Patents by Inventor Akira Tamura
Akira Tamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240044283Abstract: Provided is an electronic fuel injection type diesel engine capable of performing precise electronic fuel injection control. A fuel injector includes a main body portion having a large diameter, a nozzle portion having a small diameter, and a pressing surface formed at a step portion between the main body portion and the nozzle portion, in which the nozzle portion of the fuel injector is inserted from an inside of a sleeve into an inside of an insertion hole, the fuel injector is pressed toward a vortex chamber by a pressing force, and the pressing force applied to the fuel injector is received by a pressure receiving surface of the sleeve from the pressing surface of the fuel injector via the washer.Type: ApplicationFiled: October 25, 2021Publication date: February 8, 2024Inventors: Hiroki OSO, Yuki TAGASHIRA, Akira TAMURA, Rina KANEKO, Kiichi SUEHIRO
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Patent number: 11781501Abstract: To provide an engine head structure for “omission or shortening a fuel pipe that withstands a high pressure”, “simplification or omission of a support bracket for a fuel accumulator and/or a fuel injection device”, “reduction of the number of parts” by devising a fuel accumulator and a support structure therefor, and the like. An engine head structure has a support bracket for mounting a fuel accumulator including a joining portion with a fuel injection device on a cylinder head, is disposed on a side of the fuel injection device or between adjacent fuel injection devices. The support bracket includes a member having a mounting portion on which the fuel accumulator is placed and mounted, a mounting leg portion extending from the mounting portion and mounted on the cylinder head, and an aligning leg portion extending from the mounting portion for positioning the support bracket with respect to the cylinder head.Type: GrantFiled: March 8, 2021Date of Patent: October 10, 2023Assignee: KUBOTA CORPORATIONInventors: Akira Tamura, Kensuke Fujita, Hiroki Oso, Yasushi Kobayashi, Shingo Matsunobu, Mitsugu Okuda
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Publication number: 20230008602Abstract: To provide an engine head structure for “omission or shortening a fuel pipe that withstands a high pressure”, “simplification or omission of a support bracket for a fuel accumulator and/or a fuel injection device”, “reduction of the number of parts” by devising a fuel accumulator and a support structure therefor, and the like. An engine head structure has a support bracket for mounting a fuel accumulator including a joining portion with a fuel injection device on a cylinder head, is disposed on a side of the fuel injection device or between adjacent fuel injection devices. The support bracket includes a member having a mounting portion on which the fuel accumulator is placed and mounted, a mounting leg portion extending from the mounting portion and mounted on the cylinder head, and an aligning leg portion extending from the mounting portion for positioning the support bracket with respect to the cylinder head.Type: ApplicationFiled: March 8, 2021Publication date: January 12, 2023Inventors: Akira TAMURA, Kensuke FUJITA, Hiroki OSO, Yasushi KOBAYASHI, Shingo MATSUNOBU, Mitsugu OKUDA
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Publication number: 20210290699Abstract: Object of the invention is to provide a novel, safe, and side effect-free ghrelin secretion promoter which is capable of exhibit secreting effect of ghrelin present in human body in a form of food that is familiar and easy to be taken in. Hypophagia (loss of appetite) can be remarkably improved by a familiar, easy and safe mean by taking a given lactic acid bacteria per se or fermented milk prepared using the same as a ghrelin secretion promoter.Type: ApplicationFiled: July 13, 2017Publication date: September 23, 2021Applicant: Meiji Co., Ltd.Inventors: Akira Tamura, Satomi Koyama, Yukio Asami
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Patent number: 10736220Abstract: A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.Type: GrantFiled: December 4, 2019Date of Patent: August 4, 2020Assignee: FUJITSU LIMITEDInventors: Kazuaki Takao, Akira Tamura, Takashi Fukuda
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Publication number: 20200107454Abstract: A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.Type: ApplicationFiled: December 4, 2019Publication date: April 2, 2020Applicant: FUJITSU LIMITEDInventors: KAZUAKI TAKAO, Akira Tamura, Takashi Fukuda
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Patent number: 10531572Abstract: A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.Type: GrantFiled: January 31, 2019Date of Patent: January 7, 2020Assignee: FUJITSU LIMITEDInventors: Kazuaki Takao, Akira Tamura, Takashi Fukuda
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Publication number: 20190269019Abstract: A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.Type: ApplicationFiled: January 31, 2019Publication date: August 29, 2019Applicant: FUJITSU LIMITEDInventors: KAZUAKI TAKAO, Akira Tamura, Takashi Fukuda
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Patent number: 10076707Abstract: A game system including a server device connected to a network and one or more terminal devices operated by users and executing a video game that a player character plays a quest in a game space which has a quest data storing unit which stores quest data, a playing status storing unit which stores playing status of the quest, a quest control unit which permits the start of the quest and a hint control unit which notifies the information for the starting conditions. The playing status storing unit acquires the playing status from the quest control unit and updates the playing status, and the hint control unit determines the information for the starting conditions based on the playing status.Type: GrantFiled: February 24, 2015Date of Patent: September 18, 2018Assignee: CAPCOM CO., LTD.Inventors: Kento Kinoshita, Seiji Hamajima, Akira Tamura
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Patent number: 9716353Abstract: A disclosed coaxial connector includes: an external conductor having a cylindrical shape to be screwed together with a counterpart connector including a circular opening end, the external conductor having a contact surface provided on inner periphery of the external conductor, with which the opening end comes into contact, and also having a slit formed to allow the external conductor to stretch and shrink in a longitudinal direction of the external conductor; and a center conductor provided coaxial with the external conductor, the center conductor having a length long enough to reach a substrate on which the counterpart connector is provided upright.Type: GrantFiled: March 14, 2016Date of Patent: July 25, 2017Assignee: FUJITSU LIMITEDInventors: Yoko Murata, Akira Tamura
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Publication number: 20170072313Abstract: A game system including a server device connected to a network and one or more terminal devices operated by users and executing a video game that a player character plays a quest in a game space which has a quest data storing unit which stores quest data, a playing status storing unit which stores playing status of the quest, a quest control unit which permits the start of the quest and a hint control unit which notifies the information for the starting conditions. The playing status storing unit acquires the playing status from the quest control unit and updates the playing status, and the hint control unit determines the information for the starting conditions based on the playing status.Type: ApplicationFiled: February 24, 2015Publication date: March 16, 2017Applicant: CAPCOM CO., LTD.Inventors: Kento KINOSHITA, Seiji HAMAJIMA, Akira TAMURA
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Socket for semiconductor component, printed circuit board unit, and information processing apparatus
Patent number: 9474147Abstract: A disclosed socket for a semiconductor component includes a plate-shaped insulator having a first main surface and a second main surface, where a through hole being formed in the insulator, a terminal inserted in the through hole, the terminal having one end configured to be connected to a signal electrode of the semiconductor component and having another end configured to be connected to a signal electrode of a printed circuit board, and a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and configured to be connected to a ground electrode of the semiconductor component, and a second contact protruding from the second main surface and configured to be connected to a ground electrode of the printed circuit board.Type: GrantFiled: April 13, 2015Date of Patent: October 18, 2016Assignee: FUJITSU LIMITEDInventors: Yasushi Masuda, Akira Tamura, Yoshihiro Morita, Satoshi Ohsawa -
Publication number: 20160294129Abstract: A disclosed coaxial connector includes: an external conductor having a cylindrical shape to be screwed together with a counterpart connector including a circular opening end, the external conductor having a contact surface provided on inner periphery of the external conductor, with which the opening end comes into contact, and also having a slit formed to allow the external conductor to stretch and shrink in a longitudinal direction of the external conductor; and a center conductor provided coaxial with the external conductor, the center conductor having a length long enough to reach a substrate on which the counterpart connector is provided upright.Type: ApplicationFiled: March 14, 2016Publication date: October 6, 2016Applicant: FUJITSU LIMITEDInventors: Yoko Murata, Akira Tamura
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Patent number: 9252513Abstract: A socket includes a plurality of coupling members that each include a first end portion and a second end portion, the coupling members being made of electrically conductive material, wherein a terminal of an electronic component and a terminal of a board are electrically coupled with the first end portion and the second end portion, respectively, so to electrically connect the terminal of the electronic component and the terminal of the board, a holding member that holds the plurality of coupling members in such a manner that the plurality of coupling members are not in contact with each other, the holding member being made form an electrical insulating material, and a sheet member that is in contact with the electronic component and the board in parts between the plurality of coupling members, the sheet member being made from a material which is electrical insulating and thermal diffusive.Type: GrantFiled: November 25, 2013Date of Patent: February 2, 2016Assignee: FUJITSU LIMITEDInventors: Yasushi Masuda, Akira Tamura, Yoshihiro Morita, Satoshi Ohsawa
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SOCKET FOR SEMICONDUCTOR COMPONENT, PRINTED CIRCUIT BOARD UNIT, AND INFORMATION PROCESSING APPARATUS
Publication number: 20150359122Abstract: A disclosed socket for a semiconductor component includes a plate-shaped insulator having a first main surface and a second main surface, where a through hole being formed in the insulator, a terminal inserted in the through hole, the terminal having one end configured to be connected to a signal electrode of the semiconductor component and having another end configured to be connected to a signal electrode of a printed circuit board, and a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and configured to be connected to a ground electrode of the semiconductor component, and a second contact protruding from the second main surface and configured to be connected to a ground electrode of the printed circuit board.Type: ApplicationFiled: April 13, 2015Publication date: December 10, 2015Inventors: Yasushi Masuda, Akira Tamura, YOSHIHIRO MORITA, Satoshi Ohsawa -
Patent number: 9124039Abstract: A connector includes: a casing; a pair of signal terminals that have respective tip end portions, the pair of signal terminals projecting from the casing, the tip end portions being perpendicularly bent; a ground terminal arranged such that the ground terminal and the pair of signal terminals are arranged in a row, the ground terminal projecting at a position adjacent to the pair of signal terminals; and a shield disposed between the casing and the tip end portions of the pair of signal terminals.Type: GrantFiled: May 21, 2014Date of Patent: September 1, 2015Assignee: FUJITSU LIMITEDInventors: Yasushi Masuda, Akira Tamura, Satoshi Ohsawa
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Patent number: 9049789Abstract: There is provided a mounting adapter to be disposed between a socket and an electronic component when the electronic component is mounted with the socket. The mounting adapter includes a base having insulating property, a first electrode provided on a first surface of the base, the first surface facing the electronic component, the first electrode being to be in contact with an electric pad of the electronic component, a second electrode provided on a second surface of the base, the second electrode facing the socket, the second electrode being to be in contact with a conductor of the socket, and a through via that penetrates through the base and electrically connects the first electrode and the second electrode.Type: GrantFiled: March 18, 2013Date of Patent: June 2, 2015Assignee: FUJITSU LIMITEDInventors: Satoshi Ohsawa, Akira Tamura
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Patent number: 9019711Abstract: There is provided an electronic device that includes a housing including six sides at right angles to each other, a first side of the six sides including an opening, a first backplane arranged on a second side so as to oppose to the opening, a second backplane arranged on a third side adjacent to the second side, a circuit board which is inserted toward the first backplane through the opening to be coupled with both of the first backplane and the second backplane with use of a plurality of connectors, the circuit board including a specified corner, and a guide. The guide is configured to shift the circuit board toward the second backplane while the specified corner slides with contacting a portion of the guide which is arranged on a fourth side of the six sides opposed to the third side.Type: GrantFiled: March 13, 2012Date of Patent: April 28, 2015Assignee: Fujitsu LimitedInventor: Akira Tamura
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Patent number: D944860Type: GrantFiled: August 7, 2020Date of Patent: March 1, 2022Assignee: Kubota CorporationInventors: Takayuki Ichikawa, Takahito Uemura, Satoshi Watanabe, Akira Tamura, Shota Hatada
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Patent number: D969169Type: GrantFiled: October 8, 2018Date of Patent: November 8, 2022Assignee: Kubota CorporationInventors: Takayuki Ichikawa, Satoshi Sugimoto, Takahito Uemura, Satoshi Watanabe, Akira Tamura