Patents by Inventor Akira Tamura

Akira Tamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240044283
    Abstract: Provided is an electronic fuel injection type diesel engine capable of performing precise electronic fuel injection control. A fuel injector includes a main body portion having a large diameter, a nozzle portion having a small diameter, and a pressing surface formed at a step portion between the main body portion and the nozzle portion, in which the nozzle portion of the fuel injector is inserted from an inside of a sleeve into an inside of an insertion hole, the fuel injector is pressed toward a vortex chamber by a pressing force, and the pressing force applied to the fuel injector is received by a pressure receiving surface of the sleeve from the pressing surface of the fuel injector via the washer.
    Type: Application
    Filed: October 25, 2021
    Publication date: February 8, 2024
    Inventors: Hiroki OSO, Yuki TAGASHIRA, Akira TAMURA, Rina KANEKO, Kiichi SUEHIRO
  • Patent number: 11781501
    Abstract: To provide an engine head structure for “omission or shortening a fuel pipe that withstands a high pressure”, “simplification or omission of a support bracket for a fuel accumulator and/or a fuel injection device”, “reduction of the number of parts” by devising a fuel accumulator and a support structure therefor, and the like. An engine head structure has a support bracket for mounting a fuel accumulator including a joining portion with a fuel injection device on a cylinder head, is disposed on a side of the fuel injection device or between adjacent fuel injection devices. The support bracket includes a member having a mounting portion on which the fuel accumulator is placed and mounted, a mounting leg portion extending from the mounting portion and mounted on the cylinder head, and an aligning leg portion extending from the mounting portion for positioning the support bracket with respect to the cylinder head.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: October 10, 2023
    Assignee: KUBOTA CORPORATION
    Inventors: Akira Tamura, Kensuke Fujita, Hiroki Oso, Yasushi Kobayashi, Shingo Matsunobu, Mitsugu Okuda
  • Publication number: 20230008602
    Abstract: To provide an engine head structure for “omission or shortening a fuel pipe that withstands a high pressure”, “simplification or omission of a support bracket for a fuel accumulator and/or a fuel injection device”, “reduction of the number of parts” by devising a fuel accumulator and a support structure therefor, and the like. An engine head structure has a support bracket for mounting a fuel accumulator including a joining portion with a fuel injection device on a cylinder head, is disposed on a side of the fuel injection device or between adjacent fuel injection devices. The support bracket includes a member having a mounting portion on which the fuel accumulator is placed and mounted, a mounting leg portion extending from the mounting portion and mounted on the cylinder head, and an aligning leg portion extending from the mounting portion for positioning the support bracket with respect to the cylinder head.
    Type: Application
    Filed: March 8, 2021
    Publication date: January 12, 2023
    Inventors: Akira TAMURA, Kensuke FUJITA, Hiroki OSO, Yasushi KOBAYASHI, Shingo MATSUNOBU, Mitsugu OKUDA
  • Publication number: 20210290699
    Abstract: Object of the invention is to provide a novel, safe, and side effect-free ghrelin secretion promoter which is capable of exhibit secreting effect of ghrelin present in human body in a form of food that is familiar and easy to be taken in. Hypophagia (loss of appetite) can be remarkably improved by a familiar, easy and safe mean by taking a given lactic acid bacteria per se or fermented milk prepared using the same as a ghrelin secretion promoter.
    Type: Application
    Filed: July 13, 2017
    Publication date: September 23, 2021
    Applicant: Meiji Co., Ltd.
    Inventors: Akira Tamura, Satomi Koyama, Yukio Asami
  • Patent number: 10736220
    Abstract: A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: August 4, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Kazuaki Takao, Akira Tamura, Takashi Fukuda
  • Publication number: 20200107454
    Abstract: A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.
    Type: Application
    Filed: December 4, 2019
    Publication date: April 2, 2020
    Applicant: FUJITSU LIMITED
    Inventors: KAZUAKI TAKAO, Akira Tamura, Takashi Fukuda
  • Patent number: 10531572
    Abstract: A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: January 7, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Kazuaki Takao, Akira Tamura, Takashi Fukuda
  • Publication number: 20190269019
    Abstract: A substrate includes: a wiring substrate; a lower plate disposed below the wiring substrate; a canted coil spring disposed between the lower plate and the wiring substrate; an electronic component package disposed above the wiring substrate; a sheet disposed between the wiring substrate and the electronic component package and including a plurality of connection members that connects a plurality of first electrodes provided on an upper surface of the wiring substrate and a plurality of second electrodes provided on a lower surface of the electronic component package; an upper plate disposed on the electronic component package; and a coupling member that couples the lower plate and the upper plate, wherein the lower plate, the canted coil spring, the wiring substrate, the sheet, the electronic component package, and the upper plate are laminated and fixed in this order by coupling the lower plate and the upper plate by the coupling member.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 29, 2019
    Applicant: FUJITSU LIMITED
    Inventors: KAZUAKI TAKAO, Akira Tamura, Takashi Fukuda
  • Patent number: 10076707
    Abstract: A game system including a server device connected to a network and one or more terminal devices operated by users and executing a video game that a player character plays a quest in a game space which has a quest data storing unit which stores quest data, a playing status storing unit which stores playing status of the quest, a quest control unit which permits the start of the quest and a hint control unit which notifies the information for the starting conditions. The playing status storing unit acquires the playing status from the quest control unit and updates the playing status, and the hint control unit determines the information for the starting conditions based on the playing status.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: September 18, 2018
    Assignee: CAPCOM CO., LTD.
    Inventors: Kento Kinoshita, Seiji Hamajima, Akira Tamura
  • Patent number: 9716353
    Abstract: A disclosed coaxial connector includes: an external conductor having a cylindrical shape to be screwed together with a counterpart connector including a circular opening end, the external conductor having a contact surface provided on inner periphery of the external conductor, with which the opening end comes into contact, and also having a slit formed to allow the external conductor to stretch and shrink in a longitudinal direction of the external conductor; and a center conductor provided coaxial with the external conductor, the center conductor having a length long enough to reach a substrate on which the counterpart connector is provided upright.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: July 25, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Yoko Murata, Akira Tamura
  • Publication number: 20170072313
    Abstract: A game system including a server device connected to a network and one or more terminal devices operated by users and executing a video game that a player character plays a quest in a game space which has a quest data storing unit which stores quest data, a playing status storing unit which stores playing status of the quest, a quest control unit which permits the start of the quest and a hint control unit which notifies the information for the starting conditions. The playing status storing unit acquires the playing status from the quest control unit and updates the playing status, and the hint control unit determines the information for the starting conditions based on the playing status.
    Type: Application
    Filed: February 24, 2015
    Publication date: March 16, 2017
    Applicant: CAPCOM CO., LTD.
    Inventors: Kento KINOSHITA, Seiji HAMAJIMA, Akira TAMURA
  • Patent number: 9474147
    Abstract: A disclosed socket for a semiconductor component includes a plate-shaped insulator having a first main surface and a second main surface, where a through hole being formed in the insulator, a terminal inserted in the through hole, the terminal having one end configured to be connected to a signal electrode of the semiconductor component and having another end configured to be connected to a signal electrode of a printed circuit board, and a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and configured to be connected to a ground electrode of the semiconductor component, and a second contact protruding from the second main surface and configured to be connected to a ground electrode of the printed circuit board.
    Type: Grant
    Filed: April 13, 2015
    Date of Patent: October 18, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Yasushi Masuda, Akira Tamura, Yoshihiro Morita, Satoshi Ohsawa
  • Publication number: 20160294129
    Abstract: A disclosed coaxial connector includes: an external conductor having a cylindrical shape to be screwed together with a counterpart connector including a circular opening end, the external conductor having a contact surface provided on inner periphery of the external conductor, with which the opening end comes into contact, and also having a slit formed to allow the external conductor to stretch and shrink in a longitudinal direction of the external conductor; and a center conductor provided coaxial with the external conductor, the center conductor having a length long enough to reach a substrate on which the counterpart connector is provided upright.
    Type: Application
    Filed: March 14, 2016
    Publication date: October 6, 2016
    Applicant: FUJITSU LIMITED
    Inventors: Yoko Murata, Akira Tamura
  • Patent number: 9252513
    Abstract: A socket includes a plurality of coupling members that each include a first end portion and a second end portion, the coupling members being made of electrically conductive material, wherein a terminal of an electronic component and a terminal of a board are electrically coupled with the first end portion and the second end portion, respectively, so to electrically connect the terminal of the electronic component and the terminal of the board, a holding member that holds the plurality of coupling members in such a manner that the plurality of coupling members are not in contact with each other, the holding member being made form an electrical insulating material, and a sheet member that is in contact with the electronic component and the board in parts between the plurality of coupling members, the sheet member being made from a material which is electrical insulating and thermal diffusive.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: February 2, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Yasushi Masuda, Akira Tamura, Yoshihiro Morita, Satoshi Ohsawa
  • Publication number: 20150359122
    Abstract: A disclosed socket for a semiconductor component includes a plate-shaped insulator having a first main surface and a second main surface, where a through hole being formed in the insulator, a terminal inserted in the through hole, the terminal having one end configured to be connected to a signal electrode of the semiconductor component and having another end configured to be connected to a signal electrode of a printed circuit board, and a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and configured to be connected to a ground electrode of the semiconductor component, and a second contact protruding from the second main surface and configured to be connected to a ground electrode of the printed circuit board.
    Type: Application
    Filed: April 13, 2015
    Publication date: December 10, 2015
    Inventors: Yasushi Masuda, Akira Tamura, YOSHIHIRO MORITA, Satoshi Ohsawa
  • Patent number: 9124039
    Abstract: A connector includes: a casing; a pair of signal terminals that have respective tip end portions, the pair of signal terminals projecting from the casing, the tip end portions being perpendicularly bent; a ground terminal arranged such that the ground terminal and the pair of signal terminals are arranged in a row, the ground terminal projecting at a position adjacent to the pair of signal terminals; and a shield disposed between the casing and the tip end portions of the pair of signal terminals.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: September 1, 2015
    Assignee: FUJITSU LIMITED
    Inventors: Yasushi Masuda, Akira Tamura, Satoshi Ohsawa
  • Patent number: 9049789
    Abstract: There is provided a mounting adapter to be disposed between a socket and an electronic component when the electronic component is mounted with the socket. The mounting adapter includes a base having insulating property, a first electrode provided on a first surface of the base, the first surface facing the electronic component, the first electrode being to be in contact with an electric pad of the electronic component, a second electrode provided on a second surface of the base, the second electrode facing the socket, the second electrode being to be in contact with a conductor of the socket, and a through via that penetrates through the base and electrically connects the first electrode and the second electrode.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: June 2, 2015
    Assignee: FUJITSU LIMITED
    Inventors: Satoshi Ohsawa, Akira Tamura
  • Patent number: 9019711
    Abstract: There is provided an electronic device that includes a housing including six sides at right angles to each other, a first side of the six sides including an opening, a first backplane arranged on a second side so as to oppose to the opening, a second backplane arranged on a third side adjacent to the second side, a circuit board which is inserted toward the first backplane through the opening to be coupled with both of the first backplane and the second backplane with use of a plurality of connectors, the circuit board including a specified corner, and a guide. The guide is configured to shift the circuit board toward the second backplane while the specified corner slides with contacting a portion of the guide which is arranged on a fourth side of the six sides opposed to the third side.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: April 28, 2015
    Assignee: Fujitsu Limited
    Inventor: Akira Tamura
  • Patent number: D944860
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: March 1, 2022
    Assignee: Kubota Corporation
    Inventors: Takayuki Ichikawa, Takahito Uemura, Satoshi Watanabe, Akira Tamura, Shota Hatada
  • Patent number: D969169
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: November 8, 2022
    Assignee: Kubota Corporation
    Inventors: Takayuki Ichikawa, Satoshi Sugimoto, Takahito Uemura, Satoshi Watanabe, Akira Tamura