Abstract: This chip mounting system simultaneously images an alignment mark disposed on a substrate (WT) and an alignment mark disposed on a chip (CP), with the alignment marks disposed on the substrate (WT) and the chip (CP) being separated by a first distance at which the alignment marks fall within a depth-of-field range of imaging devices (35a, 35b). The chip mounting system calculates a relative positional deviation amount between the substrate (WT) and the chip (CP) from the imaged images of the alignment marks imaged by the imaging devices (35a, 35b) and, based on the calculated positional deviation amount, relatively moves the chip (CP) with respect to the substrate (WT) in a direction in which the positional deviation amount therebetween decreases.

Abstract: A power amplifying device according to an embodiment includes three or more BTL amplifiers and a closed loop section. The three or more BTL amplifiers include bridge-connected first and second output amplifiers and output a first output signal obtained by amplifying a first input signal. Switch circuits respectively corresponding to the three or more BTL amplifiers are connected in series in the closed loop section. The closed loop section is capable of forming a closed loop. An output terminal of the second output amplifier is connected to one end of the switch circuit corresponding to the second output amplifier. The switch circuit is turned on to establish connection between an output terminal of the first output amplifier and the output terminal of the second output amplifier and is turned off to break the connection between the output terminals.

Abstract: A chip bonding system including an activation treatment device including a frame holder and a particle beam source that irradiates a sheet, to which a chip held by the frame holder is stuck, with a particle beam, to thereby activate a bonding surface of the chip; and a bonding device that brings the chip, of which the bonding surface is activated by the activation treatment device, into contact with a substrate, to thereby bond the chip to the substrate. The frame holder supports a holding frame in a posture in which one side, to which the chip is stuck, in the sheet, of the holding frame that holds the sheet TE, which is formed of a resin, and to which the chip is stuck, is exposed to the particle beam source.

Abstract: Provided is a substance capable of effectively suppressing cancer metastasis or a pharmaceutical composition that effectively acts on an inflammatory disease. The pharmaceutical composition is a pharmaceutical composition containing, as an active ingredient, an antibody or an antibody fragment thereof having antigen-binding activity for an S100A8/A9 heterodimer, and blocks interaction between S100A8/A9 and a group of receptors therefor, to thereby strongly suppress cancer metastasis both in vitro and in vivo, or alleviate inflammation. That is, the anti-S100A8/A9 antibody or the antibody fragment thereof can strongly suppress cancer metastasis or alleviate inflammation, by virtue of its blocking action on the interaction between S100A8/A9 and the group of receptors therefor.

Abstract: A glass structure includes a glass plate; a connecting member placed on one surface of the glass plate, and is electrically connected to a conductor placed on the glass plate or placed in the vicinity of the glass plate, the connecting member including a connecting portion at one end thereof and a power supply portion at the other end thereof, and a portion other than the connecting portion and the power supply portion are covered by a resin portion; wherein the glass structure is adhered to a predetermined portion by an adhesive; and the glass structure including a base layer extending as a strip along the edge of the glass plate is placed on the surface of the glass plate and the surface of the resin portion of the connecting member, wherein the base layer including a resin primer layer, a glass primer layer and a sealant layer.

Abstract: A data positioning method includes obtaining positional information indicating a position which is designated by operation of an operation unit in any region among a plurality of regions, each of the plurality of regions corresponding to a predetermined direction along which values of a series of pieces of data are varied and being provided for designating a position of the series of pieces of data in the predetermined direction, and the plurality of regions include at least one region for designating a plurality of discrete positions of the series of pieces of data in the predetermined direction. The method further includes determining the position for designating a portion of data corresponding to the obtained positional information, any one position being determined among the plurality of discrete positions when positional information indicating a position in the region for designating the discrete positions is obtained.

Abstract: A power amplifying device according to an embodiment includes first to fourth BTL amplifiers and first to third switch circuits. The first to fourth BTL amplifiers outputs a first to fourth output signal. The first switch circuit is turned on or off connection between an output of the second output amplifier and an output of the third output amplifier. The second switch circuit is turned on or off connection between an output of the fifth output amplifier and an output of the eighth output amplifier. The third switch circuit is turned on or off connection between an output of the fourth output amplifier and an output of the seventh output amplifier. The first to third switch circuits are turned on when the amplitudes of the first to fourth input signals are smaller than a first threshold.

Abstract: A PWM modulator according to an embodiment includes a first comparator configured to compare a first input signal with a first carrier and output a comparison result, a second comparator configured to compare a second input signal with a second carrier and output a comparison result, and a selector configured to output the comparison result while switching between the comparison result of the first comparator and the comparison result of the second comparator in a cycle according to a cycle of the first or the second carrier.

Abstract: A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain.

Abstract: A chip mounting system (1) includes: a chip supplying unit (11) for supplying a chip (CP); a stage (31) for holding a substrate (WT) in an orientation in which a mounting face (WTf) for mounting the chip (CP) faces vertically downward (?Z direction); a head (33H) for holding the chip (CP) from the vertically downward direction (?Z direction); and a head drive unit (36) for, by causing vertically upward (+Z direction) movement of the head (33H) holding the chip (CP), causes the head (33H) to approach the stage (31) to mount the chip (CP) on the mounting face (WTf) of the substrate (WT).

Abstract: A substrate bonding apparatus includes a vacuum chamber, a surface activation part for activating respective bonding surfaces of a first substrate and a second substrate, and stage moving mechanisms for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates. In order to activate the bonding surfaces in the vacuum chamber, the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates.

Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.

Abstract: A PWM modulator according to an embodiment includes a first comparator configured to compare a first input signal with a first carrier and output a comparison result, a second comparator configured to compare a second input signal with a second carrier and output a comparison result, and a selector configured to output the comparison result while switching between the comparison result of the first comparator and the comparison result of the second comparator in a cycle according to a cycle of the first or the second carrier.

Abstract: A substrate bonding apparatus includes a vacuum chamber, a surface activation part for activating respective bonding surfaces of a first substrate and a second substrate, and stage moving mechanisms for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates. In order to activate the bonding surfaces in the vacuum chamber, the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates.

Abstract: A substrate bonding apparatus (100) includes a vacuum chamber (200), a surface activation part (610) for activating respective bonding surfaces of a first substrate (301) and a second substrate (302), and stage moving mechanisms (403, 404) for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates (301, 302). In order to activate the bonding surfaces in the vacuum chamber (200), the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates (301, 302).

Abstract: A data positioning method includes obtaining positional information indicating a position which is designated by operation of an operation unit in any region among a plurality of regions, each of the plurality of regions corresponding to a predetermined direction along which values of a series of pieces of data are varied and being provided for designating a position of the series of pieces of data in the predetermined direction, and the plurality of regions include at least one region for designating a plurality of discrete positions of the series of pieces of data in the predetermined direction. The method further includes determining the position for designating a portion of data corresponding to the obtained positional information, any one position being determined among the plurality of discrete positions when positional information indicating a position in the region for designating the discrete positions is obtained.

Abstract: A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain.

Abstract: The current feedback output circuit includes first and second transistors. The current feedback output circuit includes a current amplifier that has a non-inverting input terminal, an inverting input terminal, a first output terminal and a second output terminal, an input impedance of the non-inverting input terminal being higher than an input impedance of the inverting input terminal, and flows a current obtained by amplifying the difference between a current of an input signal to the non-inverting input terminal and a current input to the inverting input terminal between the first output terminal and the second output terminal. The current feedback output circuit includes first to sixth current mirror circuits. The current feedback output circuit includes a current feedback circuit that supplies a current responsive to a voltage at the signal output terminal to the inverting input terminal.

Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.

Abstract: A substrate bonding apparatus (100) includes a vacuum chamber (200), a surface activation part (610) for activating respective bonding surfaces of a first substrate (301) and a second substrate (302), and stage moving mechanisms (403, 404) for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates (301, 302). In order to activate the bonding surfaces in the vacuum chamber (200), the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates (301, 302).