Abstract: A semiconductor-chip exfoliating device for exfoliating a semiconductor chip 1 from an adhesive sheet 6 is provided. The device includes a backup holder 28 for holding the adhesive sheet 6 so that semiconductor chips 1 turn upward, a pair of needle pins arranged on a backside of the holder 28 to lift off the adhesive sheet 6 from the holder 28 through through-holes 31a, 31b in the holder 28 and a sliding unit 33 arranged on the backside of the holder 28 to slide one needle pin 30b in a direction to depart from the other needle pin 30a. By the sliding unit 33, the interval between the needle pins 30a, 30b can be changed so as to cope with a variation of semiconductor chips 1, 1A.

Abstract: In a semiconductor device manufacturing method which includes a mounting a semiconductor element having a bonding electrode on a substrate, the mounting includes supplying solder paste containing Au—Sn series solder particles onto the substrate, putting the semiconductor element having a film of an Sn alloy or Sn formed on the bonding electrode on the solder paste, and melting the Au—Sn series solder particles and the film of the Sn alloy or Sn to bond the semiconductor element to the substrate.

Abstract: A laser apparatus comprises a semiconductor laser element which emits a light beam with a spread in a slow-axis direction and a fast-axis direction, a fast-axis collimating lens which controls the spread in the fast-axis direction of the light beam emitted from the semiconductor laser element, a reflector which returns the light beam emitted in the slow-axis direction in a specific angle range to the semiconductor laser element, a reflector supporting member which supports the reflector, and a side support member which supports the fast-axis collimating lens and the reflector supporting member in the slow-axis direction with respect to the semiconductor laser element.