Abstract: A method of manufacturing a rotor core having a plurality of core members stacked together includes determining weight imbalances for the plurality of core members with respect to a central axis of the rotor core; combining the weight imbalances of the plurality of core members to determine a weight distribution of the rotor core; and displacing the weight imbalances of one or more of the plurality of core members to adjust a position of the weight distribution of the rotor core with respect to the central axis.

Abstract: There is disclosed a method for manufacturing a semiconductor device comprising a semiconductor chip having a connection portion and a wiring circuit board having a connection portion, the respective connection portions being electrically connected to each other, or a semiconductor device comprising a plurality of semiconductor chips having connection portions, the respective connection portions being electrically connected to each other. The connection portions consist of metal.

Abstract: Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.

Abstract: An aspect of the present invention is a resin composition comprising: an acrylic resin; and a curing agent, wherein the acrylic resin is a resin obtained by polymerizing monomer components comprising a first monomer represented by the following formula (1): wherein R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 12 to 30 carbon atoms, and a second monomer copolymerizable with the first monomer and having a reactive group capable of reacting with the curing agent.

Abstract: In the case of a laminated rotor core 10, insertion of permanent magnets 14 and filling of resin 15 into each of magnet insertion holes 13 are performed in order to cancel out a problem of an imbalanced weight estimated from a deviation of lamination thickness in a circumferential direction of a laminated core body 12, and a manufacturing method includes a step of measuring a deviation of lamination thickness in which an imbalanced weight is estimated by measuring the deviation of lamination thickness in the circumferential direction of the laminated core body 12, and a step of balance adjustment in which the insertion of the permanent magnets 14 into each of the magnet insertion holes 13 and the filling of resin 15 into each of the magnet insertion holes 13 are performed in a manner that cancels out a problem of this imbalanced weight.

Abstract: Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.

Abstract: In one aspect, the present invention provides a resin member comprising a copolymer of ethylene and an olefin having 3 or more carbon atoms, and a straight-chain saturated hydrocarbon compound.

Abstract: In one aspect, the present invention is a resin member comprising a copolymer of ethylene and an olefin having 3 or more carbon atoms, a straight-chain saturated hydrocarbon compound, and a gelling agent.

Abstract: A boss-side fastening surface formed in a boss of a flexible externally toothed gear of a strain wave gearing and a shaft-side fastening surface of an output shaft are coaxially fastened with bolts. The boss-side fastening surface is a convex-side fastening surface defined by two symmetrical inclined surfaces that are intersected at a prescribed angle to form a ridge line on a diameter line of the surface. The shaft-side fastening surface is a concave-side fastening surface defined by two symmetrical inclined surfaces that are intersected at a prescribed angle to form a trough line on a diameter line of the surface. The inclination angle of the inclined surfaces is set in the range of 2° to 16°. Transmission torques equal to or larger than those for combined bolt and pin fastening can be secured with bolt-only fastening.

Abstract: A random number generating unit generates random numbers s1, s2, s?1, and s?2. A public keys randomizing unit generates first randomized public keys information obtained by randomizing public keys using the random number s1 and second randomized public keys information obtained by randomizing the public keys using the random number s2. A proxy calculation unit calculates a first commission result by using a secret key and calculates a second commission result by using the secret key. A verification unit calculates a first verification value by using the random number s2, calculates a second verification value by using the random number s1, and verifies whether or not the first verification value and the second verification value coincide with each other. A common key calculation unit calculates a common key by using the random numbers s?1 and s?2 if the first verification value and the second verification value coincide with each other.

Abstract: The method includes a step of aligning and laminating enlarged iron core pieces including iron core pieces and dummy piece parts and forming a composite laminated iron core integrally including a dummy laminated part with the dummy piece parts laminated and a laminated iron core, a step of placing and positioning the composite laminated iron core on a jig and removing the dummy laminated part, and a step of mutually bonding the laminated iron core body with the dummy laminated part removed to form the laminated iron core.

Abstract: Disclosed is an optical semiconductor device having an optical semiconductor mounting element including a recess. On an inner side face of the recess is a thermosetting resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature of 100° C. to 200° C.

Abstract: The present invention provides a composite member comprising a porous body having a first exterior surface, a second exterior surface, and a communication hole communicating with the first exterior surface and the second exterior surface; and an organic material comprising at least one selected from the group consisting of chain saturated hydrocarbon compounds and sugar alcohols, the organic material filling the communication hole, wherein the porous body is formed of a material having a thermal conductivity higher than a thermal conductivity of the organic material.

Abstract: In a method of manufacturing a laminated core, a laminated core body 14 including magnet insertion holes 12 and 13 with magnet pieces 15 inserted therein is placed between a molding (upper) die 10 and a retaining (lower) die 11, and a molding resin 19 is filled from resin reservoir portions (pots) 16 to fix the pieces 15 in the holes 12 and 13. Between the die 10 and the body 14, a guide member 18 is placed, which includes resin passages 31 provided from the portions 16 to the holes 12 and 13 and gates 30 connecting to the holes 12 and 13 on downstream sides of the passages 31. The method can reduce lead time of a production line without replacing the molding dies for different laminated rotor cores and thus without preparing different types of molding dies.

Abstract: There is disclosed a method for manufacturing a semiconductor device comprising a semiconductor chip having a connection portion and a wiring circuit board having a connection portion, the respective connection portions being electrically connected to each other, or a semiconductor device comprising a plurality of semiconductor chips having connection portions, the respective connection portions being electrically connected to each other. The connection portions consist of metal.

Abstract: A semiconductor adhesive used for sealing connection portions of a semiconductor device, wherein: in the semiconductor device, the connection portion of a semiconductor chip and the connection portion of a wiring circuit substrate are electrically connected to each other or the connection portions of a plurality of semiconductor chips are electrically connected to each other; the semiconductor adhesive comprises a (meth)acrylic compound and a curing agent; and when the semiconductor adhesive is kept at 200° C. for 5 seconds, a curing reaction rate thereof is 80% or more.

Abstract: A client apparatus converts second input authentication information having a data content compliant with a second authentication method different from a first authentication method into authentication target information in a data format compliant with the first authentication method and transmits information corresponding to the authentication target information to a communication server apparatus. A server apparatus is capable of carrying out both a first process of providing a first authentication server apparatus that carries out an authentication process compliant with the first authentication method with first information corresponding to the authentication target information and a second process of providing a second authentication server apparatus that carries out an authentication process compliant with the second authentication method with second information corresponding to the authentication target information.

Abstract: Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.

Abstract: A method of manufacturing a laminated iron core includes extruding resins from a plurality of plungers toward a plurality of through holes extending from an upper surface to a lower surface of a laminated body formed of a plurality of electromagnetic steel plates to fill the plurality of through holes with the resins. The plurality of plungers are mutually independent and an extrusion amount of the resin is controlled for each plunger.

Abstract: In a method of manufacturing a laminated core, a laminated core body 14 including magnet insertion holes 12 and 13 with magnet pieces 15 inserted therein is placed between a molding (upper) die 10 and a retaining (lower) die 11, and a molding resin 19 is filled from resin reservoir portions (pots) 16 to fix the pieces 15 in the holes 12 and 13. Between the die 10 and the body 14, a guide member 18 is placed, which includes resin passages 31 provided from the portions 16 to the holes 12 and 13 and gates 30 connecting to the holes 12 and 13 on downstream sides of the passages 31. The method can reduce lead time of a production line without replacing the molding dies for different laminated rotor cores and thus without preparing different types of molding dies.