Patents by Inventor Akira Ushijima

Akira Ushijima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190210231
    Abstract: According to one embodiment, a gripping tool includes a gripper. The gripper is flexible. A granular material is provided in an interior of the gripper. The gripper is configured to grip a workpiece by being in close contact with the workpiece in a state in which an outer perimeter of the gripper is held, and by the interior of the gripper being depressurized.
    Type: Application
    Filed: March 21, 2019
    Publication date: July 11, 2019
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Emiko ISHIDA, Noriyuki OOBA, Hiromasa TAKAHASHI, Akira USHIJIMA
  • Publication number: 20180079082
    Abstract: A robot hand device according to an embodiment includes extensible arms which can be extended and shortened, a drive motor, and at least one clutch. The extensible arms support an object to be carried and are capable of being extended and shortened. The drive motor extends and shortens the extensible arms. The at least one clutch are capable of transmitting power of the motor to at least one of the extensible arms selected among the extensible arms to extend and shorten the selected at least one of the extensible arms.
    Type: Application
    Filed: September 1, 2017
    Publication date: March 22, 2018
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Hiromasa Takahashi, Noriyuki Ooba, Akira Ushijima, Emiko Ishida
  • Patent number: 9618802
    Abstract: According to one embodiment, an apparatus for manufacturing a display device, includes: a first holding section configured to hold a first substrate; a second holding section configured to hold a second substrate; a turning section configured to turn the first holding section such that the first substrate and the second substrate face each other; an elevation unit configured to elevate the second holding section and attach the first substrate and the second substrate via an adhesive layer; and a first radiation section configured to radiate ultraviolet rays from at least one direction of an inclined lower side of an opening of a space between the first substrate and the second substrate and an inclined upper side of the opening toward the opening.
    Type: Grant
    Filed: September 16, 2013
    Date of Patent: April 11, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takeshi Matsuura, Akira Ushijima, Kentaro Miyazaki, Takeshi Toyoshima, Takahide Miyahara, Takeshi Morita
  • Publication number: 20140284452
    Abstract: According to one embodiment, an apparatus for manufacturing a display device, includes: a first holding section configured to hold a first substrate; a second holding section configured to hold a second substrate; a turning section configured to turn the first holding section such that the first substrate and the second substrate face each other; an elevation unit configured to elevate the second holding section and attach the first substrate and the second substrate via an adhesive layer; and a first radiation section configured to radiate ultraviolet rays from at least one direction of an inclined lower side of an opening of a space between the first substrate and the second substrate and an inclined upper side of the opening toward the opening.
    Type: Application
    Filed: September 16, 2013
    Publication date: September 25, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takeshi MATSUURA, Akira Ushijima, Kentaro Miyazaki, Takeshi Toyoshima, Takahide Miyahara, Takeshi Morita
  • Patent number: 8142611
    Abstract: A semiconductor-chip exfoliating device for exfoliating a semiconductor chip 1 from an adhesive sheet 6 is provided. The device includes a backup holder 28 for holding the adhesive sheet 6 so that semiconductor chips 1 turn upward, a pair of needle pins arranged on a backside of the holder 28 to lift off the adhesive sheet 6 from the holder 28 through through-holes 31a, 31b in the holder 28 and a sliding unit 33 arranged on the backside of the holder 28 to slide one needle pin 30b in a direction to depart from the other needle pin 30a. By the sliding unit 33, the interval between the needle pins 30a, 30b can be changed so as to cope with a variation of semiconductor chips 1, 1A.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: March 27, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Motojiro Shibata, Akira Ushijima
  • Patent number: 8098284
    Abstract: A measuring device includes an actuator which holds a lens unit and moves the lens unit in the direction of the optical axis thereof. A test chart is photographed, with the lens unit being opposed to a reference image pickup device, and the lens unit is positioned at a just-focus position. The gap between the reference image pickup device and the lens unit at this time is reproduced, and an image pickup device, which is to be integrated, and the lens unit are opposed with this gap, and are fixed.
    Type: Grant
    Filed: November 5, 2009
    Date of Patent: January 17, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akira Ushijima, Takeshi Karuishi
  • Patent number: 7781323
    Abstract: In a semiconductor device manufacturing method which includes a mounting a semiconductor element having a bonding electrode on a substrate, the mounting includes supplying solder paste containing Au—Sn series solder particles onto the substrate, putting the semiconductor element having a film of an Sn alloy or Sn formed on the bonding electrode on the solder paste, and melting the Au—Sn series solder particles and the film of the Sn alloy or Sn to bond the semiconductor element to the substrate.
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: August 24, 2010
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kazuo Shimokawa, Akira Ushijima
  • Publication number: 20100118157
    Abstract: A measuring device includes an actuator which holds a lens unit and moves the lens unit in the direction of the optical axis thereof. A test chart is photographed, with the lens unit being opposed to a reference image pickup device, and the lens unit is positioned at a just-focus position. The gap between the reference image pickup device and the lens unit at this time is reproduced, and an image pickup device, which is to be integrated, and the lens unit are opposed with this gap, and are fixed.
    Type: Application
    Filed: November 5, 2009
    Publication date: May 13, 2010
    Inventors: Akira Ushijima, Takeshi Karuishi
  • Publication number: 20080227239
    Abstract: A semiconductor-chip exfoliating device for exfoliating a semiconductor chip 1 from an adhesive sheet 6 is provided. The device includes a backup holder 28 for holding the adhesive sheet 6 so that semiconductor chips 1 turn upward, a pair of needle pins arranged on a backside of the holder 28 to lift off the adhesive sheet 6 from the holder 28 through through-holes 31a, 31b in the holder 28 and a sliding unit 33 arranged on the backside of the holder 28 to slide one needle pin 30b in a direction to depart from the other needle pin 30a. By the sliding unit 33, the interval between the needle pins 30a, 30b can be changed so as to cope with a variation of semiconductor chips 1, 1A.
    Type: Application
    Filed: March 14, 2008
    Publication date: September 18, 2008
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Motojiro SHIBATA, Akira Ushijima
  • Publication number: 20060214274
    Abstract: In a semiconductor device manufacturing method which includes a mounting a semiconductor element having a bonding electrode on a substrate, the mounting includes supplying solder paste containing Au—Sn series solder particles onto the substrate, putting the semiconductor element having a film of an Sn alloy or Sn formed on the bonding electrode on the solder paste, and melting the Au—Sn series solder particles and the film of the Sn alloy or Sn to bond the semiconductor element to the substrate.
    Type: Application
    Filed: March 22, 2006
    Publication date: September 28, 2006
    Inventors: Kazuo Shimokawa, Akira Ushijima
  • Publication number: 20040218636
    Abstract: A laser apparatus comprises a semiconductor laser element which emits a light beam with a spread in a slow-axis direction and a fast-axis direction, a fast-axis collimating lens which controls the spread in the fast-axis direction of the light beam emitted from the semiconductor laser element, a reflector which returns the light beam emitted in the slow-axis direction in a specific angle range to the semiconductor laser element, a reflector supporting member which supports the reflector, and a side support member which supports the fast-axis collimating lens and the reflector supporting member in the slow-axis direction with respect to the semiconductor laser element.
    Type: Application
    Filed: March 4, 2004
    Publication date: November 4, 2004
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Noriyasu Kashima, Akira Ushijima, Kazuhito Higuchi, Takashi Togasaki, Tooru Sugiyama