Abstract: A cooling plate according to the present invention contains 42% to 65% by mass of TiSi2, 4% to 16% by mass of TiC, and a smaller amount of SiC than the mass percentage of TiSi2.

Abstract: A ceramic material that has a high resistivity and high corrosion resistance according to the present invention contains magnesium-aluminum oxynitride and has a carbon content of 0.005 to 0.275 mass %.

Abstract: A wiring board and a method for manufacturing the wiring board in which an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted. Copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect.

Abstract: A wafer mounting table includes a first electrode and a second electrode buried inside of a ceramic substrate having a wafer mounting surface so as to be parallel to the wafer mounting surface with the first electrode closer to the wafer mounting surface than the second electrode. The wafer mounting table includes a conductive section that electrically conducts the first electrode and the second electrode. The conductive section is such that a plurality of circular members comprised of plate-shaped metal meshes parallel to the wafer mounting surface are stacked between the first electrode and the second electrode.

Abstract: A wafer mounting table includes a first electrode and a second electrode buried inside of a ceramic substrate having a wafer mounting surface so as to be parallel to the wafer mounting surface with the first electrode closer to the wafer mounting surface than the second electrode. The wafer mounting table includes a conductive section that electrically conducts the first electrode and the second electrode. The conductive section is such that a plurality of circular members comprised of plate-shaped metal meshes parallel to the wafer mounting surface are stacked between the first electrode and the second electrode.

Abstract: The present invention provides a wiring board having a conductor portion on which mounting is suitably possible and a method for manufacturing the wiring board. Since an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted, copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect, and therefore mountability is improved.

Abstract: A ceramic package includes a ceramic substrate, a metallization layer, a first plating layer, a brazing material layer, and a seal member. The ceramic substrate has a surface, and the metallization layer is disposed along an outer periphery of a predetermined region on the surface. The first plating layer is disposed on the metallization layer. The brazing material layer is disposed on the metallization layer with the first plating layer interposed therebetween. The seal member is joined on the metallization layer via the brazing material layer. In at least one of an outer peripheral portion and an inner peripheral portion of the brazing material layer, an end of the brazing material layer is located outside a region directly below the seal member and the end of the brazing material layer is positioned nearer to the seal member than an end of the metallization layer.

Abstract: A ceramic package includes a ceramic substrate, a metallization layer, a first plating layer, a brazing material layer, and a seal member. The ceramic substrate has a surface, and the metallization layer is disposed along an outer periphery of a predetermined region on the surface. The first plating layer is disposed on the metallization layer. The brazing material layer is disposed on the metallization layer with the first plating layer interposed therebetween. The seal member is joined on the metallization layer via the brazing material layer. In at least one of an outer peripheral portion and an inner peripheral portion of the brazing material layer, an end of the brazing material layer is located outside a region directly below the seal member and the end of the brazing material layer is positioned nearer to the seal member than an end of the metallization layer.

Abstract: In a ceramic package, a seal ring is brazed to a substrate portion. A joint portion of the seal ring includes: a metallization layer; a first plating layer disposed on the metallization layer; and a brazing material layer disposed on the metallization layer with the first plating layer interposed therebetween. An end of the brazing material layer is located outside a region directly below the seal ring and at a position at the seal ring side away from an end of the metallization layer by 0.02 mm or greater.

Abstract: A bonding agent is provided which includes a flux containing either calcium aluminate or calcium oxide and aluminum oxide and aluminum nitride powder.

Abstract: An electrostatic chuck with a heater includes: a base formed of a sintered body containing alumina; an ESC electrode provided in an upper portion side in the base; and a resistance heating body embedded in a lower portion side in the base. The base is composed of a dielectric layer from the ESC electrode to an upper surface of the base, and of a support member from the ESC electrode to a lower surface of the base. In the support member, a carbon content differs between an ESC electrode neighborhood in contact with the dielectric layer and a lower region below the ESC electrode neighborhood, a carbon content in the dielectric layer is 100 wt ppm or less, the carbon content in the ESC electrode neighborhood is 0.13 wt % or less, the carbon content in the lower region is 0.03 wt % or more and 0.5 wt % or less, and the carbon content in the ESC electrode neighborhood is smaller than the carbon content in the lower region. The resistance heating body contains niobium or platinum.

Abstract: An electrostatic chuck heater is provided including a base which is formed by applying conductive paste containing a binder to upper and lower surfaces of an alumina sintered body to print an electrostatic electrode and heater electrode, calcining the alumina sintered body, arranging alumina powder above the electrostatic electrode and alumina powder below the heater electrode, and pressing the alumina powder and alumina sintered body in the above state for pressure sintering. The diffusion area ratio of the conductive material near the electrostatic electrode in the dielectric layer is set to not more than 0.25%.

Abstract: An electrostatic chuck with a heater including: a base which is composed of a sintered body containing alumina, an electrode disposed in an upper part of the base, and a resistance heating element embedded in a lower part of the base. The base includes a dielectric layer between the electrode and an upper surface of the base and a supporting member between the electrode and a lower surface of the base. The dielectric layer has a carbon content of not more than 100 ppm, and the supporting member has a carbon content of 0.03 to 0.25 wt %. Moreover, the resistance heating element is formed into a coil and mainly composed of niobium.

Abstract: An electrostatic chuck includes a base. The base has a support portion made of alumina ceramics, and a surface portion made of yttria ceramics. The surface portion forms at least a substrate mounting surface and side surface of the base on a surface of the support portion. Carbon contents in alumina ceramics of the support portion and yttria ceramics of the surface portion are 0.05 wt % or less.

Abstract: The invention provides a bonded body including: a ceramic base that is mainly composed of alumina, includes a printed electrode embedded therein and composed of a high-melting-point conductive carbide and alumina, and has a concavity concaved at one surface concaved toward the printed electrode, and a terminal hole extending from the bottom of the concavity to the printed electrode; a terminal that is made of a sintered body of niobium carbide (NbC) /alumina (Al2O3) mixture and is placed in the terminal hole and has a first surface in contact with the printed electrode and a second surface exposed at the bottom of the concavity; a braze layer that is provided in the concavity to be in contact with the second surface of the terminal; and a connecting member made of a high-melting-point metal having a coefficient of thermal expansion close to that of the ceramic base.

Abstract: An electrostatic chuck includes a base, and includes an electrode embedded in the base in parallel to a substrate mounting surface of the base. A terminal loaded into a terminal hole drilled into a back surface of the base toward the electrode is bonded to the electrode having a protruded portion with a substantially conical trapezoidal shape, which is formed on a flat surface on the terminal side of the electrode toward the terminal hole. In the protruded portion, an angle made by the flat surface on the terminal side of the electrode and an inclined surface of the protruded portion is 40° or less, and a distance from the flat surface of the electrode to a terminal-bonding surface of the protruded portion is 0.01 to 0.8 mm.

Abstract: A bonding agent is provided which includes a flux containing either calcium aluminate or calcium oxide and aluminum oxide and aluminum nitride powder.

Abstract: An alumina sintered body comprises an alumina substrate having a first main surface and a second main surface opposing each other, an embedded film electrode made of a metal and embedded in the alumina substrate at a depth HD of 0.4 mm or less from a first main surface SF1, and an embedded terminal formed of a metal, embedded in the alumina substrate nearer a second main surface SF2 side than the embedded electrode. The embedded terminal is in contact with the embedded electrode and a film thickness HE of the embedded electrode is 25 ?m or less.

Abstract: An electrostatic chuck with a heater including: a base which is composed of a sintered body containing alumina; an electrode disposed in an upper part of the base: and a resistance heating element embedded in a lower part of the base. The base includes a dielectric layer between the electrode and an upper surface of the base and a supporting member between the electrode and a lower surface of the base. The dielectric layer has a carbon content of not more than 100 ppm, and the supporting member has a carbon content of 0.03 to 0.25 wt %. Moreover, the resistance heating element is formed into a coil and mainly composed of niobium.

Abstract: An electrostatic chuck includes a base. The base has a support portion made of alumina ceramics, and a surface portion made of yttria ceramics. The surface portion forms at least a substrate mounting surface and side surface of the base on a surface of the support portion. Carbon contents in alumina ceramics of the support portion and yttria ceramics of the surface portion are 0.05 wt % or less.