Patents by Inventor Akira Ueda

Akira Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6226180
    Abstract: The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
    Type: Grant
    Filed: May 22, 1997
    Date of Patent: May 1, 2001
    Assignee: Fujitsu Limited
    Inventors: Akira Ueda, Masumi Suzuki, Minoru Hirano, Toyokazu Hamaguchi, Shigeru Hidesawa
  • Patent number: 5965672
    Abstract: An unsaturated polyester resin composition contains a silicone-containing macro-azo-initiator and/or a silicone-containing block copolymer obtained by copolymerizing the silicone-containing macro-azo-initiator with a nonionic monomer.
    Type: Grant
    Filed: August 29, 1997
    Date of Patent: October 12, 1999
    Assignees: Osaka Municipal Government, Wako Pure Chemical Industries, Ltd.
    Inventors: Yasuyuki Agari, Masayuki Shimada, Akira Ueda, Hideo Takeuchi, Nobutaka Shimamura
  • Patent number: 5744559
    Abstract: A macro-azo initiator obtained by reacting a compound (A) having an azo group in the molecule and having a reactive functional group at each end of the molecule with a compound (B) having an azo group in the molecule and having at each end of the molecule a functional group reactive with the reactive functional groups of the compound (A), is effective for a polymerization process of one or more vinyl monomers and a production process of a block polymer.
    Type: Grant
    Filed: September 8, 1997
    Date of Patent: April 28, 1998
    Assignee: Wako Pure Chemical Industries, Ltd.
    Inventors: Susumu Nagai, Hisato Takahashi, Akira Ueda
  • Patent number: 5537291
    Abstract: The cooling device including a cold plate having an inside water passage through which a cooling water passes and having one surface provided with a cooling element corresponding to an integrated circuit element, a housing for fixing the cold plate to a substrate so that the cooling element is kept in close contact with the integrated circuit element, and a water leakage sensor provided inside the housing, is disclosed.
    Type: Grant
    Filed: December 30, 1994
    Date of Patent: July 16, 1996
    Assignee: Fujitsu Limited
    Inventors: Yasushi Onodera, Akira Ueda
  • Patent number: 5300276
    Abstract: The present invention relates to a process for preparing hydrogen gas from the reduction of water, and also relates to a process for determining the ratio of the masses between hydrogen isotopes in the obtained hydrogen gas. The invention provides a process of preparing hydrogen gas comprising steps of: (i) preparing zinc metal particles having a size approximately in the range of 1 mm-2 mm by dropping a mixture of a selected amount of liquified zinc metal and 10 to 10000 ppm of nickel elements into a water bath; and (ii) reacting a sample of water with zinc metal particles at a selected reaction temperature to perform the reduction reaction of the water. The invention also provides a process of determining the ratio of the masses between hydrogen isotopes, .sup.1 H and .sup.2 H, in a sample of water. This process comprises a step of preparing hydrogen gas from the sample by the novel method described above.
    Type: Grant
    Filed: April 3, 1992
    Date of Patent: April 5, 1994
    Assignee: Mitsubishi Materials Corporation
    Inventors: Akira Ueda, Yasuhiro Kubota, Tsutomu Araki
  • Patent number: 5252748
    Abstract: The radioactive iodine compound of this invention or an intermediate for preparing the compound is represented by the following formula (I): ##STR1## wherein R is H or .sup.125 I. The radioactive compound can readily introduce a radioactive isotope element such as .sup.125 I into an antibody molecule without damaging the activity of the antibody molecule. Therefore, the compound can preferably be used to label an antibody of immunoradiometric assay, and allow a higher degree of measurement sensitivity.
    Type: Grant
    Filed: December 2, 1991
    Date of Patent: October 12, 1993
    Assignee: Shionogi & Co., Ltd.
    Inventors: Akira Yamauchi, Akira Ueda, Masao Kono, Kenichi Igano, Ken Inouye
  • Patent number: 5211505
    Abstract: An expansion joint for bridge structure comprising a layer of composite consisted of rubber grains as the aggregates and synthetic resins with lower modulus of elasticity as the binder.
    Type: Grant
    Filed: December 28, 1990
    Date of Patent: May 18, 1993
    Assignee: Sho-Bond Corporation
    Inventor: Akira Ueda
  • Patent number: 4245053
    Abstract: A novel porous, weakly acidic, itaconic acid ion exchange resin and a process for its preparation are disclosed. The process comprises the copolymerization of the beta-monoalkyl ester of itaconic acid and a cross-linking agent such as divinyl benzene in the presence of a pore forming agent selected from the group consisting of aliphatic hydrocarbons of from 5 to 8 carbon atoms, alicyclic hydrocarbons of from 5 to 8 carbon atoms and halogenated hydrocarbons of from 1 to 3 carbon atoms, followed by hydrolysis of the resulting copolymer. The macroreticular itaconic acid ion exchange resin of this invention is characterized by an excellent combination of exchange capacity, heavy metals capturing capacity, ion exchange rate and gas adsorptive capacity.
    Type: Grant
    Filed: November 30, 1978
    Date of Patent: January 13, 1981
    Assignees: Pfizer Inc., City of Osaka
    Inventors: Susumu Nagai, Akira Ueda, Kuniei Toyoda