Patents by Inventor Akira Fujita
Akira Fujita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210001641Abstract: A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.Type: ApplicationFiled: June 24, 2020Publication date: January 7, 2021Inventors: Goro NAKATANI, Akira FUJITA, Kazuya NAKAKUBO, Yasuhiro FUWA
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Patent number: 10861647Abstract: A method for manufacturing a monolithic ceramic electronic component includes preparing a mother block including ceramic green sheets stacked on each other, and an internal electrode pattern arranged along interfaces between the ceramic green sheets, cutting the mother block along first and second cutting lines that are perpendicular or substantially perpendicular to each other to obtain green chips each having a laminated structure including ceramic layers and internal electrodes in a raw state, the internal electrodes being exposed on a cut side surface produced by cutting along the first cutting line, forming a raw ceramic protective layer on the cut side surface to obtain a raw component body, and firing the raw component body, wherein the cut side surface is treated with a degreasing agent.Type: GrantFiled: February 22, 2018Date of Patent: December 8, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yuya Takagi, Akira Fujita, Hideaki Tanaka, Togo Matsui
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Publication number: 20200337118Abstract: A substrate processing apparatus includes a holder and a heating device. The holder is configured to hold a central portion of a bottom surface of a substrate to be rotated. The heating device is configured to supply a heated fluid to the bottom surface of the substrate. The heating device includes multiple fins, a heat source, a fluid introduction unit and a fluid discharge unit. The multiple fins are arranged along a circumferential direction of the substrate to be located under the substrate at an outer side than the holder. The heat source is configured to heat the multiple fins. The fluid introduction unit is configured to introduce the fluid to the multiple fins. The fluid discharge unit is configured to discharge the fluid, which is heated while passing through the multiple fins, to the bottom surface of the substrate.Type: ApplicationFiled: April 8, 2020Publication date: October 22, 2020Inventors: Yoshifumi Amano, Akira Fujita
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Patent number: 10788697Abstract: A display apparatus comprises a display device, a functional substrate opposed to and bonded to the display device through an air space and, at peripheral borders on the opposite surfaces of the display device and the functional substrate, first resin maintaining the distance between the display device and the functional substrate and second resin adhering the display device and the functional substrate to each other.Type: GrantFiled: August 28, 2017Date of Patent: September 29, 2020Assignee: TIANMA MICROELECTRONICS CO., LTD.Inventors: Yoshiro Kitagawa, Hitoshi Yoshida, Akira Fujita
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Patent number: 10747039Abstract: A display apparatus comprises a display device, a functional substrate opposed to and bonded to the display device through an air space and, at peripheral borders on the opposite surfaces of the display device and the functional substrate, first resin maintaining the distance between the display device and the functional substrate and second resin adhering the display device and the functional substrate to each other.Type: GrantFiled: August 28, 2017Date of Patent: August 18, 2020Assignee: TIANMA MICROELECTRONICS CO., LTD.Inventors: Yoshiro Kitagawa, Hitoshi Yoshida, Akira Fujita
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Patent number: 10670899Abstract: There are provided an apparatus and a method of manufacturing the apparatus. The apparatus includes: a plate-shaped base; a cover plate; and a curable resin adhering the plate-shaped base and the cover plate together. At least one of the plate-shaped base and the cover plate includes a light-shielding member covering a peripheral part of the at least one of the plate-shaped base and the cover plate. In an area which is shielded by the light-shielding member, a part of the curable resin at a side of an inner edge of the light shielding member is lower in one of an elastic modulus, a curing degree, and an adhesion strength than another part of the curable resin at a side of an outer edge of the light shielding member.Type: GrantFiled: December 27, 2018Date of Patent: June 2, 2020Assignee: TIANMA MICROELECTRONICS CO., LTD.Inventors: Hitoshi Yoshida, Futoshi Nakanishi, Akira Fujita
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Patent number: 10670714Abstract: An outside sensor unit includes an outside sensor, a main bracket, a support bracket, and a cover member. The main bracket is attached to a vehicle body. The support bracket supports the outside sensor and is attached to the main bracket rotatably adjustably. The cover member covers an outer circumference in an outside detection direction of the outside sensor. The main bracket has a base wall that is attached to the support bracket rotatably adjustably and an attachment seat that is arranged at a position which is offset in the outside detection direction of the outside sensor with respect to the base wall. The cover member is attached to the attachment seat.Type: GrantFiled: January 8, 2019Date of Patent: June 2, 2020Assignee: HONDA MOTOR CO., LTD.Inventors: Akira Fujita, Takato Watanabe
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Patent number: 10643835Abstract: Provided is a substrate processing apparatus that removes a film by supplying a processing liquid to the peripheral edge of a substrate. An ejection unit ejects the processing liquid to the peripheral edge of the substrate held and rotated by a substrate holding unit. An ejection position setting unit sets the ejection position of the processing liquid of the ejection unit to correspond to the removal width of the film included in a recipe, and a property information acquisition unit acquires property information of the film to be removed. A correction amount acquisition unit acquires the correction amount for correcting the ejection position of the processing liquid based on the property information of the film, and an ejection position correction unit corrects the ejection position of the processing liquid by the ejection unit based on the correction amount acquired by the correction amount acquisition unit.Type: GrantFiled: March 21, 2017Date of Patent: May 5, 2020Assignee: Tokyo Electron LimitedInventors: Akira Fujita, Tsuyoshi Mizuno
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Patent number: 10632760Abstract: A thermal printhead includes a substrate, a resistor layer with heat generation portions supported by the substrate and aligned in a primary scanning direction, a wiring layer supported by the substrate to form a conductive path to the heat generation portions, an insulating layer interposed between the substrate and the resistor layer, and a reflection layer located opposite to the heat generation portions with respect to the insulating layer. The reflection layer overlaps with the heat generation portions as viewed in a thickness direction of the heat generation portions and has a greater heat reflectivity than the insulating layer.Type: GrantFiled: February 20, 2019Date of Patent: April 28, 2020Assignee: ROHM CO., LTD.Inventors: Toshihiro Kimura, Akira Fujita, Kazuya Nakakubo, Satoshi Kimoto, Yasuhiro Yoshikawa, Tadashi Yamamoto
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Patent number: 10627662Abstract: A panel module includes a bonding resin layer between a first main face of a first substrate and a second main face of second substrate, and a bond made of cured adhesive. At least a part of an outer end face of the bonding resin layer is located inner than an outer end face of the first substrate and an outer end face of the second substrate. The bond has a stronger bonding force and a higher elasticity than the bonding resin layer. The bond is attached to a first region of the first main face and a second region of the second main face in an area outer than the bonding resin layer. The bond is attached to a third region of the outer end face of the second substrate and a fourth region of the first main face.Type: GrantFiled: November 1, 2018Date of Patent: April 21, 2020Assignee: TIANMA JAPAN, LTD.Inventors: Akira Fujita, Akira Suzuki, Yoshiro Kitagawa
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Patent number: 10615144Abstract: Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having predetermined crystal transformation characteristics defined by an XRD analysis, and after a sintering treatment, excellent electrical conductivity and thermal conductivity can be stably obtained; and a die bonding method using the conductive paste. Disclosed is a conductive paste which includes silver particles having a volume average particle size of 0.1 to 30 ?m as a sinterable conductive material, and a dispersing medium for making a paste-like form, and in which when the integrated intensity of the peak at 2?=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis before a sintering treatment of the silver particles is designated as S1, and the integrated intensity of the peak at 2?=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis after a sintering treatment (250° C.Type: GrantFiled: October 10, 2017Date of Patent: April 7, 2020Assignee: KAKEN TECH CO., LTD.Inventors: Shigeo Hori, Hirohiko Furui, Akira Fujita
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Patent number: 10500750Abstract: A cutting apparatus includes a crop mark print controller and a front/back determiner. The crop mark print controller prints a first crop mark on a front side of a medium and then print a second crop mark over the first crop mark. The second crop mark is larger in size than the first crop mark. The front/back determiner determines that the medium is placed, with its front side facing upward, when only the second crop mark is detected by a crop mark detector, and determine that the medium is placed, with its back side facing upward, when a pattern including the first crop mark and the second crop mark overlapping one another is detected by the crop mark detector.Type: GrantFiled: July 20, 2017Date of Patent: December 10, 2019Assignee: ROLAND DG CORPORATIONInventors: Akira Fujita, Kenji Matsushime
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Publication number: 20190288676Abstract: A driving apparatus includes a current output unit, a reference voltage output unit, a comparator, and a drive control unit. The current output unit is switchable to either a first ON resistance or a second ON resistance that is N times (N>1) the first ON resistance. The reference voltage output unit outputs a fist reference voltage during a large current time period, and outputs a second reference voltage that is M times (M>1) the first reference voltage during a small current time period. The drive control unit performs control to perform switching to the first ON resistance during the large current time period, and to perform switching to the second ON resistance during the small current time period.Type: ApplicationFiled: September 6, 2018Publication date: September 19, 2019Inventor: Akira Fujita
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Publication number: 20190263141Abstract: A thermal printhead includes a substrate, a resistor layer with heat generation portions supported by the substrate and aligned in a primary scanning direction, a wiring layer supported by the substrate to form a conductive path to the heat generation portions, an insulating layer interposed between the substrate and the resistor layer, and a reflection layer located opposite to the heat generation portions with respect to the insulating layer. The reflection layer overlaps with the heat generation portions as viewed in a thickness direction of the heat generation portions and has a greater heat reflectivity than the insulating layer.Type: ApplicationFiled: February 20, 2019Publication date: August 29, 2019Inventors: Toshihiro Kimura, Akira Fujita, Kazuya Nakakubo, Satoshi Kimoto, Yasuhiro Yoshikawa, Tadashi Yamamoto
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Patent number: 10377099Abstract: A method of manufacturing a pneumatic tire with surface fastener according to the present technology includes, while engaging a surface fastener provided with a plurality of first engaging elements and a sheet-shaped protective member provided with a plurality of second engaging elements that engage with the first engaging elements of the surface fastener, disposing the surface fastener in an unvulcanized tire so that a surface on a side opposite that of a surface on which the engaging elements are provided is closely fitted to an inner surface of the tire, and vulcanizing the unvulcanized tire provided with the surface fastener using a vulcanizer equipped with a vulcanization bladder.Type: GrantFiled: December 5, 2013Date of Patent: August 13, 2019Assignee: The Yokohama Rubber Co., LTD.Inventors: Ayako Joza, Atsushi Tanno, Shiro Ogawa, Akira Fujita
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Publication number: 20190219690Abstract: An outside sensor unit includes an outside sensor, a main bracket, a support bracket, a rotation device, and a position adjustment device. The outside sensor detects the outside of a vehicle. The main bracket is attached to a vehicle body. The support bracket supports the outside sensor and is attached to the main bracket. The rotation device has a rotation axis line which is substantially parallel to a roll axis of the vehicle and connects the support bracket and the main bracket together rotatably around the rotation axis line. The position adjustment device is capable of adjusting the relative rotation position between the support bracket and the main bracket around the rotation axis line.Type: ApplicationFiled: January 8, 2019Publication date: July 18, 2019Inventors: Akira Fujita, Takato Watanabe, Yoshitaka Katashima
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Publication number: 20190219689Abstract: An outside sensor unit includes an outside sensor, a main bracket, a support bracket, and a cover member. The main bracket is attached to a vehicle body. The support bracket supports the outside sensor and is attached to the main bracket rotatably adjustably. The cover member covers an outer circumference in an outside detection direction of the outside sensor. The main bracket has a base wall that is attached to the support bracket rotatably adjustably and an attachment seat that is arranged at a position which is offset in the outside detection direction of the outside sensor with respect to the base wall. The cover member is attached to the attachment seat.Type: ApplicationFiled: January 8, 2019Publication date: July 18, 2019Inventors: Akira Fujita, Takato Watanabe
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Publication number: 20190137810Abstract: There are provided an apparatus and a method of manufacturing the apparatus. The apparatus includes: a plate-shaped base; a cover plate; and a curable resin adhering the plate-shaped base and the cover plate together. At least one of the plate-shaped base and the cover plate includes a light-shielding member covering a peripheral part of the at least one of the plate-shaped base and the cover plate. In an area which is shielded by the light-shielding member, a part of the curable resin at a side of an inner edge of the light shielding member is lower in one of an elastic modulus, a curing degree, and an adhesion strength than another part of the curable resin at a side of an outer edge of the light shielding member.Type: ApplicationFiled: December 27, 2018Publication date: May 9, 2019Applicant: Tianma Japan, Ltd.Inventors: Hitoshi Yoshida, Futoshi Nakanishi, Akira Fujita
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Publication number: 20190139930Abstract: Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having predetermined crystal transformation characteristics defined by an XRD analysis, and after a sintering treatment, excellent electrical conductivity and thermal conductivity can be stably obtained; and a die bonding method using the conductive paste. Disclosed is a conductive paste which includes silver particles having a volume average particle size of 0.1 to 30 ?m as a sinterable conductive material, and a dispersing medium for making a paste-like form, and in which when the integrated intensity of the peak at 2?=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis before a sintering treatment of the silver particles is designated as S1, and the integrated intensity of the peak at 2?=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis after a sintering treatment (250° C.Type: ApplicationFiled: October 10, 2017Publication date: May 9, 2019Inventors: Shigeo HORI, Hirohiko FURUI, Akira FUJITA
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Publication number: 20190129219Abstract: A panel module includes a bonding resin layer between a first main face of a first substrate and a second main face of second substrate, and a bond made of cured adhesive. At least a part of an outer end face of the bonding resin layer is located inner than an outer end face of the first substrate and an outer end face of the second substrate. The bond has a stronger bonding force and a higher elasticity than the bonding resin layer. The bond is attached to a first region of the first main face and a second region of the second main face in an area outer than the bonding resin layer. The bond is attached to a third region of the outer end face of the second substrate and a fourth region of the first main face.Type: ApplicationFiled: November 1, 2018Publication date: May 2, 2019Applicant: Tianma Japan, Ltd.Inventors: Akira FUJITA, Akira SUZUKI, Yoshiro KITAGAWA