Abstract: As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of an electrode pad of a TEG to facilitate the evaluation of electrical characteristics. According to the present invention, the above described problem can be solved by arranging a plurality of probes in a fan shape or manufacturing the probes with micro electro mechanical systems (MEMS) technology.

Abstract: An engine system includes a combustion chamber including a cylinder formed in an engine and a piston configured to reciprocate inside the cylinder, a spark plug disposed in a ceiling part of the combustion chamber, and a water injection device configured to inject water into the combustion chamber through a plurality of nozzle holes facing the inside of the combustion chamber. The piston has a cavity in an upper surface thereof. The water injection device injects water into the cavity in a compression stroke at a timing when an extension of axes of at least some of the nozzle holes intersects the cavity. The cavity has a bottom part where the water injected by the water injection device collides, and a raising part configured to raise the water spreading along the bottom part toward the water injection device.

Abstract: A structure of a combustion chamber applied to an engine provided with a piston that reciprocates inside a cylinder, and a fuel supply system that supplies fuel to the combustion chamber defined by the cylinder and the piston, mixture gas of fuel from the fuel supply system and air combusting inside the combustion chamber, is provided. The structure includes a first heat insulating layer covering at least a part of a combustion chamber wall surface defining the combustion chamber and made of a material with a lower thermal conductivity than the combustion chamber wall surface, and a second heat insulating layer covering the first heat insulating layer and facing toward the combustion chamber, a thermal diffusivity of the second heat insulating layer being larger than the thermal diffusivity of the first heat insulating layer. The second heat insulating layer has a thickness less than the first heat insulating layer.

Abstract: As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of the electrode pads of a TEG so as to facilitate the evaluation of electrical characteristics. According to a method for manufacturing a semiconductor device of the present invention, the above-described problems can be solved by providing a layout of a TEG electrode pad corresponding to a plurality of probes arranged in a fan shape or probes manufactured by Micro Electro Mechanical Systems (MEMS) technology.

Abstract: As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of an electrode pad of a TEG to facilitate the evaluation of electrical characteristics. According to the present invention, the above described problem can be solved by arranging a plurality of probes in a fan shape or manufacturing the probes with micro electro mechanical systems (MEMS) technology.

Abstract: As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of the electrode pads of a TEG so as to facilitate the evaluation of electrical characteristics. According to an evaluation apparatus for a semiconductor device of the present invention, the above described problems can be solved by providing a plurality of probes arranged in a fan shape or probes manufactured by Micro Electro Mechanical Systems (MEMS) technology.

Abstract: An engine system includes a combustion chamber including a cylinder formed in an engine and a piston configured to reciprocate inside the cylinder, a spark plug disposed in a ceiling part of the combustion chamber, and a water injection device configured to inject water into the combustion chamber through a plurality of nozzle holes facing the inside of the combustion chamber. The piston has a cavity in an upper surface thereof. The water injection device injects water into the cavity in a compression stroke at a timing when an extension of axes of at least some of the nozzle holes intersects the cavity. The cavity has a bottom part where the water injected by the water injection device collides, and a raising part configured to raise the water spreading along the bottom part toward the water injection device.

Abstract: An object of the present invention relates to detecting a signal caused by a faulty point part of which the identification has been difficult with conventional EBAC. In an embodiment of the present invention, at least one probe is brought into contact with a sample on which a circuit is formed, the sample is scanned with a charged particle beam while power is supplied via the probe to the circuit identified by a contact of the probe, and a change in resistance value of a faulty point heated locally is measured via the probe. According to the present invention, even a signal caused by a high-resistance faulty point or a faulty point embedded in the sample can be easily detected.

Abstract: A fuel injection valve is provided for a ceiling portion of a cylinder head. A tip of an ignition electrode is arranged in the vicinity of an injection tip of the fuel injection valve. A recess is provided for the ceiling portion. A center of a cavity is shifted with respect to a bore center of the cylinder. In a vertical cross-section of the inside of a combustion chamber taken along a plane passing through the injection tip of the fuel injection valve and the tip of the ignition electrode, a distance from the injection tip to a wall surface of the cavity at a side at which the ignition electrode is provided is longer than a distance from the injection tip to a wall surface of the cavity at an opposite side.

Abstract: A fuel injection valve is caused to inject fuel in a latter half of a compression stroke in such a manner that a fuel concentration immediately before start of combustion is higher in a middle portion of a combustion chamber than in an outer peripheral portion thereof in a low load range where the engine load is lower than a predetermined set reference load. An intake valve driving device is controlled in such a manner that an intake valve closing timing in the low load range is advanced on a retard side with respect to an intake bottom dead center in a case where the engine speed is high, as compared with a case where the engine speed is low, and intake air within a cylinder is blown back toward an intake port at least in a range where the engine speed is low.

Abstract: An object of the present invention relates to detecting a signal caused by a faulty point part of which the identification has been difficult with conventional EBAC. In an embodiment of the present invention, at least one probe is brought into contact with a sample on which a circuit is formed, the sample is scanned with a charged particle beam while power is supplied via the probe to the circuit identified by a contact of the probe, and a change in resistance value of a faulty point heated locally is measured via the probe. According to the present invention, even a signal caused by a high-resistance faulty point or a faulty point embedded in the sample can be easily detected.

Abstract: A fuel injection valve is caused to inject fuel in a latter half of a compression stroke in such a manner that a fuel concentration immediately before start of combustion is higher in a middle portion of a combustion chamber than in an outer peripheral portion thereof in a low load range where the engine load is lower than a predetermined set reference load. An intake valve driving device is controlled in such a manner that an intake valve closing timing in the low load range is advanced on a retard side with respect to an intake bottom dead center in a case where the engine speed is high, as compared with a case where the engine speed is low, and intake air within a cylinder is blown back toward an intake port at least in a range where the engine speed is low.

Abstract: A fuel injection valve is provided for a ceiling portion of a cylinder head. A tip of an ignition electrode is arranged in the vicinity of an injection tip of the fuel injection valve. A recess is provided for the ceiling portion. A center of a cavity is shifted with respect to a bore center of the cylinder. In a vertical cross-section of the inside of a combustion chamber taken along a plane passing through the injection tip of the fuel injection valve and the tip of the ignition electrode, a distance from the injection tip to a wall surface of the cavity at a side at which the ignition electrode is provided is longer than a distance from the injection tip to a wall surface of the cavity at an opposite side.

Abstract: Provided is an exhaust system of a multi-cylinder engine capable of increasing the air-intake and thereby increasing the engine output with a simple configuration. The exhaust system is provided with low velocity-side passages 54, high velocity-side passages 53, a low velocity-side collection part 56, a high velocity-side collection part 57, and a flow passage area variable valve 58 capable of changing the flow passage area of the respective high velocity-side passages 53.

Abstract: Grid structured data arranged for a spherical structured grid constituted by combining two component structured grids are visualized by using computer graphics technology. Coordinate conversion means 31 converts grid point coordinates of first and second component structured grids (referred to as N and E systems, respectively), represented by specific regions in spherical coordinates, into local xyz coordinates used in computer graphics. Filter means 32 obtains first and second graphic objects for the N and E systems, respectively. Using E system rotation and N and E system synthesis means 33, the second graphic object for the E system is rotated by 90 degrees with respect to an x axis of a first local xyz coordinate system, and is then rotated by 180 degrees with respect to a z axis of the first local xyz coordinate system, thereby obtaining the rotated second graphic object for the E system, and then, both of the graphic objects are synthesized.

Abstract: Provided is an exhaust system of a multi-cylinder engine capable of increasing the air-intake and thereby increasing the engine output with a simple configuration. The exhaust system is provided with low velocity-side passages 54, high velocity-side passages 53, a low velocity-side collection part 56, a high velocity-side collection part 57, and a flow passage area variable valve 58 capable of changing the flow passage area of the respective high velocity-side passages 53.

Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Abstract: Grid structured data arranged for a spherical structured grid constituted by combining two component structured grids are visualized by using computer graphics technology. Coordinate conversion means 31 converts grid point coordinates of first and second component structured grids (referred to as N and E systems, respectively), represented by specific regions in spherical coordinates, into local xyz coordinates used in computer graphics. Filter means 32 obtains first and second graphic objects for the N and E systems, respectively. Using E system rotation and N and E system synthesis means 33, the second graphic object for the E system is rotated by 90 degrees with respect to an x axis of a first local xyz coordinate system, and is then rotated by 180 degrees with respect to a z axis of the first local xyz coordinate system, thereby obtaining the rotated second graphic object for the E system, and then, both of the graphic objects are synthesized.

Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250 ° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.