Patents by Inventor Akira Yamauchi

Akira Yamauchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11171617
    Abstract: A power amplifying device according to an embodiment includes first to fourth BTL amplifiers and first to third switch circuits. The first to fourth BTL amplifiers outputs a first to fourth output signal. The first switch circuit is turned on or off connection between an output of the second output amplifier and an output of the third output amplifier. The second switch circuit is turned on or off connection between an output of the fifth output amplifier and an output of the eighth output amplifier. The third switch circuit is turned on or off connection between an output of the fourth output amplifier and an output of the seventh output amplifier. The first to third switch circuits are turned on when the amplitudes of the first to fourth input signals are smaller than a first threshold.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: November 9, 2021
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices and Storage Corporation
    Inventors: Akira Yamauchi, Hiroyuki Tsurumi
  • Publication number: 20210320024
    Abstract: This substrate bonding device (100) includes: a stage (401), a head (402), an electrostatic chuck that holds a peripheral portion of a substrate (301) while the stage (401) supports the substrate (301), a holder driver that drives the electrostatic chuck, and a controller (700). The electrostatic chuck is disposed in a first area on the stage (401) facing the peripheral portion of the substrate (301), and the holder driver drives the electrostatic chuck by applying voltage to the electrostatic chuck. The controller (700) controls the holder driver in such a manner that a peripheral portion of the substrate (301) is released from the electrostatic chuck when a peripheral portion of the substrate (301) is made to come into contact with a peripheral portion of the substrate (302) while a central portion of a bonding surface of the substrate (301) and a central portion of a bonding surface of the substrate (302) are in contact with each other.
    Type: Application
    Filed: July 2, 2019
    Publication date: October 14, 2021
    Applicant: BONDTECH CO., LTD.
    Inventor: Akira YAMAUCHI
  • Publication number: 20210313211
    Abstract: This chip mounting system simultaneously images an alignment mark disposed on a substrate (WT) and an alignment mark disposed on a chip (CP), with the alignment marks disposed on the substrate (WT) and the chip (CP) being separated by a first distance at which the alignment marks fall within a depth-of-field range of imaging devices (35a, 35b). The chip mounting system calculates a relative positional deviation amount between the substrate (WT) and the chip (CP) from the imaged images of the alignment marks imaged by the imaging devices (35a, 35b) and, based on the calculated positional deviation amount, relatively moves the chip (CP) with respect to the substrate (WT) in a direction in which the positional deviation amount therebetween decreases.
    Type: Application
    Filed: November 15, 2018
    Publication date: October 7, 2021
    Applicant: BONDTECH CO., LTD.
    Inventor: Akira YAMAUCHI
  • Publication number: 20210297045
    Abstract: A power amplifying device according to an embodiment includes three or more BTL amplifiers and a closed loop section. The three or more BTL amplifiers include bridge-connected first and second output amplifiers and output a first output signal obtained by amplifying a first input signal. Switch circuits respectively corresponding to the three or more BTL amplifiers are connected in series in the closed loop section. The closed loop section is capable of forming a closed loop. An output terminal of the second output amplifier is connected to one end of the switch circuit corresponding to the second output amplifier. The switch circuit is turned on to establish connection between an output terminal of the first output amplifier and the output terminal of the second output amplifier and is turned off to break the connection between the output terminals.
    Type: Application
    Filed: September 11, 2020
    Publication date: September 23, 2021
    Inventors: Akira Yamauchi, Hiroyuki Tsurumi
  • Publication number: 20210265300
    Abstract: A chip bonding system including an activation treatment device including a frame holder and a particle beam source that irradiates a sheet, to which a chip held by the frame holder is stuck, with a particle beam, to thereby activate a bonding surface of the chip; and a bonding device that brings the chip, of which the bonding surface is activated by the activation treatment device, into contact with a substrate, to thereby bond the chip to the substrate. The frame holder supports a holding frame in a posture in which one side, to which the chip is stuck, in the sheet, of the holding frame that holds the sheet TE, which is formed of a resin, and to which the chip is stuck, is exposed to the particle beam source.
    Type: Application
    Filed: November 14, 2018
    Publication date: August 26, 2021
    Applicants: BONDTECH CO., LTD.
    Inventors: Akira YAMAUCHI, Tadatomo SUGA
  • Publication number: 20210054061
    Abstract: Provided is a substance capable of effectively suppressing cancer metastasis or a pharmaceutical composition that effectively acts on an inflammatory disease. The pharmaceutical composition is a pharmaceutical composition containing, as an active ingredient, an antibody or an antibody fragment thereof having antigen-binding activity for an S100A8/A9 heterodimer, and blocks interaction between S100A8/A9 and a group of receptors therefor, to thereby strongly suppress cancer metastasis both in vitro and in vivo, or alleviate inflammation. That is, the anti-S100A8/A9 antibody or the antibody fragment thereof can strongly suppress cancer metastasis or alleviate inflammation, by virtue of its blocking action on the interaction between S100A8/A9 and the group of receptors therefor.
    Type: Application
    Filed: April 15, 2019
    Publication date: February 25, 2021
    Applicants: National University Corporation Okayama University, NIIGATA UNIVERSITY, National University Corporation Gunma University, Kawasaki Gakuen Educational Foundation
    Inventors: Masakiyo SAKAGUCHI, Shinichi TOYOOKA, Shuta TOMIDA, Kazuhiko SHIEN, Hiroki SATO, Rie KINOSHITA, Junichiro FUTAMI, Kota ARAKI, Mikio OKAZAKI, Eisaku KONDO, Yusuke INOUE, Akira YAMAUCHI
  • Publication number: 20200411214
    Abstract: A glass structure includes a glass plate; a connecting member placed on one surface of the glass plate, and is electrically connected to a conductor placed on the glass plate or placed in the vicinity of the glass plate, the connecting member including a connecting portion at one end thereof and a power supply portion at the other end thereof, and a portion other than the connecting portion and the power supply portion are covered by a resin portion; wherein the glass structure is adhered to a predetermined portion by an adhesive; and the glass structure including a base layer extending as a strip along the edge of the glass plate is placed on the surface of the glass plate and the surface of the resin portion of the connecting member, wherein the base layer including a resin primer layer, a glass primer layer and a sealant layer.
    Type: Application
    Filed: September 11, 2020
    Publication date: December 31, 2020
    Applicant: AGC Inc.
    Inventors: Masayuki SASE, Akira YAMAUCHI
  • Patent number: 10795559
    Abstract: A data positioning method includes obtaining positional information indicating a position which is designated by operation of an operation unit in any region among a plurality of regions, each of the plurality of regions corresponding to a predetermined direction along which values of a series of pieces of data are varied and being provided for designating a position of the series of pieces of data in the predetermined direction, and the plurality of regions include at least one region for designating a plurality of discrete positions of the series of pieces of data in the predetermined direction. The method further includes determining the position for designating a portion of data corresponding to the obtained positional information, any one position being determined among the plurality of discrete positions when positional information indicating a position in the region for designating the discrete positions is obtained.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: October 6, 2020
    Assignee: YAMAHA CORPORATION
    Inventor: Akira Yamauchi
  • Publication number: 20200162040
    Abstract: A power amplifying device according to an embodiment includes first to fourth BTL amplifiers and first to third switch circuits. The first to fourth BTL amplifiers outputs a first to fourth output signal. The first switch circuit is turned on or off connection between an output of the second output amplifier and an output of the third output amplifier. The second switch circuit is turned on or off connection between an output of the fifth output amplifier and an output of the eighth output amplifier. The third switch circuit is turned on or off connection between an output of the fourth output amplifier and an output of the seventh output amplifier. The first to third switch circuits are turned on when the amplitudes of the first to fourth input signals are smaller than a first threshold.
    Type: Application
    Filed: September 6, 2019
    Publication date: May 21, 2020
    Inventors: Akira Yamauchi, Hiroyuki Tsurumi
  • Patent number: 10580752
    Abstract: A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: March 3, 2020
    Assignee: BONDTECH CO., LTD.
    Inventor: Akira Yamauchi
  • Patent number: 10581422
    Abstract: A PWM modulator according to an embodiment includes a first comparator configured to compare a first input signal with a first carrier and output a comparison result, a second comparator configured to compare a second input signal with a second carrier and output a comparison result, and a selector configured to output the comparison result while switching between the comparison result of the first comparator and the comparison result of the second comparator in a cycle according to a cycle of the first or the second carrier.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: March 3, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akira Yamauchi, Toshikazu Fujii
  • Publication number: 20200006099
    Abstract: A chip mounting system (1) includes: a chip supplying unit (11) for supplying a chip (CP); a stage (31) for holding a substrate (WT) in an orientation in which a mounting face (WTf) for mounting the chip (CP) faces vertically downward (?Z direction); a head (33H) for holding the chip (CP) from the vertically downward direction (?Z direction); and a head drive unit (36) for, by causing vertically upward (+Z direction) movement of the head (33H) holding the chip (CP), causes the head (33H) to approach the stage (31) to mount the chip (CP) on the mounting face (WTf) of the substrate (WT).
    Type: Application
    Filed: January 31, 2018
    Publication date: January 2, 2020
    Applicant: BONDTECH CO., LTD.
    Inventor: Akira YAMAUCHI
  • Patent number: 10204785
    Abstract: A substrate bonding apparatus includes a vacuum chamber, a surface activation part for activating respective bonding surfaces of a first substrate and a second substrate, and stage moving mechanisms for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates. In order to activate the bonding surfaces in the vacuum chamber, the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: February 12, 2019
    Assignees: BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi
  • Patent number: 10166749
    Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: January 1, 2019
    Assignees: LAN TECHNICAL SERVICE CO., LTD., TADATOMO SUGA
    Inventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto
  • Publication number: 20180076806
    Abstract: A PWM modulator according to an embodiment includes a first comparator configured to compare a first input signal with a first carrier and output a comparison result, a second comparator configured to compare a second input signal with a second carrier and output a comparison result, and a selector configured to output the comparison result while switching between the comparison result of the first comparator and the comparison result of the second comparator in a cycle according to a cycle of the first or the second carrier.
    Type: Application
    Filed: February 27, 2017
    Publication date: March 15, 2018
    Inventors: Akira Yamauchi, Toshikazu Fujii
  • Publication number: 20180068854
    Abstract: A substrate bonding apparatus includes a vacuum chamber, a surface activation part for activating respective bonding surfaces of a first substrate and a second substrate, and stage moving mechanisms for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates. In order to activate the bonding surfaces in the vacuum chamber, the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates.
    Type: Application
    Filed: November 13, 2017
    Publication date: March 8, 2018
    Inventors: Tadatomo SUGA, Akira YAMAUCHI
  • Patent number: 9870922
    Abstract: A substrate bonding apparatus (100) includes a vacuum chamber (200), a surface activation part (610) for activating respective bonding surfaces of a first substrate (301) and a second substrate (302), and stage moving mechanisms (403, 404) for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates (301, 302). In order to activate the bonding surfaces in the vacuum chamber (200), the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates (301, 302).
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: January 16, 2018
    Assignees: BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi
  • Publication number: 20170277414
    Abstract: A data positioning method includes obtaining positional information indicating a position which is designated by operation of an operation unit in any region among a plurality of regions, each of the plurality of regions corresponding to a predetermined direction along which values of a series of pieces of data are varied and being provided for designating a position of the series of pieces of data in the predetermined direction, and the plurality of regions include at least one region for designating a plurality of discrete positions of the series of pieces of data in the predetermined direction. The method further includes determining the position for designating a portion of data corresponding to the obtained positional information, any one position being determined among the plurality of discrete positions when positional information indicating a position in the region for designating the discrete positions is obtained.
    Type: Application
    Filed: March 23, 2017
    Publication date: September 28, 2017
    Inventor: Akira YAMAUCHI
  • Publication number: 20170221856
    Abstract: A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain.
    Type: Application
    Filed: October 19, 2015
    Publication date: August 3, 2017
    Applicant: BONDTECH CO., LTD.
    Inventor: Akira YAMAUCHI
  • Patent number: 9692371
    Abstract: The current feedback output circuit includes first and second transistors. The current feedback output circuit includes a current amplifier that has a non-inverting input terminal, an inverting input terminal, a first output terminal and a second output terminal, an input impedance of the non-inverting input terminal being higher than an input impedance of the inverting input terminal, and flows a current obtained by amplifying the difference between a current of an input signal to the non-inverting input terminal and a current input to the inverting input terminal between the first output terminal and the second output terminal. The current feedback output circuit includes first to sixth current mirror circuits. The current feedback output circuit includes a current feedback circuit that supplies a current responsive to a voltage at the signal output terminal to the inverting input terminal.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: June 27, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akira Yamauchi, Hiroyuki Tsurumi