Patents by Inventor Akira Tamura
Akira Tamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7980861Abstract: A second electrically-conductive terminal, having flexibility, contact with a first electrically-conductive terminal. A second substrate has first and second surfaces. The second surface supports the second electrically-conductive terminal. A third electrically-conductive terminal, having flexibility, is located on the first surface of the second substrate. The third electrically-conductive terminal is connected to the second electrically-conductive terminal. A fourth electrically-conductive terminal contacts with the third electrically-conductive terminal. A third substrate has a surface supporting the fourth electrically-conductive terminal. A frame is interposed between the first substrate and the third substrate. The frame supports the outer periphery of the second substrate. The frame allows relative movement of the second substrate in the direction perpendicular to the first surface of the second substrate.Type: GrantFiled: April 22, 2010Date of Patent: July 19, 2011Assignee: Fujitsu LimitedInventor: Akira Tamura
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Publication number: 20110086521Abstract: An inserting connector includes a plurality of plug electrodes where plug connecting terminals are provided at first ends of the plug electrodes and plug terminals are provided at second ends of the plug electrodes, the plug connecting terminals being configured to be connected to a board, the plug terminals being configured to be connected to jack terminals; wherein the plug connecting terminals extend in a direction perpendicular to a surface of the board; the plug terminals extend in a movable direction where the plug terminals are attached to or detached from the jack terminals; the plug electrodes are bent at an angle ? in longitudinal directions of the plug electrodes, the angle ? being greater than 0 degrees and less than 90 degrees.Type: ApplicationFiled: September 17, 2010Publication date: April 14, 2011Applicants: FUJITSU COMPONENT LIMITED, FUJITSU LIMITEDInventors: Yasuyuki Miki, Mitsuru Kobayashi, Hiroshi Tajiri, Takahiro Kondou, Koji Ishikawa, Akira Tamura
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Publication number: 20110073355Abstract: An interposer for connecting a semiconductor and a circuit board includes an insulating material sheet, a through hole which is formed in the insulating material sheet and an elastic conductive contact which is formed from an elastic conductive sheet and provided in the through hole.Type: ApplicationFiled: September 17, 2010Publication date: March 31, 2011Applicant: FUJITSU LIMITEDInventor: Akira TAMURA
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Publication number: 20110070749Abstract: There is provided a card connector for electrically coupling a card with a motherboard. The card connector includes a housing to and from which a contact pad of the card is inserted and ejected, where the housing is mountable on the motherboard; a pair of contacts is configured to hold the card between the pair of the contacts and to be electrically coupled with the contact pads of the card inserted into the housing, and extend in a first direction, and a pair of urging members is configured in the housing to force the pair of the contacts toward the card and extend in a second direction opposite to the first direction.Type: ApplicationFiled: September 21, 2010Publication date: March 24, 2011Applicant: FUJITSU LIMITEDInventors: Satoshi OSAWA, Akira TAMURA
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Publication number: 20110059631Abstract: A connector includes a movable conductive element and an elastic body. The connector electrically conducts between opposed external electrodes disposed vertically. The movable conductive element has a pair of rigid contact. And the elastic body deforms elastically to receive the load caused by the movement of the movable conductive element.Type: ApplicationFiled: August 20, 2010Publication date: March 10, 2011Applicant: FUJITSU LIMITEDInventor: Akira TAMURA
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Publication number: 20110003488Abstract: A connector conducting electricity between external electrodes while the connector is being compressed, the connector including: a columnar main body made of an elastic dielectric; a first contact terminal made of an inelastic conductor including first and second electrode sections provided on a top surface and a side surface of the columnar main body and a coupling section interconnecting the first and second electrode sections; a second contact terminal made of an inelastic conductor including third and fourth electrode sections provided on a bottom surface and a side surface of the columnar main body and a coupling section interconnecting the third and fourth electrode sections, the fourth electrode section being disposed in a position in which the fourth electrode section does not contact the second electrode section; and a conductor provided outside the main body and conducting electricity between the second and fourth electrode sections.Type: ApplicationFiled: June 23, 2010Publication date: January 6, 2011Applicant: FUJITSU LIMITEDInventor: Akira TAMURA
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Publication number: 20100226099Abstract: An electronic apparatus includes a cabinet which includes a first face capable of being opened, a second face vertical relative to the first face, and a third face facing the second face, a first connector which is disposed over the second face inside the cabinet and a fitting face of which faces the third face, and a substrate unit which includes a second connector fitted with the first connector, a first edge included in the second connector, a second edge on an opposite side of the first edge, and an engaging part disposed on the second edge.Type: ApplicationFiled: March 4, 2010Publication date: September 9, 2010Applicant: FUJITSU LIMITEDInventors: Takahiro KONDOU, Koji ISHIKAWA, Akira TAMURA
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Publication number: 20100200280Abstract: A second electrically-conductive terminal, having flexibility, contact with a first electrically-conductive terminal. A second substrate has first and second surfaces. The second surface supports the second electrically-conductive terminal. A third electrically-conductive terminal, having flexibility, is located on the first surface of the second substrate. The third electrically-conductive terminal is connected to the second electrically-conductive terminal. A fourth electrically-conductive terminal contacts with the third electrically-conductive terminal. A third substrate has a surface supporting the fourth electrically-conductive terminal. A frame is interposed between the first substrate and the third substrate. The frame supports the outer periphery of the second substrate. The frame allows relative movement of the second substrate in the direction perpendicular to the first surface of the second substrate.Type: ApplicationFiled: April 22, 2010Publication date: August 12, 2010Applicant: FUJITSU LIMITEDInventor: Akira TAMURA
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Patent number: 7730444Abstract: A structural analysis method that saves analysis time without lowering the prediction accuracy is provided. The structural analysis method has dividing up the analysis target into a plurality of finite elements; defining a plurality of meshes that divide up the analysis target into units larger than the finite elements and calculating, for each mesh, the proportion of one material among the plurality of materials that occupy the finite element contained in the mesh; specifying a mesh in which the calculated proportion of the one material exceeds a predetermined threshold value and generating mesh data by substituting material information specifying materials other than the one material with material information of the materials of the finite elements contained in the specified mesh; and calculating the physical amount yielded in the analysis target on the basis of the generated mesh data.Type: GrantFiled: October 27, 2005Date of Patent: June 1, 2010Assignee: Fujitsu LimitedInventors: Nobutaka Itoh, Tetsuyuki Kubota, Mami Nakadate, Akira Tamura
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Patent number: 7637783Abstract: A connector is disclosed that includes a housing having a space into which an object to be connected is inserted and a contact member incorporated in the housing. The contact member includes a first contact part and a second contact part. The first and second contact parts are aligned to come into contact with the pad of the object to be connected. The first contact part is positioned closer to the entrance of the space than the second contact part is. The first contact part and the second contact part face the space. The contact member includes a main body part, a first contact arm part having the first contact part, and a second contact arm part having the second contact part. The first contact arm part and the second contact arm part extend from first and second separate portions, respectively, of the main body part.Type: GrantFiled: August 4, 2008Date of Patent: December 29, 2009Assignees: Fujitsu Component Limited, Fujitsu LimitedInventors: Chiharu Sasaoka, Hideo Miyazawa, Mitsuru Kobayashi, Koki Sato, Akira Tamura, Koji Ishikawa, Yasushi Masuda
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Publication number: 20090209142Abstract: A connector is disclosed that includes a housing having a space into which an object to be connected is inserted and a contact member incorporated in the housing. The contact member includes a first contact part and a second contact part. The first and second contact parts are aligned to come into contact with the pad of the object to be connected. The first contact part is positioned closer to the entrance of the space than the second contact part is. The first contact part and the second contact part face the space. The contact member includes a main body part, a first contact arm part having the first contact part, and a second contact arm part having the second contact part. The first contact arm part and the second contact arm part extend from first and second separate portions, respectively, of the main body part.Type: ApplicationFiled: August 4, 2008Publication date: August 20, 2009Inventors: Chiharu Sasaoka, Hideo Miyazawa, Mitsuru Kobayashi, Koki Sato, Akira Tamura, Koji Ishikawa, Yasushi Masuda
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Patent number: 7181722Abstract: A method of dividing a circuit pattern for creating complementary stencil masks corresponding to complementary patterns, the method comprising a step of dividing a circuit pattern into a plurality of complementary patterns including a first complementary pattern comprising a pattern of a cantilevered beam member having a support portion width W1 and a length L1, and a second complementary pattern comprising a pattern of a both end-supported beam member having a support portion width W2 and a length L2. The dividing of the circuit pattern is performed in a manner that a aspect ratio A1 (L1/W1) of the pattern of the cantilevered beam member is confined to not more than 100, and that a aspect ratio A2 (L2/W2) of the pattern of the both end-supported beam member is confined to not more than 150.Type: GrantFiled: September 24, 2004Date of Patent: February 20, 2007Assignee: Toppan Printing Co., Ltd.Inventors: Hideyuki Eguchi, Takashi Yoshii, Hiroshi Sugimura, Akira Tamura
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Publication number: 20060173660Abstract: A structural analysis method that saves analysis time without lowering the prediction accuracy is provided. The structural analysis method has dividing up the analysis target into a plurality of finite elements; defining a plurality of meshes that divide up the analysis target into units larger than the finite elements and calculating, for each mesh, the proportion of one material among the plurality of materials that occupy the finite element contained in the mesh; specifying a mesh in which the calculated proportion of the one material exceeds a predetermined threshold value and generating mesh data by substituting material information specifying materials other than the one material with material information of the materials of the finite elements contained in the specified mesh; and calculating the physical amount yielded in the analysis target on the basis of the generated mesh data.Type: ApplicationFiled: October 27, 2005Publication date: August 3, 2006Applicant: FUJITSU LIMITEDInventors: Nobutaka Itoh, Tetsuyuki Kubota, Mami Nakadate, Akira Tamura
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Patent number: 7052568Abstract: A retreading method wherein a base composition and a cap composition are applied to a carcass (10) as two ribbons (14) and (16) extruded from separate extruders (18) and (20). The ribbons (14) and (16) can be layered and applied to a ready-to-retread carcass (10) simultaneously or, alternatively, the base ribbon (14) can be applied to the ready-to-retread carcass (10) first and the cap ribbon (16) applied thereafter. The carcass (10), with ribbons (14/16) applied thereto, is then inserted into an enclosed heated mold (22) and cured to complete the retread.Type: GrantFiled: October 28, 2002Date of Patent: May 30, 2006Assignee: Bridgestone Firestone North American Tire, LLCInventors: Akira Tamura, Tomizo Kiyosue
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Publication number: 20050079426Abstract: A method of dividing a circuit pattern for creating complementary stencil masks corresponding to complementary patterns, the method comprising a step of dividing a circuit pattern into a plurality of complementary patterns including a first complementary pattern comprising a pattern of a cantilevered beam member having a support portion width W1 and a length L1, and a second complementary pattern comprising a pattern of a both end-supported beam member having a support portion width W2 and a length L2. The dividing of the circuit pattern is performed in a manner that a aspect ratio A1 (L1/W1) of the pattern of the cantilevered beam member is confined to not more than 100, and that a aspect ratio A2 (L2/W2) of the pattern of the both end-supported beam member is confined to not more than 150.Type: ApplicationFiled: September 24, 2004Publication date: April 14, 2005Applicant: Toppan Printing Co., Ltd.Inventors: Hideyuki Eguchi, Takashi Yoshii, Hiroshi Sugimura, Akira Tamura
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Publication number: 20040079470Abstract: A retreading method wherein a base composition and a cap composition are applied to a carcass (10) as two ribbons (14) and (16) extruded from separate extruders (18) and (20). The ribbons (14) and (16) can be layered and applied to a ready-to-retread carcass (10) simultaneously or, alternatively, the base ribbon (14) can be applied to the ready-to-retread carcass (10) first and the cap ribbon (16) applied thereafter. The carcass (10), with ribbons (14/16) applied thereto, is then inserted into an enclosed heated mold (22) and cured to complete the retread.Type: ApplicationFiled: October 28, 2002Publication date: April 29, 2004Inventors: Akira Tamura, Tomizo Kiyosue
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Patent number: 6638666Abstract: A substrate for a transfer mask, which comprises a first silicon layer formed of monocrystalline silicon, a silicon oxide film formed on the first silicon layer and having a thickness ranging from 0.2 to 0.8 &mgr;m, and a second silicon layer formed on the silicon oxide film. A transfer mask which is manufactured by making use of this substrate is featured in that it is possible to prevent a transfer pattern from being cracked or destroyed due to stress from the silicon oxide film on the occasion of manufacturing the transfer mask, thereby providing a defect-free transfer mask.Type: GrantFiled: January 23, 2002Date of Patent: October 28, 2003Assignee: Toppan Printing Co., Ltd.Inventors: Toshio Konishi, Akira Tamura, Kojiro Ito, Yushin Sasaki, Hideyuki Eguchi
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Patent number: 6551113Abstract: A connector comprises at least a first conductive layer in a first connector half and a plurality of second conductive layers in a second connector half. The second conductive layers are alternated with the first conductive layer when the second connector half is coupled with the first connector half. A plurality of signal lines are arranged between the first and second conductive layers. The first and second conductive layers in combination serve to establish a so-called strip line. Since the first and second conductive layers are adapted to function as ground or shield plates to absorb noise of the respective signal lines, the signal lines can reliably be shielded from noise caused by signals passing through the adjacent signal lines. Accordingly, it is possible to reduce the space between the adjacent signal lines so as to achieve a higher density of the signal lines.Type: GrantFiled: March 29, 2000Date of Patent: April 22, 2003Assignee: Fujitsu LimitedInventors: Takeshi Nishiyama, Akira Tamura
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Publication number: 20020060297Abstract: A substrate for a transfer mask, which comprises a first silicon layer formed of monocrystalline silicon, a silicon oxide film formed on the first silicon layer and having a thickness ranging from 0.2 to 0.8 &mgr;m, and a second silicon layer formed on the silicon oxide film. A transfer mask which is manufactured by making use of this substrate is featured in that it is possible to prevent a transfer pattern from being cracked or destroyed due to stress from the silicon oxide film on the occasion of manufacturing the transfer mask, thereby providing a defect-free transfer mask.Type: ApplicationFiled: January 23, 2002Publication date: May 23, 2002Applicant: Toppan Printing Co., Ltd.Inventors: Toshio Konishi, Akira Tamura, Kojiro Ito, Yushin Sasaki, Hideyuki Eguchi
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Publication number: 20020021557Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.Type: ApplicationFiled: October 2, 2001Publication date: February 21, 2002Applicant: Fujitsu Limited,Inventors: Junichi Ishimine, Masahiro Suzuki, Akira Tamura, Masahiro Miyo, Akihiko Fujisaki, Keizo Takemura, Jie Wei, Hisashi Kawashima, Yoshiaki Udagawa, Haruhiko Yamamoto, Masahiro Mochizuki