Patents by Inventor Akira Kaneko

Akira Kaneko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967584
    Abstract: A power semiconductor device includes an insulating substrate on which a first conductor layer is arranged on one surface, a first conductor that is connected to the first conductor layer via a first connecting material, and a semiconductor element that is connected to the first conductor via a first connecting material. When viewed from a direction perpendicular to an electrode surface of the semiconductor element, the first conductor includes a peripheral portion formed larger than the semiconductor element. A first recess is formed in the peripheral portion so that a thickness of the first connecting material becomes thicker than other portions.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: April 23, 2024
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Hiromi Shimazu, Yujiro Kaneko, Toru Kato, Akira Matsushita, Eiichi Ide
  • Patent number: 11961687
    Abstract: A push switch includes a case having a housing space with an upper opening, fixed contacts provided at a bottom of the housing space in the case, a movable contact member having a dome-shaped member, the movable contact member being disposed in the housing space, and having a central portion that is brought into contact with the fixed contacts by inverting the movable contact member in response to the movable contact member being pushed by an operator, and a pushing member is disposed above the movable contact member, and the pushing member is configured to push the movable contact portion directly or through other portions upon being pushed by the operator. The pushing member pushes a portion being situated outside of a central portion of the movable contact member directly or through other portions.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: April 16, 2024
    Assignee: ALPS ALPINE CO., LTD.
    Inventors: Akira Kaneko, Katsutoshi Usui, Hiroshi Ohara
  • Patent number: 11961780
    Abstract: A semiconductor module includes a semiconductor device that includes first and second fin bases having first and second connecting portions and a resin for sealing the outer peripheral side surfaces of first to fourth conductors, and a flow path forming body connected to the first and second connecting portions of the first and second fin bases. A first elastically deformed portion, which is elastically deformed, is provided such that a distance in a thickness direction between the outer peripheral ends of the first and second connecting portions becomes smaller than a distance in a thickness direction between intermediate portions of the first and second connecting portions. The resin is filled between the first and second connecting portions of the first and second fin bases are filled with the resin therebetween.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: April 16, 2024
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Nobutake Tsuyuno, Akira Matsushita, Yujiro Kaneko
  • Patent number: 11921336
    Abstract: An optical fiber protective unit includes: a reticulated tube; and a tubular member that is inserted through the reticulated tube and that is configured to accommodate a plurality of optical fibers. The reticulated tube is disposed on an outer periphery of the tubular member in a state folded in a longitudinal direction. Both end parts of the reticulated tube are located on the outer periphery of the tubular member.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: March 5, 2024
    Assignee: Fujikura Ltd.
    Inventors: Go Taki, Masayuki Ishioka, Mizuki Isaji, Tomoaki Kaji, Soichiro Kaneko, Koji Tomikawa, Akira Namazue, Ken Osato
  • Publication number: 20240064955
    Abstract: A semiconductor device includes a substrate, a lower electrode provided over the substrate, a capacitive insulating film, and an upper electrode provided over the lower electrode, wherein the lower electrode has an upper portion and a lower portion, and at a boundary between the upper portion and the lower portion, the diameter of the upper portion is smaller than the diameter of the lower portion.
    Type: Application
    Filed: June 21, 2023
    Publication date: February 22, 2024
    Inventor: Akira Kaneko
  • Publication number: 20230366641
    Abstract: A plate-stacked heat exchanger is proposed which exchanges heat with high heat exchange efficiency in flow paths each including an internal space bulging outward between two heat transfer plates. A flow path forming portion includes a plurality of flow path bulging portions that bulges outward of a heat exchanger plate and forms heat exchange flow paths of a first heating medium therein, and a header portion includes a communication hole communicating with the header portion of an adjacent heat exchanger plate, and a flow path forming portion-side expanded portion expanding from the communication hole toward the flow path forming portion, and the flow path forming portion-side expanded portion communicates with the plurality of heat exchange flow paths. Consequently, heat can be exchanged in a greater width. Therefore, a high heat exchange rate can be obtained.
    Type: Application
    Filed: August 24, 2021
    Publication date: November 16, 2023
    Inventor: Akira KANEKO
  • Publication number: 20230272977
    Abstract: A heat exchanger includes a pair of headers, and a plurality of heat exchanger tubes stacked between the pair of headers. Each of the headers includes header members each having a gutter-shaped cross section and including an open part and a bottom part. The header members are stacked in a staking direction of the heat exchanger tubes in such a way that the bottom part of one header member closes the open part of another header member. A fitted hole into which an end of a heat exchanger tube is fitted is provided in a side part of the header member.
    Type: Application
    Filed: August 24, 2021
    Publication date: August 31, 2023
    Applicant: SANDEN CORPORATION
    Inventors: Akira Kaneko, Naotaka Iwasawa, Akihiro Fujiwara
  • Publication number: 20230269930
    Abstract: An apparatus includes: a substrate; a plurality of pillar-shaped bottom electrodes provided over the substrate; and an upper electrode covering side and top surfaces of the pillar-shaped bottom electrodes with an intervening capacitor insulating film therebetween. The pillar-shaped bottom electrodes have at least an upper portion and a lower portion. The diameter of the upper portion is smaller than the diameter of the lower portion.
    Type: Application
    Filed: May 2, 2023
    Publication date: August 24, 2023
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Akira Kaneko, Keisuke Otsuka
  • Publication number: 20230259856
    Abstract: Provided is a project success probability calculation system including a performance influencing pre-element holder that holds a performance influencing pre-element which is a pre-element that influences the performance of a project, a questioner that outputs a question for associating a performance pre-status value with the performance influencing pre-element assuming a specific project in which the project is specifically specified and prompts an input, a probability distribution derivation function holder that holds a probability distribution derivation function which is a function for calculating a probability distribution of success of the specific project using the performance pre-status value associated with the performance influencing pre-element, a success probability distribution calculator that calculates a success probability distribution of the specific project, based on the performance pre-status value obtained by the input and the held probability distribution derivation function, and a success
    Type: Application
    Filed: April 24, 2023
    Publication date: August 17, 2023
    Applicant: MANAGEMENT SOLUTIONS CO., LTD.
    Inventors: Shinya TAKAHASHI, Toshinari GOTO, Akira KANEKO, Ryo HASEGAWA, Yi ZHANG
  • Patent number: 11696431
    Abstract: A semiconductor device includes a substrate, a lower electrode provided over the substrate, a capacitive insulating film, and an upper electrode provided over the lower electrode, wherein the lower electrode has an upper portion and a lower portion, and at a boundary between the upper portion and the lower portion, the diameter of the upper portion is smaller than the diameter of the lower portion.
    Type: Grant
    Filed: December 31, 2021
    Date of Patent: July 4, 2023
    Assignee: Micron Technology, Inc.
    Inventor: Akira Kaneko
  • Publication number: 20230153759
    Abstract: A project management organization diagnosis DB system that diagnoses a proper operability which is information indicating whether a project management organization, which is an organization to manage a project, is properly installed and operated during the progress of the project, and provides a database storing a result of the diagnosis.
    Type: Application
    Filed: January 6, 2023
    Publication date: May 18, 2023
    Applicant: MANAGEMENT SOLUTIONS CO., LTD.
    Inventors: Shinya TAKAHASHI, Toshinari GOTO, Ryo HASEGAWA, Yi ZHANG, Akira KANEKO
  • Patent number: 11647624
    Abstract: An apparatus includes: a substrate; a plurality of pillar-shaped bottom electrodes provided over the substrate; and an upper electrode covering side and top surfaces of the pillar-shaped bottom electrodes with an intervening capacitor insulating film therebetween; wherein the pillar-shaped bottom electrodes have at least an upper portion and a lower portion, and the diameter of the upper portion is smaller than the diameter of the lower portion.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: May 9, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Akira Kaneko, Keisuke Otsuka
  • Patent number: 11607926
    Abstract: Provided is a vehicle air-conditioning system configured so that air-cooling/heating can be efficiently performed. The system (10, 20, 30, 40) includes a vapor compression heat pump unit (HP) having at least a compressor (CP), a condenser (CD), an expansion mechanism (EX), and an evaporator (EV) on a refrigerant circuit (RC), a brine flow path network (BC) having multiple pumps (PC, PH) and multiple flow path switching valves (TV1 to TV8, V1 to V9), and a vehicle indoor air-conditioning unit (AC) having an air duct (AD) and multiple vehicle indoor heat exchangers (HXC1, HXC2) arranged in series in the air duct. Upon actuation in an air-cooling mode or an air-heating mode accompanied by neither dehumidification nor defrosting, brine flows in series in the multiple vehicle indoor heat exchangers.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: March 21, 2023
    Assignee: SANDEN HOLDINGS CORPORATION
    Inventor: Akira Kaneko
  • Publication number: 20230055168
    Abstract: Provided is a project management system including a process identifying information holding unit that holds process identifying information for identifying processes of a project, an influencing circumstantial situation information holding unit that holds a plurality of pieces of influencing circumstantial situation information that is information indicating an influencing circumstance being a circumstance influencing progress of the project recognized in the processes of the project, a per-process influencing circumstantial situation information input reception unit that receives per-process influencing circumstantial situation information that is information associating the influencing circumstantial situation information being held and the process identifying information of the process in which the circumstantial situation indicated by the influencing circumstantial situation information is recognized, and a graphical output unit that outputs graphically the per-process influencing circumstantial situation
    Type: Application
    Filed: August 31, 2022
    Publication date: February 23, 2023
    Applicant: MANAGEMENT SOLUTIONS CO., LTD.
    Inventor: Akira KANEKO
  • Patent number: 11459019
    Abstract: A vehicle steering apparatus, including: a steering column; a link member; an actuator including: a vehicle body side engaging portion, and a link side engaging portion, and when operated, the actuator changing a spacing between the vehicle body side engaging portion and the link side engaging portion, and swinging the steering column between the first position and the second position; a steering support that supports the steering column from the vehicle lower side in a state in which the steering column is disposed at the first position; and a clamp member provided at the link member, the clamp member being engaged with the steering support in the state in which the steering column is disposed at the first position, and the clamp member moving away from the steering support when the steering column is to swing from the first position toward the second position.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: October 4, 2022
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Masahiro Ohrui, Akira Kaneko, Akihiro Harada
  • Publication number: 20220189960
    Abstract: An apparatus includes: a substrate; a plurality of pillar-shaped bottom electrodes provided over the substrate; and an upper electrode covering side and top surfaces of the pillar-shaped bottom electrodes with an intervening capacitor insulating film therebetween; wherein the pillar-shaped bottom electrodes have at least an upper portion and a lower portion, and the diameter of the upper portion is smaller than the diameter of the lower portion.
    Type: Application
    Filed: December 15, 2020
    Publication date: June 16, 2022
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Akira Kaneko, Keisuke Otsuka
  • Publication number: 20220122985
    Abstract: A semiconductor device includes a substrate, a lower electrode provided over the substrate, a capacitive insulating film, and an upper electrode provided over the lower electrode, wherein the lower electrode has an upper portion and a lower portion, and at a boundary between the upper portion and the lower portion, the diameter of the upper portion is smaller than the diameter of the lower portion.
    Type: Application
    Filed: December 31, 2021
    Publication date: April 21, 2022
    Applicant: MICRON TECHNOLOGY, INC.
    Inventor: Akira Kaneko
  • Patent number: 11227866
    Abstract: A semiconductor device includes a substrate, a lower electrode provided over the substrate, a capacitive insulating film, and an upper electrode provided over the lower electrode, wherein the lower electrode has an upper portion and a lower portion, and at a boundary between the upper portion and the lower portion, the diameter of the upper portion is smaller than the diameter of the lower portion.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: January 18, 2022
    Assignee: MICRON TECHNOLOGY, INC.
    Inventor: Akira Kaneko
  • Publication number: 20210394815
    Abstract: A vehicle steering apparatus, including: a steering column; a link member; an actuator including: a vehicle body side engaging portion, and a link side engaging portion, and when operated, the actuator changing a spacing between the vehicle body side engaging portion and the link side engaging portion, and swinging the steering column between the first position and the second position; a steering support that supports the steering column from the vehicle lower side in a state in which the steering column is disposed at the first position; and a clamp member provided at the link member, the clamp member being engaged with the steering support in the state in which the steering column is disposed at the first position, and the clamp member moving away from the steering support when the steering column is to swing from the first position toward the second position.
    Type: Application
    Filed: June 7, 2021
    Publication date: December 23, 2021
    Inventors: Masahiro Ohrui, Akira Kaneko, Akihiro Harada
  • Publication number: 20210335558
    Abstract: A push switch includes a case having a housing space with an upper opening, fixed contacts provided at a bottom of the housing space in the case, a movable contact member having a dome-shaped member, the movable contact member being disposed in the housing space, and having a central portion that is brought into contact with the fixed contacts by inverting the movable contact member in response to the movable contact member being pushed by an operator, and a pushing member is disposed above the movable contact member, and the pushing member is configured to push the movable contact portion directly or through other portions upon being pushed by the operator. The pushing member pushes a portion being situated outside of a central portion of the movable contact member directly or through other portions.
    Type: Application
    Filed: April 20, 2021
    Publication date: October 28, 2021
    Inventors: Akira KANEKO, Katsutoshi USUI, Hiroshi OHARA