Patents by Inventor Akira Shoujiguchi

Akira Shoujiguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11501388
    Abstract: There are provided a repair determination section that determines, based on failure information on the facility for manufacturing a product, a repair time required to repair the facility, and a recovery plan creation section that creates a recovery plan in accordance with a predetermined production evaluation indicator, based on the repair time and production information on a line with the failed facility, one or more other facilities, and on one or more other lines.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: November 15, 2022
    Assignee: NEC CORPORATION
    Inventors: Eisuke Saneyoshi, Shigeru Koumoto, Akira Shoujiguchi, Rie Iwasaki, Takahiro Toizumi, Ryota Suzuki
  • Patent number: 11486915
    Abstract: A state estimation apparatus is configured to extract a time interval to be analyzed from a time series of a first signal based on a second signal acquired in conjunction with the first signal relating to the operation of the facility, and estimate a change in a state of the facility based on waveform data of the time interval of the first signal.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: November 1, 2022
    Assignee: NEC CORPORATION
    Inventors: Eisuke Saneyoshi, Shigeru Koumoto, Akira Shoujiguchi
  • Publication number: 20210278832
    Abstract: A maintenance plan formulation device includes: a failure sign detection unit that acquires a state of at least an apparatus and detects an abnormality indicating a sign that appears before a failure of the apparatus occurs; a maintenance limit timing calculation unit that calculates a maintenance limit timing that indicates a limit of a maintenance timing of the apparatus with the abnormality thereof being detected; a maintenance timing calculation unit that calculates a maintenance timing of the apparatus based on the maintenance limit timing of the apparatus; and a maintenance timing output part that outputs the maintenance timing to a display apparatus.
    Type: Application
    Filed: June 28, 2017
    Publication date: September 9, 2021
    Applicant: NEC CORPORATION
    Inventors: Shigeru KOUMOTO, Rie IWASAKI, Eisuke SANEYOSHI, Akira SHOUJIGUCHI, Takahiro TOIZUMI, Ryota SUZUKI
  • Patent number: 10813243
    Abstract: It is impossible to avoid the increase in device cost and maintenance cost in order to cool a plurality of heat sources efficiently using a natural-circulation type phase-change cooling device; therefore, a phase-change cooling device according to an exemplary aspect of the present invention includes a plurality of heat receiving units configured to hold respectively refrigerant receiving heat from a plurality of heat sources; a condensing unit configured to generate refrigerant liquid by condensing and liquefying refrigerant vapor of the refrigerant evaporated in the heat receiving units; a refrigerant vapor transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant vapor; and a refrigerant liquid transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant liquid, wherein the refrigerant liquid transport structure includes a main-liquid-pipe connected to the condensing unit, a refrig
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: October 20, 2020
    Assignee: NEC Corporation
    Inventors: Akira Shoujiguchi, Minoru Yoshikawa, Masaki Chiba, Arihiro Matsunaga, Masanori Sato
  • Publication number: 20200166552
    Abstract: A state estimation apparatus is configured to extract a time interval to be analyzed from a time series of a first signal based on a second signal acquired in conjunction with the first signal relating to the operation of the facility, and estimate a change in a state of the facility based on waveform data of the time interval of the first signal.
    Type: Application
    Filed: July 17, 2018
    Publication date: May 28, 2020
    Applicant: NEC Corporation
    Inventors: Eisuke SANEYOSHI, Shigeru KOUMOTO, Akira SHOUJIGUCHI
  • Publication number: 20200058081
    Abstract: There are provided a repair determination section that determines, based on failure information on the facility for manufacturing a product, a repair time required to repair the facility, and a recovery plan creation section that creates a recovery plan in accordance with a predetermined production evaluation indicator, based on the repair time and production information on a line with the failed facility, one or more other facilities, and on one or more other lines.
    Type: Application
    Filed: October 30, 2017
    Publication date: February 20, 2020
    Applicant: NEC Corporation
    Inventors: Eisuke SANEYOSHI, Shigeru KOUMOTO, Akira SHOUJIGUCHI, Rie IWASAKI, Takahiro TOIZUMI, Ryota SUZUKI
  • Publication number: 20190324070
    Abstract: The present invention extracts a time segment of an analysis target from time series data of a signal related to an operation of the facility and estimates a change with time of a state of the facility, based on the time series data of the time segment extracted.
    Type: Application
    Filed: November 29, 2017
    Publication date: October 24, 2019
    Applicant: NEC Corporation
    Inventors: Eisuke SANEYOSHI, Shigeru KOUMOTO, Akira SHOUJIGUCHI
  • Patent number: 10409345
    Abstract: With a phase change cooling device, it is difficult to obtain reliable high-efficiency cooling performance due to a change in heat exchange performance.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: September 10, 2019
    Assignee: NEC Corporation
    Inventors: Masanori Sato, Minoru Yoshikawa, Akira Shoujiguchi, Arihiro Matsunaga
  • Patent number: 10215456
    Abstract: In order to supply a refrigerant to multiple-stage heat receivers equally while saving space, a refrigerant distribution device to distribute a refrigerant supplied from the upper stream according to the present invention includes a main body including a side wall part, an upper face part and a bottom face part, an upstream pipe provided on the upper face part in a manner communicating with an inside of the main body, a downstream pipe provided in a state partially inserted inside the main body via an under face hole part provided in the bottom face part, a tributary pipe provided in the side wall part or the bottom face part in a manner communicating with the inside of the main body, and a refrigerant direction changing means provided between the upstream pipe and the downstream pipe.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: February 26, 2019
    Assignees: NEC Corporation, NEC Platforms, Ltd.
    Inventors: Arihiro Matsunaga, Masaki Chiba, Minoru Yoshikawa, Tadao Hosaka, Shunsuke Fujii, Akira Shoujiguchi, Kenichi Inaba, Masanori Sato
  • Patent number: 10182517
    Abstract: A vapor pipe 103 connects a heat dissipation portion 200 and each of a plurality of heat receiving portions 102. A liquid pipe 104 connects the heat dissipation portion 200 and each of a plurality of the heat receiving portions 102. A bypass pipe 105 connects the vapor pipe 103 and the liquid pipe 104. A valve 106 opens and closes a flow path of the bypass pipe 105. A first connection portion 107 connects the vapor pipe 103 and the bypass pipe 105. A second connection portion 108 connects the liquid pipe 103 and the bypass pipe 105. The first connection portion 107 is disposed at a position higher than that of the second connection portion 108. As a result, refrigerant can be efficiently transported in a short time.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: January 15, 2019
    Assignee: NEC Corporation
    Inventors: Minoru Yoshikawa, Kenichi Inaba, Masanori Sato, Akira Shoujiguchi, Arihiro Matsunaga, Masaki Chiba
  • Patent number: 9820407
    Abstract: An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: November 14, 2017
    Assignee: NEC Corporation
    Inventors: Hitoshi Sakamoto, Minoru Yoshikawa, Akira Shoujiguchi, Masaki Chiba, Kenichi Inaba, Arihiro Matsunaga
  • Publication number: 20170311485
    Abstract: It is impossible to avoid the increase in device cost and maintenance cost in order to cool a heat source efficiently using a natural-circulation type phase-change cooling device; therefore, a cooling device according to an exemplary aspect of the present invention includes a heat receiving unit for receiving heat; a condensing unit for releasing heat; and a refrigerant intermediary unit for connecting the heat receiving unit with the condensing unit, and transporting refrigerant circulating between the heat receiving unit and the condensing unit, wherein the refrigerant intermediary unit includes a refrigerant retaining unit for retaining the refrigerant, a primary tube connecting the refrigerant retaining unit with the condensing unit, and a secondary tube connecting the refrigerant retaining unit with the heat receiving unit and including a bendable tube.
    Type: Application
    Filed: September 15, 2015
    Publication date: October 26, 2017
    Inventors: Minoru YOSHIKAWA, Akira SHOUJIGUCHI, Masaki CHIBA, Arihiro MATSUNAGA, Masanori SATO
  • Publication number: 20170303432
    Abstract: If a gas-liquid separation structure is introduced into a phase-change cooling device to prevent the cooling performance from decreasing, manufacturing costs increase; therefore, a refrigerant intermediary device according to an exemplary aspect of the present invention includes a refrigerant container configured to contain refrigerant; a first inlet, provided for an outer periphery of the refrigerant container, through which a vapor-phase refrigerant and a first liquid-phase refrigerant flowing in; a first outlet, provided for the outer periphery of the refrigerant container, through which the vapor-phase refrigerant flowing out; a second inlet, provided for the outer periphery of the refrigerant container, through which a second liquid-phase refrigerant flowing in; and a second outlet, provided for the outer periphery of the refrigerant container, through which the first liquid-phase refrigerant and the second liquid-phase refrigerant flowing.
    Type: Application
    Filed: September 15, 2015
    Publication date: October 19, 2017
    Inventors: Arihiro MATSUNAGA, Masanori SATO, Akira SHOUJIGUCHI, Masaki CHIBA, Minoru YOSHIKAWA
  • Publication number: 20170280594
    Abstract: A rack louver 120 controls an air flow of outside air external to an enclosure 10 taken into the enclosure 10, flowing from an inlet 20 to an outlet 30 in a rack 60. An outlet louver 130 controls an air flow of inside air internal to the enclosure 10 flowing out from the outlet 30 to outside the enclosure 10. A system control unit 150 adjusts motive power of a blowing unit 40, a degree of opening of the rack louver 120, and a degree of opening of the outlet louver 130 in accordance with an outside-air temperature measured by an outside-air temperature sensor 50 and electronic equipment power consumption measured by a power sensor 100. Consequently, electronic equipment in the rack can be cooled with higher energy efficiency while suppressing temperature rise in the electronic equipment.
    Type: Application
    Filed: August 20, 2015
    Publication date: September 28, 2017
    Applicant: NEC Corporation
    Inventors: Masanori SATO, Kenichi INABA, Minoru YOSHIKAWA, Akira SHOUJIGUCHI, Masaki CHIBA, Arihiro MATSUNAGA
  • Publication number: 20170280585
    Abstract: It is impossible to avoid the increase in device cost and maintenance cost in order to cool a plurality of heat sources efficiently using a natural-circulation type phase-change cooling device; therefore, a phase-change cooling device according to an exemplary aspect of the present invention includes a plurality of heat receiving units configured to hold respectively refrigerant receiving heat from a plurality of heat sources; a condensing unit configured to generate refrigerant liquid by condensing and liquefying refrigerant vapor of the refrigerant evaporated in the heat receiving units; a refrigerant vapor transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant vapor; and a refrigerant liquid transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant liquid, wherein the refrigerant liquid transport structure includes a main-liquid-pipe connected to the condensing unit, a refrig
    Type: Application
    Filed: August 20, 2015
    Publication date: September 28, 2017
    Applicant: NEC Corporation
    Inventors: Akira SHOUJIGUCHI, Minoru YOSHIKAWA, Masaki CHIBA, Arihiro MATSUNAGA, Masanori SATO
  • Publication number: 20170280590
    Abstract: In a natural-circulation type phase-change cooling device, the cooling performance is degraded if the number of heat sources to be cooled increases; therefore, a phase-change cooling device according to an exemplary aspect of the present invention includes a plurality of heat receiving units for respectively holding refrigerant receiving heat from a plurality of heat sources; a condensing unit for generating refrigerant liquid by condensing and liquefying refrigerant vapor of the refrigerant evaporated in the heat receiving units; a refrigerant vapor transport structure configured to connect the heat receiving units to the condensing unit and transport the refrigerant vapor; a refrigerant liquid transport structure configured to connect the heat receiving units to the condensing unit and transport the refrigerant liquid; wherein the refrigerant vapor transport structure includes a plurality of sub-vapor-pipes respectively connected to the plurality of heat receiving units, a vapor joining portion connected to
    Type: Application
    Filed: August 19, 2015
    Publication date: September 28, 2017
    Applicant: NEC Corporation
    Inventors: Masaki CHIBA, Minoru YOSHIKAWA, Akira SHOUJIGUCHI, Arihiro MATSUNAGA, Masanori SATO
  • Patent number: 9696068
    Abstract: In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.
    Type: Grant
    Filed: July 19, 2013
    Date of Patent: July 4, 2017
    Assignee: NEC Corporation
    Inventors: Arihiro Matsunaga, Minoru Yoshikawa, Hitoshi Sakamoto, Akira Shoujiguchi, Masaki Chiba, Kenichi Inaba
  • Patent number: 9693485
    Abstract: A cooling system of an electronic device storing apparatus of the present invention comprises: a rack including an electronic device and a plurality of placement shelves to place the electronic device; in the rack, a vaporizer having a refrigerant internally being mounted; outside the rack, a condensing part connected with the vaporizer by a laying pipe being installed; and a refrigerant adjustment means for adjusting a height of a refrigerant surface in the vaporizer.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: June 27, 2017
    Assignee: NEC Corporation
    Inventors: Kenichi Inaba, Minoru Yoshikawa, Hitoshi Sakamoto, Akira Shoujiguchi, Arihiro Matsunaga, Masaki Chiba
  • Publication number: 20160290691
    Abstract: It is difficult to avoid a decrease in cooling capacity without causing an increase in power consumption if a cooling device including a piping structure grows in size, therefore, a piping structure according to an exemplary aspect of the present invention includes a tubular part including a first flow passage through which a refrigerant flowing and a shell region surrounding the first flow passage; an introduction part composing a part of the shell region and including a second flow passage connected to the first flow passage; and a connection located at an end, between ends of the introduction part, on the side opposite to an end on a side where the second flow passage being connected to the first flow passage.
    Type: Application
    Filed: November 10, 2014
    Publication date: October 6, 2016
    Inventors: Masaki CHIBA, Minoru YOSHIKAWA, Akira SHOUJIGUCHI, Kenichi INABA, Arihiro MATSUNAGA, Masanori SATO, Tadao HOSAKA, Yasuhito NAKAMURA
  • Publication number: 20160295749
    Abstract: A vapor pipe 103 connects a heat dissipation portion 200 and each of a plurality of heat receiving portions 102. A liquid pipe 104 connects the heat dissipation portion 200 and each of a plurality of the heat receiving portions 102. A bypass pipe 105 connects the vapor pipe 103 and the liquid pipe 104. A valve 106 opens and closes a flow path of the bypass pipe 105. A first connection portion 107 connects the vapor pipe 103 and the bypass pipe 105. A second connection portion 108 connects the liquid pipe 103 and the bypass pipe 105. The first connection portion 107 is disposed at a position higher than that of the second connection portion 108. As a result, refrigerant can be efficiently transported in a short time.
    Type: Application
    Filed: November 14, 2014
    Publication date: October 6, 2016
    Inventors: Minoru YOSHIKAWA, Kenichi INABA, Masanori SATO, Akira SHOUJIGUCHI, Arihiro MATSUNAGA, Masaki CHIBA