Patents by Inventor Akira Mikumo

Akira Mikumo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200168435
    Abstract: A showerhead provided in a chamber of a semiconductor manufacturing apparatus and facing a wafer holder includes: a disk-shaped member having a plurality of through holes penetrating the disk-shaped member in a direction of a thickness thereof; a high-frequency conductor embedded in the disk-shaped member; a hole provided in the disk-shaped member, extending in the direction of the thickness of the disk-shaped member and having a bottom exposing a portion of the conductor; an electrode terminal portion disposed in the hole and having a base portion electrically connected to the conductor and a columnar portion provided on the base portion; a cylindrical member having a first end portion fitted outside the columnar portion and facing the conductor and a second end portion facing away from the first end portion, and a sealing member surrounding the first end portion.
    Type: Application
    Filed: June 25, 2018
    Publication date: May 28, 2020
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Koichi KIMURA, Akira MIKUMO
  • Publication number: 20190051543
    Abstract: A wafer holder includes a mounting table that has a mounting surface for a workpiece at a top, a supporting member that supports the mounting table from a lower side, a first cylindrical member one end of which is joined hermetically to a lower surface of the mounting table, and a second cylindrical member that is provided inside the first cylindrical member and one end of which is joined hermetically to the lower surface of the mounting table.
    Type: Application
    Filed: October 17, 2017
    Publication date: February 14, 2019
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Koichi KIMURA, Akira MIKUMO
  • Publication number: 20180174878
    Abstract: A wafer holding unit includes a disk-shaped ceramic substrate having a wafer mounting surface on an upper surface of the substrate, an RF electrode, for example, embedded within the substrate, a metal terminal inserted from a lower surface of the substrate, and a connecting terminal which electrically connects the RF electrode and the metal terminal with each other. The connecting terminal is constituted by a ceramic member and a metal layer. The ceramic member is made of the same material as the substrate and preferably has a truncated conical shape. The metal layer covers a surface of the ceramic member. An upper end of the metal layer is connected to the RF electrode, while a lower end of the metal layer is connected to the metal terminal with a metal member interposed therebetween.
    Type: Application
    Filed: July 1, 2016
    Publication date: June 21, 2018
    Inventors: Koichi KIMURA, Shigenobu SAKITA, Kenji SHINMA, Daisuke SHIMAO, Katsuhiro ITAKURA, Masuhiro NATSUHARA, Akira MIKUMO
  • Publication number: 20110139399
    Abstract: A heater unit has excellent uniform heat properties in a wafer placement surface, and is capable of rapid temperature increase and rapid cooling, also has high rigidity. A heating and cooling device that includes the heater unit is used as a manufacturing or inspection apparatus and is used for work with glass substrates or semiconductor substrates for flat panel displays. The heater comprises a first uniform heat plate having a placement surface on which a substrate is placed, a second uniform heat plate for supporting the first uniform heat plate, and at least one layer of a insulated resistance heating element provided between the first uniform heat plate and the second uniform heat plate. The first uniform heat plate and the second uniform heat plate have a differing thermal conductivity and differing Young's modulus.
    Type: Application
    Filed: November 24, 2010
    Publication date: June 16, 2011
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Katsuhiro ITAKURA, Keiji KITABAYASHI, Akira MIKUMO, Hirohiko NAKATA
  • Publication number: 20100044364
    Abstract: A heater unit that much improves accuracy in thermal uniformity of an object of heating during cooling, particularly rapid cooling, is provided. The heater unit in accordance with the present invention includes a heater substrate for mounting an object of heating and performing heat treatment thereon, and a cooling module for cooling the heater substrate, and between said heater substrate and the cooling module, an intervening body is arranged. Utilizing deformability of the intervening body, ratio of a non-contact portion can be reduced than when the intervening body is not provided, and temperature uniformity of the heater substrate at the time of cooling can be improved.
    Type: Application
    Filed: November 2, 2009
    Publication date: February 25, 2010
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Akira MIKUMO, Tomoyuki Awazu, Masuhiro Matsuhara, Hirohiko Nakata
  • Patent number: 7554059
    Abstract: A ceramic heater attaining more uniform temperature distribution from the start to the end of cooling is provided. Further, in a cooling module used for cooling the heater, liquid leakage during use is prevented, degradation in cooling capability is prevented and the performance is maintained for a long period of use, and the manufacturing cost of the module is decreased. The ceramic heater includes a ceramic heater body and a cooling module cooling the heater body, and the cooling module has a structure formed by arranging a pipe in a trench formed in a plate-shaped structure.
    Type: Grant
    Filed: September 12, 2006
    Date of Patent: June 30, 2009
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tomoyuki Awazu, Akira Mikumo, Masuhiro Natsuhara, Hirohiko Nakata
  • Publication number: 20070215602
    Abstract: A heating and cooling module wherein the calorific value can be increased in a heater for mounting and heating a semiconductor chip, and the heating and cooling module is not damaged when the semiconductor chip is rapidly heated and cooled. The heating and cooling module of the includes a ceramic heater for mounting and heating a treated object, a cooling mechanism for cooling the ceramic heater, and a holder between the ceramic heater and the cooling mechanism, wherein the ceramic heater is an aluminum nitride heater having one or more internally disposed heating element layers. An intermediate layer is preferably inserted between the ceramic heater and the holder. An intermediate layer is also preferably inserted between the holder and the cooling mechanism.
    Type: Application
    Filed: March 12, 2007
    Publication date: September 20, 2007
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Masuhiro Natsuhara, Tomoyuki Awazu, Hirohiko Nakata, Akira Mikumo
  • Publication number: 20070069174
    Abstract: The present invention provides a composite having superior reliability and superior binding strength with respect to films formed on substrates by aerosol methods, and also provides a semiconductor manufacturing devices susceptor and a power module substrate. In the composite of the present invention, a film formed by an aerosol method is provided on a surface of a composite formed from a plurality of metals. Alternatively, a film formed by an aerosol method may be provided on the surface of a composite formed from a metal and a ceramic. The composite preferably has a thermal conductivity of 100 W/mK or greater, and the film formed by the aerosol method preferably has a thermal conductivity of 1 W/mK or greater.
    Type: Application
    Filed: August 25, 2006
    Publication date: March 29, 2007
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Masuhiro Natsuhara, Hirohiko Nakata, Tomoyuki Awazu, Akira Mikumo
  • Publication number: 20070062929
    Abstract: A heater unit that much improves accuracy in thermal uniformity of an object of heating during cooling, particularly rapid cooling, is provided. The heater unit in accordance with the present invention includes a heater substrate for mounting an object of heating and performing heat treatment thereon, and a cooling module for cooling the heater substrate, and between said heater substrate and the cooling module, an intervening body is arranged. Utilizing deformability of the intervening body, ratio of a non-contact portion can be reduced than when the intervening body is not provided, and temperature uniformity of the heater substrate at the time of cooling can be improved.
    Type: Application
    Filed: August 22, 2006
    Publication date: March 22, 2007
    Inventors: Akira Mikumo, Tomoyuki Awazu, Masuhiro Natsuhara, Hirohiko Nakata
  • Publication number: 20070056953
    Abstract: A ceramic heater attaining more uniform temperature distribution from the start to the end of cooling is provided. Further, in a cooling module used for cooling the heater, liquid leakage during use is prevented, degradation in cooling capability is prevented and the performance is maintained for a long period of use, and the manufacturing cost of the module is decreased. The ceramic heater includes a ceramic heater body and a cooling module cooling the heater body, and the cooling module has a structure formed by arranging a pipe in a trench formed in a plate-shaped structure.
    Type: Application
    Filed: September 12, 2006
    Publication date: March 15, 2007
    Inventors: Tomoyuki Awazu, Akira Mikumo, Masuhiro Natsuhara, Hirohiko Nakata
  • Publication number: 20070054424
    Abstract: A semiconductor heater holder for setting a heater for heating a semiconductor, having an opening, wherein the heat capacity of the semiconductor heater holder is not more than 1.5 times the heat capacity of the heater, and a semiconductor manufacturing apparatus comprising this semiconductor heater holder.
    Type: Application
    Filed: August 16, 2006
    Publication date: March 8, 2007
    Inventors: Masuhiro Natsuhara, Akira Mikumo, Tomoyuki Awazu, Hirohiko Nakata
  • Publication number: 20070029740
    Abstract: A wafer holding body for placing a semiconductor wafer, a method of manufacturing the same, and an device using the wafer holding body are provided, wherein a channel is formed in the wafer holding body.
    Type: Application
    Filed: July 7, 2006
    Publication date: February 8, 2007
    Inventors: Masuhiro Natsuhara, Katsuhiro Itakura, Tomoyuki Awazu, Hirohiko Nakata, Akira Mikumo
  • Publication number: 20060102613
    Abstract: A heating body and a device equipped with the same provide greater uniformity in temperature distribution between the start of heating and the end of cooling. A semiconductor fabrication device heating body includes a base having a heating surface upon which an object is mounted or positioned at a fixed distance away and is heated, and a resistance heating body. All or part of the base of the heating body has a thermal capacity per unit volume of at least 2.0 J/K·cm3 and a thermal conductivity of at least 50 W/mK.
    Type: Application
    Filed: October 20, 2005
    Publication date: May 18, 2006
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Kuibira, Akira Mikumo, Masuhiro Natsuhara, Hirohiko Nakata
  • Patent number: 6777376
    Abstract: In order to provide a superconducting wire that has a high critical current value, has no defects such as bulges, and has high mechanical strength, an oxide superconducting material (1) is covered, and ceramic particles or fibers (3) are buried in the surface of a covering (2) made of metal
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: August 17, 2004
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tetsuyuki Kaneko, Munetsugu Ueyama, Akira Mikumo, Naoki Ayai, Shin-ichi Kobayasi
  • Patent number: 6493925
    Abstract: Powder including at least a superconducting phase is degassed (step S1). After the powder is filled in a silver pipe (step S2), the silver pipe is degassed at a high temperature (step S3). After a plurality of single-core wires are inserted into another silver pipe to attain a multi-core structure, the silver pipe is degassed at a high temperature (step S5). The silver pipe is sealed under a reduced pressure (step S6). Therefore, even when a multi-core superconducting wire is manufactured, a manufacturing method of a superconducting wire capable of preventing swelling of the wire caused by a residual gaseous component can be obtained.
    Type: Grant
    Filed: September 19, 2000
    Date of Patent: December 17, 2002
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tetsuyuki Kaneko, Munetsugu Ueyama, Akira Mikumo, Naoki Ayai, Shin-ichi Kobayashi
  • Patent number: 5891585
    Abstract: An Nb.sub.3 Al multi-filamentary superconducting wire capable of realizing both stabilization of a superconducting state and increase in capacity is provided. The Nb.sub.3 Al multi-filamentary superconducting wire includes a core formed of copper or copper alloy and located at the center of the wire; a multi-filamentary superconductor layer located around the core and having filaments containing Nb and Al as constituent elements embedded in a matrix formed of copper or copper alloy; and a high resistance layer located around the multi-filamentary superconductor layer, and is characterized in that a sectional area of the core is at least 15% of the total sectional area of the core and the matrix and that the core and the matrix are formed of copper or copper alloy of at least 99.9% purity.
    Type: Grant
    Filed: November 1, 1996
    Date of Patent: April 6, 1999
    Assignees: Sumitomo Elkectric Industries, Ltd., Japan Atomic Energy Research Institute
    Inventors: Naoki Ayai, Yuichi Yamada, Akira Mikumo, Kenichi Takahashi, Norikiyo Koizumi, Toshinari Ando, Makoto Sugimoto, Hiroshi Tsuji
  • Patent number: 5779864
    Abstract: Disclosed herein are methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire.Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.
    Type: Grant
    Filed: January 28, 1997
    Date of Patent: July 14, 1998
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Mikumo, Kenichi Takahashi, Masanobu Koganeya
  • Patent number: 5602488
    Abstract: Methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire.Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.
    Type: Grant
    Filed: January 22, 1996
    Date of Patent: February 11, 1997
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Mikumo, Kenichi Takahashi, Masanobu Koganeya
  • Patent number: 5507924
    Abstract: Disclosed herein are methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire.Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.
    Type: Grant
    Filed: January 31, 1994
    Date of Patent: April 16, 1996
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Mikumo, Kenichi Takahashi, Masanobu Koganeya