Patents by Inventor Akira Mikumo

Akira Mikumo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070029740
    Abstract: A wafer holding body for placing a semiconductor wafer, a method of manufacturing the same, and an device using the wafer holding body are provided, wherein a channel is formed in the wafer holding body.
    Type: Application
    Filed: July 7, 2006
    Publication date: February 8, 2007
    Inventors: Masuhiro Natsuhara, Katsuhiro Itakura, Tomoyuki Awazu, Hirohiko Nakata, Akira Mikumo
  • Publication number: 20060102613
    Abstract: A heating body and a device equipped with the same provide greater uniformity in temperature distribution between the start of heating and the end of cooling. A semiconductor fabrication device heating body includes a base having a heating surface upon which an object is mounted or positioned at a fixed distance away and is heated, and a resistance heating body. All or part of the base of the heating body has a thermal capacity per unit volume of at least 2.0 J/K·cm3 and a thermal conductivity of at least 50 W/mK.
    Type: Application
    Filed: October 20, 2005
    Publication date: May 18, 2006
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Kuibira, Akira Mikumo, Masuhiro Natsuhara, Hirohiko Nakata
  • Patent number: 6777376
    Abstract: In order to provide a superconducting wire that has a high critical current value, has no defects such as bulges, and has high mechanical strength, an oxide superconducting material (1) is covered, and ceramic particles or fibers (3) are buried in the surface of a covering (2) made of metal
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: August 17, 2004
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tetsuyuki Kaneko, Munetsugu Ueyama, Akira Mikumo, Naoki Ayai, Shin-ichi Kobayasi
  • Patent number: 6493925
    Abstract: Powder including at least a superconducting phase is degassed (step S1). After the powder is filled in a silver pipe (step S2), the silver pipe is degassed at a high temperature (step S3). After a plurality of single-core wires are inserted into another silver pipe to attain a multi-core structure, the silver pipe is degassed at a high temperature (step S5). The silver pipe is sealed under a reduced pressure (step S6). Therefore, even when a multi-core superconducting wire is manufactured, a manufacturing method of a superconducting wire capable of preventing swelling of the wire caused by a residual gaseous component can be obtained.
    Type: Grant
    Filed: September 19, 2000
    Date of Patent: December 17, 2002
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tetsuyuki Kaneko, Munetsugu Ueyama, Akira Mikumo, Naoki Ayai, Shin-ichi Kobayashi
  • Patent number: 5891585
    Abstract: An Nb.sub.3 Al multi-filamentary superconducting wire capable of realizing both stabilization of a superconducting state and increase in capacity is provided. The Nb.sub.3 Al multi-filamentary superconducting wire includes a core formed of copper or copper alloy and located at the center of the wire; a multi-filamentary superconductor layer located around the core and having filaments containing Nb and Al as constituent elements embedded in a matrix formed of copper or copper alloy; and a high resistance layer located around the multi-filamentary superconductor layer, and is characterized in that a sectional area of the core is at least 15% of the total sectional area of the core and the matrix and that the core and the matrix are formed of copper or copper alloy of at least 99.9% purity.
    Type: Grant
    Filed: November 1, 1996
    Date of Patent: April 6, 1999
    Assignees: Sumitomo Elkectric Industries, Ltd., Japan Atomic Energy Research Institute
    Inventors: Naoki Ayai, Yuichi Yamada, Akira Mikumo, Kenichi Takahashi, Norikiyo Koizumi, Toshinari Ando, Makoto Sugimoto, Hiroshi Tsuji
  • Patent number: 5779864
    Abstract: Disclosed herein are methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire.Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.
    Type: Grant
    Filed: January 28, 1997
    Date of Patent: July 14, 1998
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Mikumo, Kenichi Takahashi, Masanobu Koganeya
  • Patent number: 5602488
    Abstract: Methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire.Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.
    Type: Grant
    Filed: January 22, 1996
    Date of Patent: February 11, 1997
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Mikumo, Kenichi Takahashi, Masanobu Koganeya
  • Patent number: 5507924
    Abstract: Disclosed herein are methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire.Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.
    Type: Grant
    Filed: January 31, 1994
    Date of Patent: April 16, 1996
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Mikumo, Kenichi Takahashi, Masanobu Koganeya