or detected by the collision detection module, a camera for taking a forward image of the vehicle and a monitor disposed in a cabin of the vehicle. In the apparatus, the monitor displays the image taken by the camera when the monitor receives one of the precautionary signal and the collision signal.
    Type: Application
    Filed: March 1, 2004
    Publication date: September 23, 2004
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Akio Takahashi, Nobuyoshi Asanuma
  • Thermosetting resin composition
    Publication number: 20040143062
    Abstract: A thermosetting resin composition is produced by heat treating a mixture of a polyaddition thermosetting resin, a silicic compound of the formula 1
    Type: Application
    Filed: January 8, 2004
    Publication date: July 22, 2004
    Inventors: Yuichi Satsu, Harukazu Nakai, Akio Takahashi, Masao Suzuki, Katsuo Sugawara
  • Thermosetting resin composition
    Patent number: 6762511
    Abstract: A device allows for continuous regulation of the composition of a fluid mixture that includes at least two components of different polarities. The device is designed, for example, to be inserted in a separation system that the device supplies with a carrier fluid of stabilized composition. The device includes a storage tank (3) receiving a mixture coming from the separation system and at least one auxiliary vessel (6) containing one of the components of the mixture. To control the transfer of this component from auxiliary vessel (6) to storage tank (3), the device further includes at least one tubular capacitive sonde (CS) totally immersed in the fluid mixture, a sonde (TS) for measuring the temperature of the mixture, and a sondc (LS) for measuring the mixture level in storage tank (3).
    Type: Grant
    Filed: March 19, 2001
    Date of Patent: July 13, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Yuichi Satsu, Harukazu Nakai, Akio Takahashi, Masao Suzuki, Katsuo Sugawara
  • Background noise eliminating apparatus and method, and storage medium storing program realizing such method
    Patent number: 6760690
    Abstract: A CPU of an effector calculates envelopes of an impulse response waveform from sample data of impulse response waveform data supplied from a microphone via an A/D converter circuit. Next, CPU detects a section during which a slope of the detected envelopes takes a value near “0” during a predetermined time or longer. CPU calculates an average value of sample data during the detected section to correct a DC offset. Thereafter, CPU acquires a maximum value of absolute values among the sample data during the detected section, and determines this maximum value as a background noise component value. The background noise components are removed from each sample data constituting the impulse response waveform data.
    Type: Grant
    Filed: August 31, 2001
    Date of Patent: July 6, 2004
    Assignee: Yamaha Corporation
    Inventor: Akio Takahashi
  • Distance measuring sensor mounting structure
    Patent number: 6729429
    Abstract: A distance measuring sensor mounting structure includes a bulkhead upper frame, a front bumper beam situated below the bulkhead upper frame and diagonally to the front thereof and at least two sensor brackets each having a distance measuring sensor fixedly supported thereon. At least two sensor brackets are installed at predetermined positions between the bulkhead upper frame and the front bumper beam to connect the bulkhead upper frame to the front bumper beam.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: May 4, 2004
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventor: Akio Takahashi
  • Electronic device using low dielectric loss tangent insulators for high frequency signals
    Publication number: 20040039127
    Abstract: An electronic device for high frequency signals having a small dielectric loss and high efficiency is provided which has a low dielectric loss tangent resin composition for coping with high frequency signals as an insulating layer.
    Type: Application
    Filed: May 9, 2003
    Publication date: February 26, 2004
    Inventors: Satoru Amou, Akira Nagai, Shinji Yamada, Takao Ishikawa, Akio Takahashi
  • Electroless gold plating solution and method for electroless plating
    Publication number: 20040028833
    Abstract: The present invention is aimed to provide an electroless gold plating solution which requires less amount of a reducing agent, retains a sufficient deposition rate for a practical use, and has an excellent stability as a plating solution; and a method for carrying out an electroless gold plating. The present invention provides an electroless gold plating solution comprising a gold salt, a phenyl compound based reducing agent and a water-soluble amine and a method for plating using the gold plating solution.
    Type: Application
    Filed: March 17, 2003
    Publication date: February 12, 2004
    Inventors: Akio Takahashi, Hiroshi Yamamoto, Sumiko Nakajima, Kiyoshi Hasegawa, Kanji Murakami
  • Solvent-free thermosetting resin composition, process for producing the same, and product therefrom
    Publication number: 20040007769
    Abstract: A solvent-free thermosetting resin composition which comprises an epoxy resin (a) and a product (b) of the reaction of an organosilicon compound, represented by the general formula (1) (where R is an organic group containing a functional group reactive with an epoxy resin by addition reaction; and R1 is a methyl or ethyl group), with water, the product (b) containing organosilicon compound polycondensates formed in the epoxy resin (a) and having a degree of polycondensation of 2 or higher, and which has a low viscosity at a room temperature (25° C.) and gives a cured resin having intact material properties, especially intact high-temperature mechanical properties; a process for producing the resin composition; and a product obtained by applying the composition.
    Type: Application
    Filed: June 25, 2003
    Publication date: January 15, 2004
    Inventors: Akio Takahashi, Yuichi Satsu, Harukazu Nakai, Masao Suzuki, Yuzo Ito, Shuichi Oohara
  • Thermal stable low elastic modulus material and device using the same
    Patent number: 6638631
    Abstract: The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same. The present invention also provides a thermal stable low elastic modulus resin composition obtained by heat-curing a mixture containing a polyimide, polyamide-imide or polyamide resin or resin precursor, whose cured product has an elastic modulus measured at −50° C. of 2-0.01 GPa, and an oligomer of an organosilicon compound having a functional group capable of causing addition reaction with an NH and/or COOH group.
    Type: Grant
    Filed: July 5, 2002
    Date of Patent: October 28, 2003
    Assignee: Hitachi, ltd.
    Inventors: Yuichi Satsu, Morimichi Umino, Takumi Ueno, Akio Takahashi, Akira Nagai, Toshiya Satoh, Shinji Yamada, Kazuhiro Suzuki
  • Thermal stable low elastic modulus material and device using the same
    Patent number: 6638352
    Abstract: The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same. The present invention also provides a thermal stable low elastic modulus resin composition obtained by heat-curing a mixture containing a polyimide, polyamide-imide or polyamide resin or resin precursor, whose cured product has an elastic modulus measured at −50° C. of 2-0.01 GPa, and an oligomer of an organosilicon compound having a functional group capable of causing addition reaction with an NH and/or COOH group.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: October 28, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Yuichi Satsu, Morimichi Umino, Takumi Ueno, Akio Takahashi, Akira Nagai, Toshiya Satoh, Shinji Yamada, Kazuhiro Suzuki
  • Three-dimensional sound reproducing apparatus and a three-dimensional sound reproduction method
    Publication number: 20030086572
    Abstract: A three-dimensional sound reproducing apparatus is configured by cascading a sound field effect adding unit and a crosstalk canceling unit. The sound field effect adding unit adds a predetermined three-dimensional sound field effect to an input audio signal, thereby generating audio signals respectively corresponding to left and right channels. The crosstalk canceling unit performs a calculation process on the audio signals of the two channels so that, when the audio signals are respectively generated by two loudspeakers positioned in front of a listener, the audio signals reach the left and right ears of the listener without producing crosstalk. The resulting audio signals are supplied to the loudspeakers, respectively.
    Type: Application
    Filed: November 25, 2002
    Publication date: May 8, 2003
    Applicant: YAMAHA CORPORATION
    Inventors: Hiromi Sotome, Shigeo Ando, Shinichi Muramatsu, Akio Takahashi, Hiroshi Iriyama
  • Three-dimensional sound reproducing apparatus and a three-dimensional sound reproduction method
    Publication number: 20030053633
    Abstract: A three-dimensional sound reproducing apparatus is configured by cascading a sound field effect adding unit and a crosstalk canceling unit. The sound field effect adding unit adds a predetermined three-dimensional sound field effect to an input audio signal, thereby generating audio signals respectively corresponding to left and right channels. The crosstalk canceling unit performs a calculation process on the audio signals of the two channels so that, when the audio signals are respectively generated by two loudspeakers positioned in front of a listener, the audio signals reach the left and right ears of the listener without producing crosstalk. The resulting audio signals are supplied to the loudspeakers, respectively.
    Type: Application
    Filed: August 30, 2002
    Publication date: March 20, 2003
    Applicant: YAMAHA CORPORATION
    Inventors: Hiromi Sotome, Shigeo Ando, Shinichi Muramatsu, Akio Takahashi
  • Thermal stable low elastic modulus material and device using the same
    Publication number: 20030047351
    Abstract: The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same.
    Type: Application
    Filed: July 5, 2002
    Publication date: March 13, 2003
    Inventors: Yuichi Satsu, Morimichi Umino, Takumi Ueno, Akio Takahashi, Akira Nagai, Toshiya Satoh, Shinji Yamada, Kazuhiro Suzuki
  • Thermal stable low elastic modulus material and device using the same
    Publication number: 20030049193
    Abstract: The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same.
    Type: Application
    Filed: March 15, 2002
    Publication date: March 13, 2003
    Inventors: Yuichi Satsu, Morimichi Umino, Takumi Ueno, Akio Takahashi, Akira Nagai, Toshiya Satoh, Shinji Yamada, Kazuhiro Suzuki
  • High dielectric constant composite material and multilayer wiring board using the same
    Publication number: 20030030999
    Abstract: A high dielectric composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility with organic resins, and then dispersing in an organic resin, has a dielectric constant of 15 or above, with its dielectric loss tangent in the frequency region of from 100 MHz to 80 GHz being 0.1 or less, and can therefore be used effectively for multilayer wiring boards and module substrates.
    Type: Application
    Filed: August 7, 2002
    Publication date: February 13, 2003
    Applicant: HITACHI, LTD.
    Inventors: Yuichi Satsu, Akio Takahashi, Tadashi Fujieda, Takumi Ueno, Haruo Akahoshi
  • Generating synthesized voice and instrumental sound
    Patent number: 6513007
    Abstract: There is provided a synthesized sound generating apparatus and method which can achieve responsive and high-quality speech synthesis based on a real-time convolution operation. Coefficients are generated by using dynamic cutting to extract characteristic information from a first signal. A convolution operation is performed on a second signal using the generated coefficients to generate a synthesized signal. As the convolution operation, an interpolation process is performed on the coefficients to prevent a rapid change in level of the generated synthesized signal upon switching of the coefficients.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: January 28, 2003
    Assignee: Yamaha Corporation
    Inventor: Akio Takahashi