Patents by Inventor Akiyoshi Hattori

Akiyoshi Hattori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11398401
    Abstract: A wafer mounting table includes a first electrode and a second electrode buried inside of a ceramic substrate having a wafer mounting surface so as to be parallel to the wafer mounting surface with the first electrode closer to the wafer mounting surface than the second electrode. The wafer mounting table includes a conductive section that electrically conducts the first electrode and the second electrode. The conductive section is such that a plurality of circular members comprised of plate-shaped metal meshes parallel to the wafer mounting surface are stacked between the first electrode and the second electrode.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: July 26, 2022
    Assignee: NGK Insulators, Ltd.
    Inventors: Yuji Akatsuka, Masaki Ishikawa, Kazuhiro Nobori, Akiyoshi Hattori, Keiichi Nakamura
  • Patent number: 11399426
    Abstract: A wiring board and a method for manufacturing the wiring board in which an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted. Copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: July 26, 2022
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Toshio Suzuki, Masami Kanayama, Akiyoshi Hattori, Masanori Kito
  • Publication number: 20200219755
    Abstract: A wafer mounting table includes a first electrode and a second electrode buried inside of a ceramic substrate having a wafer mounting surface so as to be parallel to the wafer mounting surface with the first electrode closer to the wafer mounting surface than the second electrode. The wafer mounting table includes a conductive section that electrically conducts the first electrode and the second electrode. The conductive section is such that a plurality of circular members comprised of plate-shaped metal meshes parallel to the wafer mounting surface are stacked between the first electrode and the second electrode.
    Type: Application
    Filed: February 24, 2020
    Publication date: July 9, 2020
    Applicant: NGK INSULATORS, LTD.
    Inventors: Yuji AKATSUKA, Masaki ISHIKAWA, Kazuhiro NOBORI, Akiyoshi HATTORI, Keiichi NAKAMURA
  • Publication number: 20190191544
    Abstract: The present invention provides a wiring board having a conductor portion on which mounting is suitably possible and a method for manufacturing the wiring board. Since an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted, copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect, and therefore mountability is improved.
    Type: Application
    Filed: July 19, 2017
    Publication date: June 20, 2019
    Inventors: Toshio SUZUKI, Masami KANAYAMA, Akiyoshi HATTORI, Masanori KITO
  • Patent number: 10014189
    Abstract: A ceramic package includes a ceramic substrate, a metallization layer, a first plating layer, a brazing material layer, and a seal member. The ceramic substrate has a surface, and the metallization layer is disposed along an outer periphery of a predetermined region on the surface. The first plating layer is disposed on the metallization layer. The brazing material layer is disposed on the metallization layer with the first plating layer interposed therebetween. The seal member is joined on the metallization layer via the brazing material layer. In at least one of an outer peripheral portion and an inner peripheral portion of the brazing material layer, an end of the brazing material layer is located outside a region directly below the seal member and the end of the brazing material layer is positioned nearer to the seal member than an end of the metallization layer.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: July 3, 2018
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Toshio Suzuki, Masami Kanayama, Akiyoshi Hattori, Masanori Kitou
  • Patent number: 9984899
    Abstract: A ceramic package includes a ceramic substrate, a metallization layer, a first plating layer, a brazing material layer, and a seal member. The ceramic substrate has a surface, and the metallization layer is disposed along an outer periphery of a predetermined region on the surface. The first plating layer is disposed on the metallization layer. The brazing material layer is disposed on the metallization layer with the first plating layer interposed therebetween. The seal member is joined on the metallization layer via the brazing material layer. In at least one of an outer peripheral portion and an inner peripheral portion of the brazing material layer, an end of the brazing material layer is located outside a region directly below the seal member and the end of the brazing material layer is positioned nearer to the seal member than an end of the metallization layer.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: May 29, 2018
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Toshio Suzuki, Masami Kanayama, Akiyoshi Hattori, Masanori Kitou
  • Publication number: 20160358832
    Abstract: In a ceramic package, a seal ring is brazed to a substrate portion. A joint portion of the seal ring includes: a metallization layer; a first plating layer disposed on the metallization layer; and a brazing material layer disposed on the metallization layer with the first plating layer interposed therebetween. An end of the brazing material layer is located outside a region directly below the seal ring and at a position at the seal ring side away from an end of the metallization layer by 0.02 mm or greater.
    Type: Application
    Filed: May 27, 2016
    Publication date: December 8, 2016
    Inventors: Toshio SUZUKI, Masami KANAYAMA, Akiyoshi HATTORI, Masanori KITOU
  • Patent number: 8475613
    Abstract: A bonding agent is provided which includes a flux containing either calcium aluminate or calcium oxide and aluminum oxide and aluminum nitride powder.
    Type: Grant
    Filed: May 1, 2009
    Date of Patent: July 2, 2013
    Assignee: NGK Insulators, Ltd.
    Inventors: Akiyoshi Hattori, Takahiro Takahashi
  • Patent number: 8136820
    Abstract: An electrostatic chuck with a heater includes: a base formed of a sintered body containing alumina; an ESC electrode provided in an upper portion side in the base; and a resistance heating body embedded in a lower portion side in the base. The base is composed of a dielectric layer from the ESC electrode to an upper surface of the base, and of a support member from the ESC electrode to a lower surface of the base. In the support member, a carbon content differs between an ESC electrode neighborhood in contact with the dielectric layer and a lower region below the ESC electrode neighborhood, a carbon content in the dielectric layer is 100 wt ppm or less, the carbon content in the ESC electrode neighborhood is 0.13 wt % or less, the carbon content in the lower region is 0.03 wt % or more and 0.5 wt % or less, and the carbon content in the ESC electrode neighborhood is smaller than the carbon content in the lower region. The resistance heating body contains niobium or platinum.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: March 20, 2012
    Assignee: NGK Insulators, Ltd.
    Inventors: Ikuhisa Morioka, Kazuhiro Nobori, Tetsuya Kawajiri, Akiyoshi Hattori
  • Patent number: 8008602
    Abstract: An electrostatic chuck heater is provided including a base which is formed by applying conductive paste containing a binder to upper and lower surfaces of an alumina sintered body to print an electrostatic electrode and heater electrode, calcining the alumina sintered body, arranging alumina powder above the electrostatic electrode and alumina powder below the heater electrode, and pressing the alumina powder and alumina sintered body in the above state for pressure sintering. The diffusion area ratio of the conductive material near the electrostatic electrode in the dielectric layer is set to not more than 0.25%.
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: August 30, 2011
    Assignee: NGK Insulators, Ltd.
    Inventors: Yutaka Mori, Akiyoshi Hattori, Takeru Torigoe
  • Patent number: 7848075
    Abstract: An electrostatic chuck with a heater including: a base which is composed of a sintered body containing alumina, an electrode disposed in an upper part of the base, and a resistance heating element embedded in a lower part of the base. The base includes a dielectric layer between the electrode and an upper surface of the base and a supporting member between the electrode and a lower surface of the base. The dielectric layer has a carbon content of not more than 100 ppm, and the supporting member has a carbon content of 0.03 to 0.25 wt %. Moreover, the resistance heating element is formed into a coil and mainly composed of niobium.
    Type: Grant
    Filed: July 13, 2007
    Date of Patent: December 7, 2010
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazuhiro Nobori, Tetsuya Kawajiri, Akiyoshi Hattori
  • Patent number: 7701693
    Abstract: An electrostatic chuck includes a base. The base has a support portion made of alumina ceramics, and a surface portion made of yttria ceramics. The surface portion forms at least a substrate mounting surface and side surface of the base on a surface of the support portion. Carbon contents in alumina ceramics of the support portion and yttria ceramics of the surface portion are 0.05 wt % or less.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: April 20, 2010
    Assignee: NGK Insulators, Ltd.
    Inventors: Akiyoshi Hattori, Kazuhiro Nobori
  • Publication number: 20100000779
    Abstract: The invention provides a bonded body including: a ceramic base that is mainly composed of alumina, includes a printed electrode embedded therein and composed of a high-melting-point conductive carbide and alumina, and has a concavity concaved at one surface concaved toward the printed electrode, and a terminal hole extending from the bottom of the concavity to the printed electrode; a terminal that is made of a sintered body of niobium carbide (NbC) /alumina (Al2O3) mixture and is placed in the terminal hole and has a first surface in contact with the printed electrode and a second surface exposed at the bottom of the concavity; a braze layer that is provided in the concavity to be in contact with the second surface of the terminal; and a connecting member made of a high-melting-point metal having a coefficient of thermal expansion close to that of the ceramic base.
    Type: Application
    Filed: June 5, 2009
    Publication date: January 7, 2010
    Applicant: NGK Insulators, Ltd.
    Inventors: Akiyoshi HATTORI, Hirokazu NAKANISHI
  • Patent number: 7633738
    Abstract: An electrostatic chuck includes a base, and includes an electrode embedded in the base in parallel to a substrate mounting surface of the base. A terminal loaded into a terminal hole drilled into a back surface of the base toward the electrode is bonded to the electrode having a protruded portion with a substantially conical trapezoidal shape, which is formed on a flat surface on the terminal side of the electrode toward the terminal hole. In the protruded portion, an angle made by the flat surface on the terminal side of the electrode and an inclined surface of the protruded portion is 40° or less, and a distance from the flat surface of the electrode to a terminal-bonding surface of the protruded portion is 0.01 to 0.8 mm.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: December 15, 2009
    Assignee: NGK Insulators, Ltd.
    Inventor: Akiyoshi Hattori
  • Publication number: 20090242101
    Abstract: A bonding agent is provided which includes a flux containing either calcium aluminate or calcium oxide and aluminum oxide and aluminum nitride powder.
    Type: Application
    Filed: May 1, 2009
    Publication date: October 1, 2009
    Applicant: NGK Insulators, Ltd.
    Inventors: Akiyoshi HATTORI, Takahiro Takahashi
  • Patent number: 7446993
    Abstract: An alumina sintered body comprises an alumina substrate having a first main surface and a second main surface opposing each other, an embedded film electrode made of a metal and embedded in the alumina substrate at a depth HD of 0.4 mm or less from a first main surface SF1, and an embedded terminal formed of a metal, embedded in the alumina substrate nearer a second main surface SF2 side than the embedded electrode. The embedded terminal is in contact with the embedded electrode and a film thickness HE of the embedded electrode is 25 ?m or less.
    Type: Grant
    Filed: March 20, 2007
    Date of Patent: November 4, 2008
    Assignee: NGK Insulators, Ltd.
    Inventors: Akiyoshi Hattori, Yutaka Mori, Kazuhiro Nobori
  • Publication number: 20080266745
    Abstract: An electrostatic chuck with a heater including: a base which is composed of a sintered body containing alumina; an electrode disposed in an upper part of the base: and a resistance heating element embedded in a lower part of the base. The base includes a dielectric layer between the electrode and an upper surface of the base and a supporting member between the electrode and a lower surface of the base. The dielectric layer has a carbon content of not more than 100 ppm, and the supporting member has a carbon content of 0.03 to 0.25 wt %. Moreover, the resistance heating element is formed into a coil and mainly composed of niobium.
    Type: Application
    Filed: July 13, 2007
    Publication date: October 30, 2008
    Applicant: NGK Insulators, Ltd.
    Inventors: Kazuhiro Nobori, Tetsuya Kawajiri, Akiyoshi Hattori
  • Publication number: 20080174930
    Abstract: An electrostatic chuck includes a base. The base has a support portion made of alumina ceramics, and a surface portion made of yttria ceramics. The surface portion forms at least a substrate mounting surface and side surface of the base on a surface of the support portion. Carbon contents in alumina ceramics of the support portion and yttria ceramics of the surface portion are 0.05 wt % or less.
    Type: Application
    Filed: September 12, 2007
    Publication date: July 24, 2008
    Applicant: NGK Insulators, Ltd.
    Inventors: Akiyoshi Hattori, Kazuhiro Nobori
  • Publication number: 20080100985
    Abstract: An electrostatic chuck includes a base, and includes an electrode embedded in the base in parallel to a substrate mounting surface of the base. A terminal loaded into a terminal hole drilled into a back surface of the base toward the electrode is bonded to the electrode having a protruded portion with a substantially conical trapezoidal shape, which is formed on a flat surface on the terminal side of the electrode toward the terminal hole. In the protruded portion, an angle made by the flat surface on the terminal side of the electrode and an inclined surface of the protruded portion is 40° or less, and a distance from the flat surface of the electrode to a terminal-bonding surface of the protruded portion is 0.01 to 0.8 mm.
    Type: Application
    Filed: October 30, 2007
    Publication date: May 1, 2008
    Applicant: NGK Insulators, Ltd.
    Inventor: Akiyoshi Hattori
  • Patent number: 7354652
    Abstract: A corrosion-resistant member, which is exposed to a corrosive environment is provided. The corrosion-resistant member is made of a corrosion-resistant material that contains at least one of an oxide of calcium and aluminum, and a calcium aluminum oxide. The corrosion-resistant material includes a rare earth element in an amount of less than 5 wt %.
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: April 8, 2008
    Assignee: NGK Insulators, Ltd.
    Inventor: Akiyoshi Hattori