Abstract: A method of manufacturing a laminated rotor core, including inserting permanent magnets into magnet insertion portions of an iron core formed by laminating plural core sheets; and thereafter to fix the magnets, injecting resin into the magnet insertion portions from a resin reservoir part in a die holding the iron core; the method comprising: a first process of placing a segment dummy plate between the body and the die, the plate covering one or more of the plural magnet insertion portions individually and including a resin injection hole continuing thereto; a second process of injecting the resin from the resin reservoir part of the die through the resin injection hole of the plate to the corresponding magnet insertion portions; and a third process of detaching the dummy plate with excess resin after the resin injected to the magnet insertion portions is cured; and the method improving a resin sealing process.

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

Abstract: A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.

Abstract: There is provided a rotor core which increases the quality and reliability thereof by preventing the occurrence of a core separation of the rotor core. There is provided a rotor core including a plurality of substantially cylindrical core blocks which are stacked on each other; and a plurality of magnets, characterized in that a plurality of magnet holes extending in an axial direction are provided in the plurality of core blocks so as to extend over the plurality of core blocks in that the plurality of magnets are accommodated in each of the plurality of magnet accommodation holes and fixed therein with a resin, and in that an axial position of core block boundary planes where the plurality of core blocks are brought into abutment with each other and an axial position of magnet boundary planes where the plurality of magnets are brought into abutment with each other differ from each other.

Abstract: A method for manufacturing a laminated core is provided that makes positions of boundary parts of laminated blocks and improves an efficiency of a welding operation of the blocks. The above-described object is achieved by the method of manufacturing the laminated core 10 including a process that forms a plurality of blocks 12 having a plurality of welding parts 13 to 15 of different forms or colors at intervals of prescribed angles in the circumferential direction, a process that laminates the plurality of blocks 12 under a state that the blocks are rotated at intervals of the prescribed angles and a process that welds the welding parts 13 to 15 having the different forms or colors of the laminated blocks 12 to form integrally the plurality of blocks 12.

Abstract: The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.

Abstract: An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

Abstract: To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product 60 in which a dicing tape 9, an adhesive layer 3, and a semiconductor wafer 6 are stacked in this order so that a circuit surface 6a of the semiconductor wafer 6 may face the dicing tape 9 side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface 6a from a rear surface 6b of the semiconductor wafer 6. At least the semiconductor wafer 6 and the adhesive layer 3 are cut in the thickness direction of the layered product 60. The dicing tape 9 is cured to peel off the dicing tape 9 and the adhesive layer 3. A projection electrode 4 of a semiconductor chip 26 is aligned with a wiring 12 of a wiring substrate 40.

Abstract: An epoxy resin composition for a underfilling of a semiconductor comprising an epoxy resin, an acid anhydride, a curing accelerator and a flux agent as essential components, wherein the curing accelerator is a quaternary phosphonium salt, as well as a semiconductor device and manufacturing method employing the same.

Abstract: An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.

Abstract: An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.

Abstract: An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.

Abstract: A planar optical waveguide including a clad layer, an optical waveguide having a core embedded in the clad layer; and a groove formed in the clad layer and having a reflection interface for totally reflecting a leaked light leaked from the optical waveguide to the clad layer. Since the reflection interface for totally reflecting the leaked light is formed in the clad layer, the leaked light is prevented from entering into the tap coupler, and the variation of the branching ratio can be reduced.

Abstract: A laminated core (10) and a method for manufacturing the same formed with multiple continuous segment core pieces (13) wound in a spiral form by bending connecting portions (12) mutually connecting the segment core pieces (13), the connecting portions (12) being formed in an outer peripheral area (11), while the connecting portions (12) of vertically adjacent layers being displaced in a circumferential direction with inner edges or outer edges of the segment core pieces (13) fitted, the laminated core comprising: a concave cutout (21) provided in a radial exterior of each connecting portion (12) to dispose a radially expanded portion (20) within an outer circle of the laminated core (10), the radially expanded portion (20) being formed with each connecting portion (12) expanding radially outward at the time of bending each connecting portion (12); an interior cutout (22) provided in a radial interior of each connecting portion (12) to define a bending position of each connecting portion (12); and a receptacle

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

Abstract: A laminated core (10) and a method for manufacturing the same, the laminated core (10) formed with a plurality of continuous segment core sheets (13) wound and laminated in a spiral form while connecting portions (12) mutually connecting the adjacent segment core sheets (13) are bent and side edges of the adjacent segment core sheets (13) are fitted with each other, the connecting portions (12) being located in an outer peripheral portion (11) of the laminated core (10), the laminated core (10) comprising: a concave cutout (19) provided at a radially outward side of the connecting portion (12), the concave cutout (19) allowing a radial bulge (18) to be accommodated within an outer circle of the laminated core (19), the radial bulge (18) formed at a radially outward side of the connecting portion (12) by bending the connecting portion (12); and an inward cutout (20) provided at a radially inward side of the connecting portion (12), the inward cutout (20) defining a bending position of the connecting portion (1

Abstract: A laminated core (10) and a method for manufacturing the same formed with multiple continuous segment core pieces (13) wound in a spiral form by bending connecting portions (12) mutually connecting the segment core pieces (13), the connecting portions (12) being formed in an outer peripheral area (11), while the connecting portions (12) of vertically adjacent layers being displaced in a circumferential direction with inner edges or outer edges of the segment core pieces (13) fitted, the laminated core comprising: a concave cutout (21) provided in a radial exterior of each connecting portion (12) to dispose a radially expanded portion (20) within an outer circle of the laminated core (10), the radially expanded portion (20) being formed with each connecting portion (12) expanding radially outward at the time of bending each connecting portion (12); an interior cutout (22) provided in a radial interior of each connecting portion (12) to define a bending position of each connecting portion (12); and a receptacle