Abstract: A polishing method able to easily flatten unevenness formed on the surface of a film to be polished and able to efficiently polish the film flat while suppressing damage to an interlayer insulating film below the film, comprising, when polishing an object having a film such as an interconnection layer formed burying interconnection grooves formed in an insulating film of a substrate, supplying a polishing solution over the surface to be polished at least substantially parallel to the surface to preferentially remove by polishing the projecting portions of the film and flatten the surface by the shear stress of the processing solution or arranging a cathode member facing the surface and supplying an electrolytic solution containing a chelating agent between the surface and cathode member while supplying voltage between the film and the cathode member to preferentially remove by polishing the projecting portions of the film and flatten the surface by the shear stress of the electrolytic solution, and a polishin

Abstract: In a related interconnection structure that is formed by filling a metal, there have been problems, since defective connection occurs due to generation of voids and other features caused by poor filling of the metal, which entails reduction in reliability, and contact resistance is large due to a barrier metal layer at a contact portion. A novel interconnection structure is provided which comprises: a recess (for example, a contact hole, a trench, or a trench and a contact hole formed at a bottom of the trench), which is connected onto a conductive material mass formed in an insulating film, and which is formed in the insulating film; a barrier metal layer formed on side walls of the recess; and metal material masses filled in the interior of the recess, wherein the metal material masses are formed with a metal repeatedly filled into the recess over a plurality of times, and a metal material mass and a conductive material mass are directly connected to each other.

Abstract: A method of electroless plating for processing a plating surface to form a barrier layer being capable of uniformly forming a barrier layer and reducing the consumption of a processing solution, comprising a step of feeding a processing solution used in at least one of the pre-processing steps of the electroless plating and the electroless plating step to the plating surface for puddling treatment, or, using a processing solution at least containing, with respect to one mole of a first metallic material supplying a main ingredient of the barrier layer, three or more moles of a completing agent and three or more moles of reducing agent and having a pH value adjusted to 9 or more and stored in an atmosphere of an inert gas or ammonia gas, and a corresponding electroless plating apparatus.

Abstract: A method of production and a method of polishing a semiconductor device and a polishing apparatus, capable of easily flattening an initial unevenness of a metal film, excellent in efficiency of removal of an excess metal film, and capable of suppressing damage to an interlayer insulation film below the metal film when flattening the metal film by polishing, the polishing method including the steps of interposing an electrolytic solution including a chelating agent between a cathode member and the copper film, applying a voltage between the cathode member used as a cathode and the copper film used as an anode to oxidize the surface of the copper film and forming a chelate film of the oxidized copper, selectively removing a projecting portion of the chelate film corresponding to the shape of the copper film to expose the projecting portion of the copper film at its surface, and repeating the above chelate film forming step and the above chelate film removing step until the projecting portion of the copper film

Abstract: A liquid supplying apparatus for supplying treatment liquid to a treatment liquid ejecting unit which ejects treatment liquid to a work, which is capable of supplying high quality treatment liquid without wasting treatment liquid. Since a fixed quantity of treatment liquid is ejected from the treatment liquid ejecting unit during the process waiting time and this treatment liquid is ejected through a cup sealed airtight to a liquid tank and circulated, the liquid supplying apparatus capable of supplying high quality treatment liquid can be realized without wasting treatment liquid.

Abstract: A spin coating device for a substrate, in which a uniform thin film can be formed by applying an application liquid to a substrate and the quality of the substrate can be further improved. The spin coating device for a substrate comprises a turntable 2 for holding and rotating a substrate 1; an application liquid supply means 4 for supplying an application liquid 3 to the rotating substrate 1: splash preventing means 20, which are arranged at the periphery of the substrate 1 held by the turntable 2, prevent the droplets of the application liquid from splashing and provide with an opening portion 10 for circulating the flow A of external air in an area ranging from the central portion toward the peripheral portion of the substrate 1 held by the turntable 2. Exhaust means 8 and 9 for exhausting air from within the splash preventing means 20 are provided.

Abstract: A circuit breaker wherein one or two of circuit-breaking electric element blocks respectively including current source side and load side terminals, fixed and movable contactors, means for forcibly tripping the movable contactor away from the fixed contactor by operating at least electromagnetically responsive to an overcurrent and an arc suppressing means, and movably supporting the movable contactor at a stationary part of the tripping means is arranged in each of side spaces within a single housing, while a single mechanical contact operating mechanism for moving the movable contactor in each of the blocks between both positions of opening and closing contacts responsive to an external operating force and operatively connected with the tripping means of the blocks is contained in an intermediate space provided between the side spaces, in each of the latter of which the movable contactor of an elongated member is arranged with one end having the movable contact directed toward the source side terminal and w

Abstract: The metallic surface of a master plate or mother plate is oxidized in a solution of hypochlorite to form a parting layer upon which a metal layer is plated. The metal layer may be stripped from the master plate or mother plate aided by the parting layer to form a matrix or stamper from which a plastic record disc, such as, a video disc, can be molded.