Patents by Inventor Akira Shinchi

Akira Shinchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6059617
    Abstract: A protective member (28) having a melting point lower than a cover (12) is provided on a distal end of a protrusion (22) of the cover (12). A terminal (13) and a covered electric wire (19) are housed in a groove portion (18) of a connector housing (11), and the protrusion (22) of the cover (12) is inserted into the groove portion (18), and thereafter, an ultrasonic vibration is applied to the covered electric wire (19) and the terminal (13) from the cover (12). A covering portion (27) of the covered electric wire (19) is melted and removed by the ultrasonic vibration. The protective member (28) absorbs a heat generated in the cover (12) by applying the ultrasonic vibration, and is preferentially melted. Therefore, the protrusion (22) is not deformed due to the heat, so that a contact area of a core wire (26) and the terminal (13) can be secured.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: May 9, 2000
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi
  • Patent number: 6039592
    Abstract: A packing is formed by an elastomer, and a connector housing is formed by a resin having a mutual solubility with the elastomer. The packing is inserted into a cylindrical section of the connector housing, and a flange section of the packing is brought into contact with a bottom section of the cylindrical section. Next, by using an ultrasonic wave horn, a ring-shaped contact section between the flange section and the bottom section is excited by an ultrasonic wave, and the ring-shaped contact section is fused to form a ring-shaped sealing section. Thus, the packing is firmly fixed to the connector housing.
    Type: Grant
    Filed: February 27, 1998
    Date of Patent: March 21, 2000
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi
  • Patent number: 6027589
    Abstract: An introduction portion of a resin molded product for introducing a covered conductor is waterproofed in a following method. First, an annular waterproofing member which can be fused with the introduction portion and has a compatibility with its covering portion is attached to an outside periphery of the covered conductor corresponding to the introduction portion. Second, by heating the introduction portion, the waterproofing portion and covering portion are melted together and the waterproofing member and introduction portion are fused together with each other. This method ensures a cheap cost and a high waterproofing performance, and is applicable for various types and sizes of wires.
    Type: Grant
    Filed: May 21, 1998
    Date of Patent: February 22, 2000
    Assignee: Yazaki Corporation
    Inventors: Tetsuo Kato, Akira Shinchi, Tetsuro Ide
  • Patent number: 6027009
    Abstract: A soldering material (28) is joined to a surface (13a) of a terminal (13). The terminal (13) is incorporated in a groove (18) of a connector housing (11) so that a covered wire (19) is made into contact with the terminal (13). A cover (12) is mounted so as to insert protrusions (22) into the grooves (18). By carrying out ultrasonic vibration while applying a pressure by a ultrasonic horn, a covering portion of the covered wire is melted and removed. The soldering material (28) is melted by heat generated when the covering portion is melted so that the soldering material (28) is made into contact with the cores thereby the cores and terminal (13) being connected with each other through the soldering material (28). As a result, the soldering material (28) makes a firm contact with the cores.
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: February 22, 2000
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi
  • Patent number: 6021565
    Abstract: A wire connecting structure for connecting covered wires to terminals is provided. The wire connecting structure includes a connector housing body having grooves and a cover body having projections for engagement with the grooves. In arrangement, the terminals are accommodated in the grooves and the covered wires are disposed on the terminals, respectively. The connector housing body has engagement projections formed on opposing sidewalls, while the cover body has engagement holes formed on opposing sidewalls, for engagement with the engagement projections. Owing to the provision of the engagement projections and holes, the connector housing body is detachably united with the cover body on condition that the wires are electrically connected with the terminals. Therefore, it is possible for an operator to dissolve the structure and watch the inside even after the connecting structure is completed.
    Type: Grant
    Filed: January 6, 1998
    Date of Patent: February 8, 2000
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi
  • Patent number: 6019628
    Abstract: A covered electric wire is placed on a conductor drawn out onto a terminal retaining portion protruding from an end portion of a connector housing. A a core wire of the covered electric wire is conductively contacted with the conductor and welding ribs on both sides of a cover closing the terminal retaining portion are welded to the terminal retaining portion by oscillating ultrasonic waves while pressing the covered electric wire against the conductor by means of this cover. On an outer periphery of the cover there is formed a reinforcing rib covering the length between the welding ribs on both sides thereof.
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: February 1, 2000
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi
  • Patent number: 6018127
    Abstract: A wire connecting structure has a connector housing body, a terminal holding portion provided on the connector housing body, a cover body for clogging the terminal holding portion, terminals disposed in the terminal holding portion, and covered wires containing core elements and cover portion, wherein each of the covered wires is placed in each of the terminals and each of the covered wires is pressed by the cover body while ultrasonic vibration is applied so as to melt the cover portion thereby making the core elements and the terminal into conductive contact with each other, the wire connecting structure further having relief concave portions which are provided on at least one of the cover body and connector housing body, for releasing the melted cover portion.
    Type: Grant
    Filed: January 7, 1998
    Date of Patent: January 25, 2000
    Assignee: Yazaki Corporation
    Inventors: Akira Shinchi, Naoki Ito
  • Patent number: 6012955
    Abstract: A terminal (20) lies, together with an insulated electric wire (8) having a superposed relation therewith, between a bottom of a groove (13) of a first member (11) and a vertex face (15) of a protrusion (14) of a second member (12), and is subjected together with the insulated electric wire (8) to a sequence of ultrasonic vibrations under pressures exerted via the first and second members (11,12) so that an insulation of the insulated electric wire is melted and the terminal is current-conductively contacted to a core wire of the insulated electric wire, wherein the terminal has at a connection part (21) thereof to be connected to the insulated electric wire an engaging portion (22) engageable with a side face of the protrusion (14) having an engagement portion to be engaged therewith.
    Type: Grant
    Filed: January 8, 1998
    Date of Patent: January 11, 2000
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi
  • Patent number: 6004170
    Abstract: A covered wire connection structure is formed by the steps of: pinching a covered wire with a pair of resin chips; pressing and exciting a cover portion of the wire by ultrasonic vibration so as to conductively connect conductive portions of both the covered wires at the connection portion; and melting a pair of the resin chips so as to seal the connection portion. The resin chip comprises main melting portions for pinching the connection portion which are melted to a mating resin chip so as to seal the connection portion, and auxiliary melting portions which are formed of material compatible with the cover portion of the covered wire introduced from the main melting portions and pinch the cover portion such that they are melted to the mating resin chip. The auxiliary melting portions and cover portion of the covered wire are melted together and integrated so as to seal an introductive portion of the covered wire from the resin chips.
    Type: Grant
    Filed: October 23, 1997
    Date of Patent: December 21, 1999
    Assignee: Yazaki Corporation
    Inventors: Tetsuo Kato, Nobuyuki Asakura, Akira Shinchi, Tetsuro Ide
  • Patent number: 5997340
    Abstract: A wire connecting structure of a connector comprises a connector housing, a terminal holding portion protruding from an end of the connector housing, terminal incorporating holes which are provided in the terminal holding portion and communicate with the connector housing, terminals disposed within the terminal incorporating holes, covered wires placed on the terminals, and upper hole wall portions which are provided in the terminal holding portion to define upper portions of the terminal incorporating holes and when pressed, subside into the terminal incorporating holes so as to contact the covered wires, core elements of the covered wire and the terminal being subjected to ultrasonic vibration through the upper hole wall portion which is pressed so as to contact the covered wire, so that the core elements and the terminal are conductively contacted with each other, the upper hole wall portion being settled by fusion in each of the terminal incorporating holes by the ultrasonic vibration.
    Type: Grant
    Filed: December 22, 1997
    Date of Patent: December 7, 1999
    Assignee: Yazaki Corporation
    Inventors: Naoki Ito, Akira Shinchi
  • Patent number: 5980316
    Abstract: A waterproof connector having excellent waterproofing properties is provided. This waterproof connector consists of a connector main body 1 for receiving a plurality of terminals connected to wires 10 in parallel, and an elastomer packing 4 to be inserted into a concave portion 2 formed in the connector main body 1 at the wire connecting end. The elastomer packing 4 is made up of a pair of split modules 4A and 4B. Wire receiving grooves 5A and 5B for receiving the wires are formed on the contact surface of each split module 4A and 4B. With the wires 10 being placed into the wire receiving grooves 5A and 5B, the elastomer packing 4 is inserted into the concave portion 2. Elastomer packing pressing grooves 6A and 6B are formed on the outer periphery of the elastomer packing 4, and one elastomer packing pressing groove 6A and 6B is situated between every two neighboring wire receiving grooves 5A and 5B.
    Type: Grant
    Filed: April 7, 1998
    Date of Patent: November 9, 1999
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi
  • Patent number: 5967829
    Abstract: A waterproof connector is low in manufacturing cost and has an enhanced waterproofness by complete prevention of the entry of water from a core wire being enabled. A cover portion is formed on an end portion of a housing and on the cover portion there is mounted a rubber-like elastic member having a semi-circular accommodation groove permitting a covered electric wire to pass therethrough. An upper cover portion is welded to the cover portion by ultrasonic oscillation. On the upper cover portion there is mounted a rubber-like elastic member brought into pressure contact with the covered electric wire together with the rubber-like elastic member as well as a core wire waterproofing member. When the ultrasonic oscillation is made, the core wire waterproofing member and a bottom surface portion of the cover portion are welded to each other.
    Type: Grant
    Filed: January 7, 1998
    Date of Patent: October 19, 1999
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi
  • Patent number: 5959253
    Abstract: A wire connection structure having a connector housing body, a terminal holding portion provided on the connector housing body, a cover body for clogging the terminal holding portion 11, terminals disposed in the terminal holding portion, and covered wires containing core elements and cover portion, wherein each of the covered wires is placed in each of the terminals and each of the covered wires is pressed by the cover body toward the terminal while ultrasonic vibration is applied so as to melt the cover portion thereby making the core elements and the terminal into conductive contact with each other, the wire connection structure further having wire fixing portions which are provided on the cover body for fusing the covered wire with the terminal holding portion at a portion backward of a rear end of the terminal.
    Type: Grant
    Filed: January 7, 1998
    Date of Patent: September 28, 1999
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi
  • Patent number: 5957735
    Abstract: A covered electric wire is placed on a conductor drawn out onto a terminal retaining portion protruding from an end portion of a connector housing. When causing a core wire of the covered electric wire and the conductor to be conductively contacted with each other by oscillating ultrasonic waves while pressing the covered electric wire against the conductor by a cover closing the terminal retaining portion, the terminal retaining portion and the cover are positioned by positioning members which are fitted to each other and one of the two is thereby prevented from being displaced relative to the other.
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: September 28, 1999
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi
  • Patent number: 5954549
    Abstract: A terminal and a covered electric wire are pressed by a groove portion of a first member and a protruding portion of a second member, after which ultrasonic vibration is applied to bring the terminal and the covered electric wire into electric conduction therebetween, thereby ensuring the connection therebetween. A block portion is provided in the groove portion of the first member and the protruding portion which is to be fitted into the groove portion is provided with respect to the second member. The block portion and the protruding portion are each made of resin having a smaller coefficient of linear expansion, thereby making small the amount of shrinkage resulting from natural cooling after application of ultrasonic vibration and thereby ensuring the contact pressure of the terminal with core wires of the covered electric wire.
    Type: Grant
    Filed: December 22, 1997
    Date of Patent: September 21, 1999
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi
  • Patent number: 5947770
    Abstract: A terminal is placed in a groove portion of a first member and, in a state where a covered electric wire is placed on the terminal, the resulting laminate is pressed by a second member. By applying ultrasonic vibrations while this pressing is being maintained as is, the first member and the second member are welded to each other. The second member is made of resin having a heat resistance lower than the resin constituting a block portion which forms a bottom wall portion of the groove portion. By performing the above pressing in a state where heat is being generated by application of ultrasonic vibration, it does not happen that the block portion supporting the terminal is recessed even when the second member is recessed. This eliminates the possibility that the terminal may be embedded in the resin.
    Type: Grant
    Filed: December 22, 1997
    Date of Patent: September 7, 1999
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi
  • Patent number: 5939674
    Abstract: A waterproof structure for an electrical wiring instrument includes electrical wires, a housing, an upper cover and rubbery elastic members resulting from a pair of rubbery elastic materials. The housing has a cover portion formed on an end of the housing and provided with first accommodation grooves for accommodating the electrical wires. Each of the first accommodation grooves is defined by a pair of first ribs parallel to each other. The upper cover has second accommodation grooves formed for accommodating the electrical wires. Each of the second accommodation grooves is defined by a pair of second ribs parallel to each other. In assembling, after accommodating the wires in the first accommodation grooves, the wires are interposed between the pair of rubbery elastic materials in the form of sheets. Then, the upper cover is laid on the cover portion and subsequently subjected to ultrasonic oscillation under pressure.
    Type: Grant
    Filed: December 22, 1997
    Date of Patent: August 17, 1999
    Assignee: Yazaki Corporation
    Inventors: Tetsuo Jibe, Akira Shinchi
  • Patent number: 5928033
    Abstract: A waterproof structure for a wire leading part of a housing is provided. The structure includes two cover bodies and two waterproof members carried by the cover bodies. The waterproof members are made of elastic materials which are soluble in each other and fusible in insulating covers of wires by ultrasonic oscillation under pressure. At the mutual welding of the cover bodies by the ultrasonic oscillation, the waterproof members are fused in each other, the waterproof members are fused in the insulating covers and the cover bodies are welded to the housing.
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: July 27, 1999
    Assignee: Yazaki Corporation
    Inventors: Tetsuo Kato, Akira Shinchi, Nobuyuki Asakura
  • Patent number: 5871364
    Abstract: A connector with a protective cover in which the protective cover covers the connector and an exposed, fixed terminal, thereby enhancing safety, and a connector fitting operation can be effected easily without increasing the time and labor required for an assembling operation. The connector with the protective cover includes a connector portion receiving a connection terminal connected to one end of a power source-side wire, and a cover portion integrally connected to a front end of a connector housing of the connector portion through a hinge. When the cover portion is fitted on and connected to the connector portion, the whole of the connector housing and an exposed, fixed terminal can be positively protected. At the same time, the connection terminal is retained by a projection formed on a reverse surface of the cover portion.
    Type: Grant
    Filed: August 16, 1996
    Date of Patent: February 16, 1999
    Assignee: Yazaki Corporation
    Inventors: Akira Shinchi, Noboru Yamaguchi
  • Patent number: 5869784
    Abstract: Covered wires are overlapped with each other at an overlapping portion and pinched by a pair of resin chips. Cover portions are melted by ultrasonic vibration and conductive wire portions are conductively contacted with each other by pressing from outside of the resin chips. A pair of the resin chips are melt-fixed to seal the overlapping portion S. The resin chips have main melting portions which are melted with each other to pinch and seal the overlapping portion S, auxiliary melting portions which are melted with each other such that cover portions of covered wires introduced from the main melting portions are pinched and cover portion removing portions formed in the auxiliary melting portions to melt and extrude the cover portion. Thus, by this covered wire connection structure, it is possible to provide an excellent melting performance and achieve enhancement of melting force between the resin chips and improvement of covering performance for conductive wire portions.
    Type: Grant
    Filed: May 19, 1997
    Date of Patent: February 9, 1999
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi