Abstract: A wavelength detector includes an optical structure receiving an input beam, the optical structure outputting at least three wavelength dependent two-beam interference signals. Each wavelength dependent two-beam interference signal has a different phase offset. A detector receives the at least three wavelength dependent two-beam interference signals and outputs an electrical signal representative of each wavelength dependent two-beam interference. A processor receives the at least three electrical signals from the detector and generates a composite control signal. Alternatively, two of the three signals are periodic with respect to wavelength and the third signal is a reference signal. The two-beam interference signals may be created by providing patterned apertures in respective beam paths. Phase shifting interferometry techniques may be used to determine the wavelength from the periodic signals.

Abstract: An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers, at least one of the two optical elements being a spherical lens. The resulting optical system presents a high numerical aperture. One of the optical elements may be a refractive element formed in a material having a high index of refraction.

Abstract: An aspheric microlens, particularly a conic constant of the microlens, may be evaluated and this evaluation may be used to determine an optimal process for creating the aspheric microlens. Such evaluation may include a curve fitting or a numerical expression of the wavefront.

Abstract: An integrated optical apparatus includes an optically transparent substrate with a light source and a detector mounted adjacent thereto. The substrate includes an optical element in a transmit path from the light source to a remote target. The optical element splits the light into more than one beam. A detector receives beams reflected by the target. All optical elements needed to create the more then one beam, direct the more than one beam onto the target and direct the more than one beam from the target to the detector are on the substrate and/or any structure bonded to the substrate. Preferably, the optical element provides sufficient separation between the more than one beam such that each beam is delivered to a unique respective light detecting element of the detector. The return path from the remote target to the detector may include an optical element for each beam or no optical elements. An additional substrate may be included and bonded to the substrate.

Abstract: Mass production of integrated subsystems may be realized by aligning first and second plurality of dies. The aligned dies are then treated to secure them together. The secured dies are then separated to form a secured pair of dies containing at least one lithographically formed element, thus forming an integrated subsystem. A bonding material may be provided over at least part of each first die, over an entire surface of the wafer or around the perimeter of each first die. Either one of the first or second dies may be provided on a wafer. Either die may contain active elements, e.g., a laser or a detector. The lithographic elements may be formed in the die or may be of a different material than that of the die.

Abstract: An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers, at least one of the two optical elements being a spherical lens. The resulting optical system presents a high numerical aperture. One of the optical elements may be a refractive element formed in a material having a high index of refraction.

Abstract: An apparatus which couples light to a fiber from a light source at an input plane while reducing back reflections includes returning light reflected back through such that the returning light does not substantially overlap with an output of the light source in the input plane. This apparatus may include a mode matching element and/or an angular distribution altering element. The apparatus may be reciprocal. The reciprocal apparatus may prevent light traversing the apparatus again having a change in phase of light from substantially overlapping an original object in an input plane.

Abstract: An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers. An active element having a characteristic which changes in response to an applied field may be integrated on a bottom surface of the wafers. The resulting optical system may present a high numerical aperture. Preferably, one of the optical elements is a refractive element formed in a material having a high index of refraction.

Abstract: A monitor for a light beam creates a monitor beam by deflecting a portion of the application beam and further manipulating the monitor beam and/or the application beam to allow more efficient use thereof. For example, the monitor beam may be collimated to allow an increase in spacing between the device outputting the light beam and a detector for sensing the monitor beam. Alternatively or additionally, the monitor beam may be focused to allow use of a smaller detector and of a smaller percentage of the application beam. The diffractive element deflecting the beam may be either transmissive or reflective. The additionally manipulation of the monitor beam and/or the application beam may be provided by the same diffractive element which deflects the beam, which is particularly useful when the diffractive element is reflective, and/or by additional optical elements.

Abstract: Mass production of integrated optical subsystems may be realized by aligning first and second plurality of dies. The aligned dies are then treated to secure them together. The secured dies are then separated to form a secured pair of dies containing at least one optical element, thus forming an integrated optical subsystem. A bonding material may be provided over at least part of the optical path of each first die, over an entire surface of the wafer or around the perimeter of each first die. Either one of the first or second dies may be provided on a wafer. Either die may contain active elements, e.g., a laser or a detector. The optical elements may be formed in the die or may be of a different material than that of the die.

Abstract: A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active optical element, with the different dimensions of the substrates forming the structure allowing access for the electrical interconnections for the active optical elements. Different dicing techniques may be used to realize the uneven structures.

Abstract: An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers, at least one of the two optical elements being a spherical lens. The resulting optical system presents a high numerical aperture. One of the optical elements may be a refractive element formed in a material having a high index of refraction.

Abstract: A power monitor for a light emitter emitting from a single face creates a monitor beam by deflecting a portion of the application beam and further manipulating the monitor beam to allow more efficient use of the monitor beam. For example, the monitor beam may be collimated to allow an increase in spacing between the light emitter and a detector for sensing the monitor beam. Alternatively or additionally, the monitor beam may be focused to allow use of a smaller detector and of a smaller percentage of the application beam. The diffractive element deflecting the beam may be either transmissive or reflective. The additionally manipulation of the monitor beam may be provided by the same diffractive element which deflects the beam, which is particularly useful when the diffractive element is reflective, and/or by additional optical elements.

Abstract: A beam homogenizer that minimizes undesired intensity variations at the output plane caused by sharp breaks between facets in previous embodiments. The homogenizer includes a hologram made up of irregularly patterned diffractive fringes. An input beam illuminates at least part of the hologram. The hologram transmits a portion of the input beam onto an output plane. In doing so, the energy of the input beam is spatially redistributed at the output plane into a homogenized output beam having a preselected spatial energy distribution at the output plane. Thus, the illuminated portion of the output plane has a shape predetermined by the designer of the homogenizer.

Abstract: An analog controlled angle diffuser and associated methods provide a wavelength insensitive diffuser with a controlled output. The diffuser has free formed shaped analog fringes, i.e., fringes which have a continuous cross-section from their peak to their termination. Preferably, the depth of the analog fringes will be at least 2&pgr;, even more preferably at least 2O&pgr;. Advantageously, the pattern of the diffuser is computer-generated.

Abstract: An analog controlled angle diffuser and associated methods provide a wavelength insensitive diffuser with a controlled output. The diffuser has free formed shaped analog fringes, i.e., fringes which have a continuous cross-section from their peak to their termination. Preferably, the depth of the analog fringes will be at least 2&pgr;, even more preferably at least 20&pgr;. Advantageously, the pattern of the diffuser is computer-generated.

Abstract: An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers. An active element having a characteristic which changes in response to an applied field may be integrated on a bottom surface of the wafers. The resulting optical system may present a high numerical aperture. Preferably, one of the optical elements is a refractive element formed in a material having a high index of refraction.

Abstract: A beam homogenizer that minimizes undesired intensity variations at the output plane caused by sharp breaks between facets in previous embodiments. The homogenizer includes a hologram made up of irregularly patterned diffractive fringes. An input beam illuminates at least part of the hologram. The hologram transmits a portion of the input beam onto an output plane. In doing so, the energy of the input beam is spatially redistributed at the output plane into a homogenized output beam having a preselected spatial energy distribution at the output plane. Thus, the illuminated portion of the output plane has a shape predetermined by the designer of the homogenizer.

Abstract: A power monitor for a light emitter emitting from a single face creates a monitor beam by deflecting a portion of the application beam and further manipulating the monitor beam to allow more efficient use of the monitor beam. For example, the monitor beam may be collimated to allow an increase in spacing between the light emitter and a detector for sensing the monitor beam. Alternatively or additionally, the monitor beam may be focused to allow use of a smaller detector and of a smaller percentage of the application beam. The diffractive element deflecting the beam may be either transmissive or reflective. The additionally manipulation of the monitor beam may be provided by the same diffractive element which deflects the beam, which is particularly useful when the diffractive element is reflective, and/or by additional optical elements.

Abstract: Mass production of integrated optical subsystems may be realized by aligning first and second plurality of dies. The aligned dies are then treated to secure them together. The secured dies are then separated to form a secured pair of dies containing at least one optical element, thus forming an integrated optical subsystem. A bonding material may be provided over at least part of the optical path of each first die, over an entire surface of the wafer or around the perimeter of each first die. Either one of the first or second dies may be provided on a wafer. Either die may contain active elements, e.g., a laser or a detector. The optical elements may be formed in the die or may be of a different material than that of the die.