Patents by Inventor Akio Takahashi

Akio Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6193305
    Abstract: A windshield supporting structure, through which a windshield is supported on a dashboard includes, a first cantilever-like support constructed to extend substantially horizontally from a front edge of an upper surface of the dashboard toward a front of a vehicle body; and a second support extending from a distal end of the first support toward a lower edge of said windshield, the first support and the second support being constructed to form a substantially V-shaped cross-section. The second support includes a thin lower flange portion connecting with the distal end of the first support, a box portion having a hollow rectangular cross-section and being continued with the lower flange portion, and an upper flange portion supporting the windshield and being continued with the box portion.
    Type: Grant
    Filed: July 23, 1999
    Date of Patent: February 27, 2001
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventor: Akio Takahashi
  • Patent number: 6193304
    Abstract: A windshield support is formed as a cantilever-like or overhang support including a bend portion 16, a box portion and a flange portion 20 which are formed continuously in that order. The bend portion 16 is extended from an instrument panel upper portion 12 and has a substantially V-shaped cross section. The box portion 18 has a hollow rectangular cross section and is sufficiently disposed away from the instrument panel upper portion 12. The flange portion 20 receives a front window glass 15. A recessed portion 12a is provided at the instrument panel upper portion 12 for receiving a lower portion 18a of the box portion 18 when the bend portion 16 has to be bent by virtue of an external force applied to the windshield.
    Type: Grant
    Filed: May 11, 1999
    Date of Patent: February 27, 2001
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Akio Takahashi, Kiyonari Shirato
  • Patent number: 6190834
    Abstract: The present invention provides a photosensitive resin composition capable of forming an insulating film, which is superior in both a roughening property and an adhesiveness, and a via-hole, which is highly reliable in connection, and a multilayer printed circuit board. The present invention provides a photosensitive resin composition containing a first resin, which is an epoxy resin, and a second resin having a N-substituted carbamic acid ester atomic group and a radical polymeric unsaturated bond in its side chain. The second resin is desirably an oligomer having a repeating unit expressed by the following general formula (chem. 1) or (chem. 3) by 3-10 units. Where, X is H or CH3, Y and Z is H or an alkyl group of carbon number 1-4, n is 0 or 1, a part of R1 is an atomic group expressed by the following general formula (chem. 2), the residual R1 is a hydroxyl group, and R2 is an alkylene group of carbon number 1-4.
    Type: Grant
    Filed: May 6, 1998
    Date of Patent: February 20, 2001
    Assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd.
    Inventors: Masatoshi Narahara, Mineo Kawamoto, Tokihito Suwa, Masao Suzuki, Satoru Amou, Akio Takahashi, Hiroyuki Fukai, Mitsuo Yokota, Shiro Kobayashi, Masashi Miyazaki
  • Patent number: 6190493
    Abstract: A thin-film multilayer wiring board comprising a first and a second metallic wiring layers formed on a substrate with an organic insulating layer interposed between the metallic wiring layers, wherein the lands of the first and second metallic wiring layers are electrically connected by via studs made of a conductive metal filler formed by electroless plating, and the difference between the top end diameter and the base diameter of each via stud is 10% or less, or the angle made by the taper of the interface between the insulating layer and each via stud against the axis thereof is 5° or less, can provide a high wiring density and signal transmission performance.
    Type: Grant
    Filed: November 20, 1997
    Date of Patent: February 20, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Ryuji Watanabe, Takeyuki Itabashi, Osamu Miura, Akio Takahashi, Yukio Ookoshi, Hitoshi Suzuki, Masahiro Suzuki, Tsutomu Imai
  • Patent number: 6179364
    Abstract: In a bonnet for an automobile in which an inner frame 22 as a reinforcement is placed to integrally underlie an outer panel 21, assuming that the thickness of the bonnet 20 is expressed as a distance from an upper surface of the outer panel 21 to a lower surface of the inner frame 22, the thickness of the bonnet is reduced at a front portion rather than at a rear portion of the bonnet, whereby a reduction in rigidity is attained at the front portion. From an empirical observation, a smaller obstacle tends to come into collision with the front portion of the bonnet, while a larger obstacle with the rear portion of the bonnet, and therefore, the thickness of the bonnet is made thinner at the front portion than at the rear portion of the bonnet. Consequently, a damage to an obstacle, in particular, to a smaller obstacle, produced when it comes into collision with the bonnet is limited to a minimum level.
    Type: Grant
    Filed: May 12, 1999
    Date of Patent: January 30, 2001
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventor: Akio Takahashi
  • Patent number: 6132852
    Abstract: A multilayer wiring substrate using a resin composition comprising polyquinoline compound and bismaleimide compound as essential ingredients between wiring-carrying resin layers as insulating layers forms no void at the time of lamination, has an excellent adhesive property at various interfaces, has a heat stability after lamination and is high in reliability, so that, it is applicable to many fields not only including the multilayer wiring substrates capable of mounting LSI or tip carrier directly but also including multilayer wiring substrate for work station, mounting substrates for small-sized electronic devices such as camera and video for people's use, and high frequency multitip module multilayer substrate.
    Type: Grant
    Filed: March 12, 1999
    Date of Patent: October 17, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Masahiro Suzuki, Akio Takahashi, Minoru Tanaka, Haruhiko Matsuyama, Haruo Akahoshi
  • Patent number: 6119609
    Abstract: A headgear holding apparatus including a base structure attached to a sewing machine such that the base structure is movable in a first direction, a rotatable structure supported by the base structure such that the rotatable structure is rotatable about a first axis line parallel to the first direction, a headgear holder which has a part-cylindrical outer surface for holding an inner surface of a headgear, the holder being detachably attached to the rotatable structure such that the part-cylindrical outer surface thereof is rotated when the rotatable structure is rotated, a headgear support member which is attached to the base structure, has a curved outer surface, and extends near a sewing position where a sewing needle of the sewing machine is reciprocated, the curved outer surface supporting the inner surface of the headgear when the holder is rotated, and two or more guide rollers attached to the base structure such that the rollers are provided on both sides of the headgear support member in a second dir
    Type: Grant
    Filed: July 6, 1998
    Date of Patent: September 19, 2000
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Yasuhiko Kawaguchi, Akio Takahashi
  • Patent number: 6054219
    Abstract: The present invention provides a soft magnetic powder composite core for an electric apparatus produced with soft magnetic particles having electric insulating layers on the surfaces thereof, wherein said electric insulating layers are formed by mixing said soft magnetic particles with an insulating layer-forming solution which comprises a phosphating solution and a rust inhibitor, which is an organic compound containing at least one of nitrogen or sulfur having a lone pair of electrons suppressing the formation of iron oxide and surfactant, and drying the treated soft magnetic particles at a predetermined temperature. The soft magnetic powder composite core is excellent in iron loss and magnetic flux density.
    Type: Grant
    Filed: May 27, 1997
    Date of Patent: April 25, 2000
    Assignees: Hitachi, Ltd., Hitachi Powdered Metals, Co., Ltd.
    Inventors: Yuichi Satsu, Hideaki Katayama, Yuzo Ito, Akio Takahashi, Noboru Baba, Chikara Tanaka, Kazuo Asaka, Chio Ishihara, Hiroaki Miyata, Kazuhiro Satou
  • Patent number: 6028364
    Abstract: A semiconductor device has a multi-layered wiring structure having a conductor layer to be electrically connected to a packaging substrate, the structure being provided on a circuit formation surface of a semiconductor chip; and ball-like terminals disposed in a grid array on the surface of the multi-layered wiring structure on the packaging substrate side, wherein the multi-layered wiring structure includes a buffer layer for relieving a thermal stress produced between the semiconductor chip and the packaging substrate, after packaging thereof, and multiple wiring layers.
    Type: Grant
    Filed: March 19, 1997
    Date of Patent: February 22, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Masahiko Ogino, Akira Nagai, Shuji Eguchi, Toshiaki Ishii, Masanori Segawa, Haruo Akahoshi, Akio Takahashi, Takao Miwa, Naotaka Tanaka, Ichirou Anjou
  • Patent number: 5958362
    Abstract: The present method is to produce an active material powder formed of a spinel oxide containing lithium or a layer-structured oxide containing lithium for a lithium secondary battery which is uniform in composition, fine in particle size and free of oxygen defects, and which is unlikely to cause capacity deterioration resulted from repetitive charge/discharge cycles at a high current density.A suspension 1 prepared by suspending an ingredient of the active material powder in a combustible liquid or an emulsion prepared by emulsifying a solution of the ingredient in the combustible liquid is sprayed in a droplet state 15 together with an oxygenic gas 2. The combustible liquid contained in the droplet 15 is burned to have the ingredient therein reacted and to evaporate the solvent. As a result, active material powder 4 formed of the spinel oxide containing lithium is obtained.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: September 28, 1999
    Assignee: Kabushiki Kaisha Toyota Chuo Kenkyusho
    Inventors: Kazumasa Takatori, Naoyoshi Watanabe, Toshihiko Tani, Tsuyoshi Sasaki, Akio Takahashi, Masahiko Kato, Akihiko Murakami
  • Patent number: 5914216
    Abstract: A multilayer circuit board having a resolution in the range of 25-80 .mu.m, and blind via-holes having an aspect ratio in the range of 2.0-0.6 for effecting access between the layers, wherein an insulating layer between said layers having the blind via-holes has a glass transition temperature in the range of 150-220.degree. C., and an epoxy group photosensitive resin composition is used therefor. A photosensitive resin composition having a preferable resolution and heat resistance is obtained. A multilayer circuit board is provided in which the thermal stress generated in the steps of a reflow process, a gold wire bonding process and a repairing process in a bare chip mounting process was reduced, and peeling off of the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses during the heating processes were suppressed. Accordingly, a decrease in the size and weight of an electronic apparatus is possible.
    Type: Grant
    Filed: July 18, 1997
    Date of Patent: June 22, 1999
    Assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd.
    Inventors: Satoru Amou, Masao Suzuki, Tokihito Suwa, Mineo Kawamoto, Akio Takahashi, Masanori Nemoto, Hiroyuki Fukai, Mitsuo Yokota, Shiro Kobayashi, Masashi Miyazaki
  • Patent number: 5873321
    Abstract: A sewing device including a head portion for mounting a needle; a support frame; and a bed unit supported on the frame and switchable between a usage position in confrontation with the head portion and a retracted position retracted away from the head portion compared with the usage position.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: February 23, 1999
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Fumiaki Asano, Akio Takahashi, Yoshikazu Kurono, Masaki Shimizu
  • Patent number: 5850791
    Abstract: A sewing machine including a needle bar having a sewing needle, a spindle for driving the needle bar, a bed portion movable selectively to a using position or a retracted position, and a rotary hook housed in the bed portion. A stitch is formed by the cooperation of the sewing needle and the rotary hook. A rotary hook drive motor is provided in the bed portion for driving the rotary hook. A sensor is provided for detecting a position of the bed portion. The needle bar and the spindle is selectively disconnected from each other. If the bed portion is out of the using position, and this out position is detected by the sensor, the needle bar is released from the spindle for stopping the sewing needle. Further, in this case, the rotation of the rotary hook drive motor is also stopped.
    Type: Grant
    Filed: November 18, 1997
    Date of Patent: December 22, 1998
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Yasuhiko Kawaguchi, Akio Takahashi, Masaki Shimizu, Hirokazu Hirose, Yoshikazu Kurono
  • Patent number: 5849460
    Abstract: A photosensitive resin composition for use in manufacture of multi-layer circuit boards with connecting holes between layers is disclosed. The resin composition has excellent adhesion with a plating metal, resolution, photo-curing, thermosetting, thermal resistance, and is capable of being developed using an alkaline solution or an aqueous solution containing a non-halogen based organic solvent as the developing solution. The resin composition comprises a photosensitive epoxy resin, a thermosetting epoxy resin, a reactant of a carboxylic acid added to an acrylonitrile-butadiene rubber and an epoxy resin, a photo-polymerization initiator and a thermosetting agent. This reactant facilitates a high density pattern of connecting holes for circuit boards of the layered type.
    Type: Grant
    Filed: July 16, 1997
    Date of Patent: December 15, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Yoshinori Kawai, Mineo Kawamoto, Junichi Katagiri, Masanori Nemoto, Akio Takahashi
  • Patent number: 5836260
    Abstract: A needle bar stopper is provided in a sewing machine having a main shaft and a needle bar which moves vertically upon reception of a driving force from the main shaft. The needle bar stopper comprises a transmission prohibiting unit, including a needle bar stopping solenoid, which prohibits transmission of the driving force from the main shaft to the needle bar and a braking unit, including a needle bar stopping solenoid, which applies a braking force to the needle bar when transmission of the driving force is prohibited by the transmission prohibiting unit. The needle bar stopper can stop the needle bar reliably by use of the braking unit.
    Type: Grant
    Filed: July 24, 1997
    Date of Patent: November 17, 1998
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Yasuhiko Kawaguchi, Akio Takahashi, Masaki Shimizu, Minoru Sakanobe
  • Patent number: 5803001
    Abstract: An embroidery machine having a spindle, a sewing machine motor driving the spindle, and a thread cutting device including a thread cutting motor and a thread cutting mechanism provided with a movable blade driven by the thread cutting motor. The thread cutting motor is provided independently of the sewing machine motor and is driven so that the movable blade is moved in synchronism with the spindle. The movable blade is movable between a maximum pivot positioned farthest from a stationary blade and a stand-by position close to the stationary blade.
    Type: Grant
    Filed: March 7, 1997
    Date of Patent: September 8, 1998
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Masaki Shimizu, Akio Takahashi
  • Patent number: 5788821
    Abstract: A copper-based oxidation catalyst comprising a substrate of copper or copper alloy and regions of a metal composed mainly of a group VIII element in close contact with the substrate, the surface of the substrate being partly exposed to the outside, has a high catalytic activity on the carbonyl oxidation reaction and is effective as a catalyst for electroless plating, a fuel cell electrode material, a catalyst for treating waste water or waste liquor or an oxidation reaction catalyst.
    Type: Grant
    Filed: March 11, 1997
    Date of Patent: August 4, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Takeyuki Itabashi, Fujiko Kinosaki, Akio Takahashi, Haruo Akahoshi
  • Patent number: 5784989
    Abstract: A sewing machine capable of cutting only a needle thread without cutting a bobbin thread during the middle of stitching operation for changing the needle thread with another needle thread. A thread cutting motor is driven independent of a sewing machine motor. A rotary hook control unit is provided for controlling rotation of a rotary hook as well as driving mode of the thread cutting motor in relation to a rotation of a spindle. A thread cutting mechanism including a movable blade pivotably driven by the thread cutting motor is provided between the rotary hook and a throat plate. If the movable blade is moved from its maximum pivot position to a stand-by position, both needle thread and bobbin thread are cut at the final number of stitch. If the movable blade is moved from a needle thread cutting position to the stand-by position, only the needle thread can be cut.
    Type: Grant
    Filed: February 28, 1997
    Date of Patent: July 28, 1998
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Masaki Shimizu, Akio Takahashi
  • Patent number: 5784990
    Abstract: An embroidery machine having a plurality of beds and corresponding heads. In each of the heads, a plurality of needle bars supporting needles and thread take up levers are provided. Each bed contains a rotary hook drive motor provided independent of a sewing machine motor which drives a spindle extending through the heads. The rotary hook drive motor is driven in synchronization with the spindle for performing embroidery stitching, but is driven independently of the spindle at a specific rotation angle range thereof based on number of stitching. In each bed, a conventional needle thread holding mechanism is dispensed with. By controlling rotation of the rotary hook drive motor, a residual end part of the needle thread has a sufficient length capable of avoiding disengagement of the residual end part from an eyelet of the needle at a thread cutting operation.
    Type: Grant
    Filed: March 7, 1997
    Date of Patent: July 28, 1998
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Masaki Shimizu, Akio Takahashi, Tetsuo Morita
  • Patent number: 5774746
    Abstract: A camera wherein exposure parameters fixed by a program line can be shifted along an exposure value EV line so that exposure parameters for an exposure operation are based on the shifted program line according to the preference of the camera user.The camera has setting means for temporarily changing these exposure parameters at a constant exposure value with respect to the values predetermined by a program line. A counting means counts the number of times that a shutter is released while the program line is shifted in one direction and control means stores the changed values for shifting the program line under certain conditions. In this way a learning function is provided to learn the aforementioned tendency of the user.
    Type: Grant
    Filed: March 31, 1997
    Date of Patent: June 30, 1998
    Assignee: Asahi Kogaku Kogyo Kabushiki Kaisha
    Inventors: Tadayuki Kirigaya, Hideaki Tsuji, Isamu Hirai, Yasuyuki Haneishi, Masato Yamamoto, Masaaki Haga, Masashi Furuno, Akio Takahashi, Koji Sato