Abstract: A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.

Abstract: In order to supply a refrigerant to multiple-stage heat receivers equally while saving space, a refrigerant distribution device to distribute a refrigerant supplied from the upper stream according to the present invention includes a main body including a side wall part, an upper face part and a bottom face part, an upstream pipe provided on the upper face part in a manner communicating with an inside of the main body, a downstream pipe provided in a state partially inserted inside the main body via an under face hole part provided in the bottom face part, a tributary pipe provided in the side wall part or the bottom face part in a manner communicating with the inside of the main body, and a refrigerant direction changing means provided between the upstream pipe and the downstream pipe.

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Abstract: A control mechanism becomes complex when an optimum volume of refrigerant is stably supplied to a plurality of objects to be cooled that have differing heat generation values. The present invention is a cooling system which comprises a first refrigerant tank that stores a liquid-phase refrigerant, a plurality of evaporators that gasify the liquid-phase refrigerant supplied from the first refrigerant tank, a condenser that liquefies the gas-phase refrigerant that was gasified by the evaporators, a vapor pipe that connects the evaporators and the condenser and in which the gas-phase refrigerant flows, and a liquid pipe that connects the condenser and the first refrigerant tank and connects the first refrigerant tank and the plurality of evaporators and in which the liquid-phase refrigerant flows, wherein the condenser is located higher than the plurality of evaporators, and the first refrigerant tank is located lower than the condenser.

Abstract: A cooling structure of a sealed casing according to the present invention includes sealed containers for housing heat-generation components irradiated with light from a light source to generate heat, an evaporation unit disposed in the sealed container to store a refrigerant, a condensation unit configured to liquefy the refrigerant gasified by the heat received from the heat-generation component, a steam pipe configured to connect the evaporation unit and the condensation unit, through which the gasified refrigerant flows, and a liquid pipe configured to connect the evaporation unit and the condensation unit to each other, through which the liquefied refrigerant flows. Thus, a cooling structure capable of preventing performance deterioration of a cooling target device can be achieved.

Abstract: This cooling device has: an evaporation section for storing a refrigerant; a condensation section for radiating the heat of a gas-phase refrigerant, which has been gasified by the evaporation section, by condensing and liquefying the gas-phase refrigerant; a vapor pipe for transporting the gas-phase refrigerant to the condensation section; a liquid pipe for transporting a liquid-phase refrigerant, which has been condensed by the condensation section, to the evaporation section; and a mounting plate provided with a connection structure connected to the device side which is to be cooled. The evaporation section is disposed on one surface of the mounting plate, and the condensation section is disposed on the other side of the mounting plate.

Abstract: A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.

Abstract: [Problem] To provide an electronic apparatus cooling system having superior cooling characteristics and portability. [Solution] A rack 2 is installed within a container 1. A heat receiving apparatus 3 is disposed on a lateral face of the rack 2, and receives heat emitted within the rack 2 by a liquid-phase cooling medium gasifying and becoming a gaseous-phase cooling medium. A gaseous-phase tube 6 is disposed extending in plumb direction, and transports the gaseous-phase cooling medium from the heat receiving apparatus 3. A heat radiating apparatus 4 is disposed above the rack 2 outside the container 1, and radiates the heat which the heat receiving apparatus 3 has received by cooling the gaseous-phase cooling medium flowing from the gaseous-phase tube 6, making said gaseous-phase cooling medium into the liquid-phase cooling medium. A liquid-phase tube 7 transports the liquid-phase cooling medium from the heat radiating apparatus 4 to the heat receiving apparatus 3.

Abstract: An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510.

Abstract: The present invention includes: a heat receiving portion that receives heat generated by an electronic apparatus and causes a phase of a first heating medium to change from a liquid phase to a gas; a heat radiating portion that causes a phase of the first heating medium to change from the gas to the liquid and supplies the first heating medium to the heat receiving portion; and a compressor that raises a temperature of the first heating medium supplied from the heat receiving portion and supplies the first heating medium to the heat radiating portion.

Abstract: A cooling system of an electronic device storing apparatus of the present invention comprises: a rack including an electronic device and a plurality of placement shelves to place the electronic device; in the rack, a vaporizer having a refrigerant internally being mounted; outside the rack, a condensing part connected with the vaporizer by a laying pipe being installed; and a refrigerant adjustment means for adjusting a height of a refrigerant surface in the vaporizer.

Abstract: In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Abstract: The size of an electronic device using a cooling structure for an electronic circuit board is increased when using a heating element with a large amount of heat generation, therefore, a cooling structure for an electronic circuit board according to an exemplary aspect of the present invention includes an evaporator with an evaporation container storing a refrigerant; a condenser condensing and liquefying a vapor-phase refrigerant vaporized in the evaporator and radiating heat; and a pipe connecting the evaporator to the condenser, wherein the evaporator includes a heat receiving area, on one side of the evaporation container, thermally connecting to a heating element disposed on the electronic circuit board, and a plurality of flow path plates, in an area including the heat receiving area, extending in the direction parallel to the electronic circuit board; and a vapor-liquid interface of the refrigerant is positioned above or at the level of a lower end and below an upper end of the heat receiving area in th

Abstract: [Problem] When a size of a cooling device using a boiling cooling system is reduced, a cooling performance decreases.

Abstract: When a cooling device employing an ebullient cooling system is mounted in a low-profile electronic device, not only is it impossible to obtain the sufficient cooling performance, but also the cooling efficiency of the entire electronic device decreases, therefore, a cooling device according to an exemplary aspect of the invention includes evaporating means for storing a refrigerant; condensing means for condensing and liquefying a vapor-phase refrigerant vaporized in the evaporation means and radiating heat; a pipe connecting the evaporating means to the condensing means; and flow regulating means for regulating a flow direction of air passing through the condensing means, wherein the evaporating means and the condensing means are located on roughly the same level in the vertical direction; the evaporating means includes an evaporation container and bulkhead means for separating the refrigerant disposed in the evaporation container; the height of the bulkhead means is larger than or equal to the height of a v

Abstract: A cooling device of the present invention is a cooling device arranged in a chassis equipped with an upper surface, and comprises: a refrigerant; a vaporizer that includes an evaporative vessel having a side face of a curved surface shape, and performs heat-absorption by making the refrigerant change its phase from a liquid phase state to a vapor phase state; a condenser that performs heat-radiation by making the refrigerant change its phase from a vapor phase state to a liquid phase state; a pipe that connects the vaporizer and the condenser; and a flow path suppression means for suppressing a cooling wind that flows between an area over the evaporative vessel and the upper surface.

Abstract: A cooling device employing a boiling cooling method cannot exhibit sufficient cooling performance when it is installed in a low-profile electronic device. A cooling device of the present invention comprises an evaporation unit which contains a refrigerant, a condensation unit which performs heat radiation by condensing and liquefying vapor-phase refrigerant which was vaporized at the evaporation unit, and piping which connects the evaporation unit with the condensation unit; wherein the evaporation unit comprises an evaporation container and a partition wall section which is arranged within the evaporation container and constitutes a flow path of the refrigerant, and the height of the partition wall section is equal to or larger than the height of the vapor-liquid interface of the refrigerant and is smaller than the height of the evaporation container.