Abstract: An isolator unit includes a mount for mounting three isolator components, resulting in a smaller package. The isolator components are attached to the mount using a technique that reduces the possibility that the orientations of the components change with a change in temperature. Consequently, the operational characteristics of the isolator have a reduced temperature dependence.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for inspecting of bumps and other three dimensional (3D) features on wafers and other semiconductor substrates. The sensor eliminates out of focus light using a confocal principal to improve depth response. This process and system creates multiple parallel confocal optical paths along a line. The out of focus light is eliminated by placing an aperture at a plane which is a conjugate focal plane to the surface of the sample. The result is that the sensor produces a signal only when the sample surface is in a narrow focal range.

Abstract: An optical device has a first collimator sub-assembly having a first free-space end, and a second collimator sub-assembly having a second free-space end opposing the first free-space end of the first collimator. A central housing has first and second ends and is disposed between the first and second collimator sub-assemblies. A first ring on the first collimator sub-assembly is mounted to the first end of the central housing and a second ring on the second collimator sub-assembly is mounted to the second end of the central housing.

Abstract: In accordance with the invention, the quality of hard gold is determined by Raman vibrational spectroscopy. A sample of the hard gold is provided, a monochromatic light beam is directed onto the sample, and the frequency and intensity of the light scattered by the sample is analyzed for the vibrational frequencies of polymer molecules. Scattering frequencies offset from the initial beam frequency by about 2132 cm−1 and about 2182 cm−1, for example, are indicative of high quality nickel-hardened gold.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.

Abstract: In accordance with the invention, the quality of hard gold is determined by Raman vibrational spectroscopy. A sample of the hard gold is provided, a monochromatic light beam is directed onto the sample, and the frequency and intensity of the light scattered by the sample is analyzed for the vibrational frequencies of polymer molecules. Scattering frequencies offset from the initial beam frequency by about 2132 cm−1 and about 2182 cm−1, for example, are indicative of high quality nickel-hardened gold.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for inspecting of bumps and other three dimensional (3D) features on wafers and other semiconductor substrates. The sensor eliminates out of focus light using a confocal principal to improve depth response. This process and system creates multiple parallel confocal optical paths along a line. The out of focus light is eliminated by placing an aperture at a plane which is a conjugate focal plane to the surface of the sample. The result is that the sensor produces a signal only when the sample surface is in a narrow focal range.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for inspecting of bumps and other three dimensional (3D) features on wafers and other semiconductor substrates. The sensor eliminates out of focus light using a confocal principal to improve depth response.

Abstract: In accordance with the invention, a packaged electronic device comprises at least one electronic device and leads sealed within a protective package. The leads comprise a conductive metal substrate having a composite metal finish with a total thickness of 1000 Å or less. The finish comprises, in succession from the substrate, 25-750 Å of palladium alloy and 5-250 Å of wirebondable and solderable material. The substrate is advantageously nickel-plated copper alloy or Fe—Ni alloy. The content of palladium in the palladium alloy coating can range from 10-95 weight percent. This finish meets requirements of wirebonding and solderability at a thickness surprisingly lower than previously used packaging finishes.

Abstract: A single ended, frequency domain reflectometry signal processing based scheme measures loop loss of a telecommunications wireline. A distortion-corrected, normalized data array is differentially combined with an associated set of wireline noise spectrum values. The resulting noise margin data is processed by a Shannon Theorem operator, to produce a set of N frequency bins, each containing the number of bits which the link will support for a respective tone. The bit contents of the bins represent a composite bit rate that is available for use for ADSL signalling.

Abstract: A calibration device which has at least two targets. Each target has at least one surface exhibiting areas of optical contrast, and each surface has a general plane of orientation. The targets are oriented such that a general plane of orientation of one target is inclined at an angle relative to the general plane of orientation of a surface of the second target which has areas of optical contrast.

Abstract: A surface finish which provides improved wirebonding performance for integrated circuit packages is disclosed. The surface finish which is formed on a substrate includes a palladium layer and one or more material layers. The one or more material layers are interposed between the substrate and the palladium layer. The palladium layer has a hardness that is less than about 500 (KHN.sub.50) while at least one material layer has a hardness that is less than about 250 (KHN.sub.50).

Abstract: Gold electroplating solutions, particularly useful for plating onto nickel-iron substrates, are prepared utilizing electrolytes of relatively low conductivity, such as boric acid, alkali metal and ammonium acetates, nitrates, sulfates and orthophosphates. The gold is plated onto substrates using a current density ranging from about 1 to about 2000 amperes/square foot at a temperature of about 20.degree. to about 90.degree. C.