Abstract: Optical fiber photonic integrated chip connector interfaces and photonic integrated chip assemblies utilizing low-profile optical fibers and methods thereof are disclosed. In one embodiment, an optical fiber photonic integrated chip (PIC) connector interface includes at least one low-profile optical fiber having an end face, at least one core, and a cladding layer, wherein the end face is non-rotationally symmetric with respect to the at least one core, and the cladding layer includes at least one minimum perimeter point that is a minimum distance from the at least one core as compared to remaining perimeter points of the cladding. The PIC connector interface further includes an interconnect substrate including a fiber mounting surface, and a mechanical coupling surface. The at least one low-profile optical fiber is disposed on the fiber mounting surface such that one or more surfaces of the cladding defining the at least one minimum perimeter point faces away from the fiber mounting surface.

Abstract: A dielectric substrate for RF, microwave, or millimeter wave devices, circuits, or surfaces includes a propagating region for transmitting or reflecting an electromagnetic field, and one or more material-filled vias located within the propagating region. The application of an external electric or magnetic field to the material-filled vias may be used to tune the electric permittivity or the magnetic permeability of the fill material and hence control the effective electric permittivity or the effective magnetic permeability of the dielectric substrate within the propagating region. A dimension of the material-filled vias may be less than half of a wavelength of the propagating electromagnetic field. The fill material may include liquid crystals, a ferroelectric crystal composite, a ferromagnetic crystal composite, organic semiconductors, and/or electro-optic or magneto-optic polymers.

Abstract: A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.

Abstract: A fiber optic assembly is provided including a support substrate having a substantially flat surface and a signal-fiber array supported on the support substrate. The signal-fiber array includes a plurality of optical fibers. At least some of the optical fiber of the plurality of optical fibers includes a first datum contact disposed between the optical fiber and an adjacent optical fiber and each of the optical fibers of the plurality of optical fibers includes a second datum contact disposed between each of the optical fibers of the plurality of optical fibers and the support substrate. A first datum surface is disposed at a top surface of each of the plurality of optical fibers opposite the support surface.

Abstract: Waveguide substrates, waveguide substrate assemblies, and methods for fabricating waveguide substrates are disclosed. In one embodiment, a waveguide substrate includes an input edge, an output edge, and at least one waveguide within the waveguide substrate. The waveguide substrate further includes at least one input alignment feature within the input edge adjacent to the input end of the at least one waveguide, wherein the at least one input alignment feature is fabricated from a material of the waveguide substrate. The waveguide substrate may also include at least one output alignment feature within the input edge adjacent to the output end of the at least one waveguide, wherein the at least one output alignment feature is fabricated from the material of the waveguide substrate.

Abstract: Waveguide connector assemblies having a clamshell shell housing and methods of assembling a waveguide module assembly are disclosed. In one embodiment, a waveguide module assembly includes a first shell housing, and a second shell housing coupled to the first shell housing. The first shell housing and the second shell housing define a cavity. The waveguide module assembly further includes a waveguide substrate including at least one waveguide, a first surface, and a second surface opposite the first surface. The waveguide substrate is at least partially disposed within the cavity such that at least a portion of the first surface and at least a portion of the second surface are covered by at least one of the first shell housing and the second shell housing.

Abstract: Optical fiber photonic integrated chip connector interfaces and photonic integrated chip assemblies utilizing low-profile optical fibers and methods thereof are disclosed. In one embodiment, an optical fiber photonic integrated chip (PIC) connector interface includes at least one low-profile optical fiber having an end face, at least one core, and a cladding layer, wherein the end face is non-rotationally symmetric with respect to the at least one core, and the cladding layer includes at least one minimum perimeter point that is a minimum distance from the at least one core as compared to remaining perimeter points of the cladding. The PIC connector interface further includes an interconnect substrate including a fiber mounting surface, and a mechanical coupling surface. The at least one low-profile optical fiber is disposed on the fiber mounting surface such that one or more surfaces of the cladding defining the at least one minimum perimeter point faces away from the fiber mounting surface.

Abstract: The methods disclosed herein include forming an expanded core in an optical fiber with a glass core having a core dopant and a core outer surface, and a glass cladding immediately surrounding the core and having a flat glass-portion surface closest to the core outer surface at a first core spacing S1. The methods include applying heat to a section of the optical fiber to cause the glass core to expand toward the flat glass-portion surface due to thermal diffusion of the core dopant. The methods also include terminating the application of heat to define the expanded core in the heated section of the optical fiber. The expanded core defines an evanescent coupling region having a second core spacing 0?S2<S1 and an adiabatic transition region between the core and the evanescent coupling region of the expanded core.

Abstract: Waveguide substrate, waveguide substrate assemblies and methods of fabricating waveguide substrates having various waveguide routing schemes are disclosed. In one embodiment, a waveguide substrate includes a first surface and a second surface, and a plurality of waveguides within the waveguide substrate. The plurality of waveguides defines a plurality of inputs at the first surface. A subset of the plurality of waveguides extends to the second surface to at least partially define a plurality of outputs at the second surface. In one waveguide routing scheme, at least one branching waveguide extends between one of the first surface and the second surface to a surface other than the first surface and the second surface. Another waveguide routing scheme arranges the plurality of waveguides into optical receive-transmit pairs for duplex pairing of optical signals.

Abstract: A dielectric substrate for RF, microwave, or millimeter wave devices, circuits, or surfaces includes a propagating region for transmitting or reflecting an electromagnetic field, and one or more material-filled vias located within the propagating region. The application of an external electric or magnetic field to the material-filled vias may be used to tune the electric permittivity or the magnetic permeability of the fill material and hence control the effective electric permittivity or the effective magnetic permeability of the dielectric substrate within the propagating region. A dimension of the material-filled vias may be less than half of a wavelength of the propagating electromagnetic field. The fill material may include liquid crystals, a ferroelectric crystal composite, a ferromagnetic crystal composite, organic semiconductors, and/or electro-optic or magneto-optic polymers.

Abstract: Optical fiber photonic integrated chip connector interfaces and photonic integrated chip assemblies utilizing low-profile optical fibers and methods thereof are disclosed. In one embodiment, an optical fiber photonic integrated chip (PIC) connector interface includes at least one low-profile optical fiber having an end face, at least one core, and a cladding layer, wherein the end face is non-rotationally symmetric with respect to the at least one core, and the cladding layer includes at least one minimum perimeter point that is a minimum distance from the at least one core as compared to remaining perimeter points of the cladding. The PIC connector interface further includes an interconnect substrate including a fiber mounting surface, and a mechanical coupling surface. The at least one low-profile optical fiber is disposed on the fiber mounting surface such that one or more surfaces of the cladding defining the at least one minimum perimeter point faces away from the fiber mounting surface.

Abstract: A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.

Abstract: A fiber optic assembly is provided including a support substrate having a substantially flat surface and a signal-fiber array supported on the support substrate. The signal-fiber array includes a plurality of optical fibers. Al least some of the optical fiber of the plurality of optical fibers includes a first datum contact disposed between the optical fiber and an adjacent optical fiber and each of the optical fibers of the plurality of optical fibers includes a second datum contact disposed between each of the optical fibers of the plurality of optical fibers and the support substrate. A first datum surface is disposed at a top surface of each of the plurality of optical fibers opposite the support surface.

Abstract: An optical-electrical substrate for providing electrical and optical connections to a photonic integrated circuit (PIC) includes a glass body with glass optical waveguides along an upper surface, and electrically conductive vias extending through a portion of the glass body from an intermediate surface to a lower surface. The intermediate surface is arranged at an elevation positioned between the upper and lower surfaces, and may optionally support redistribution layers and an electrical integrated circuit. An optical-electrical substrate may be fabricated by defining glass optical waveguides along an upper surface of a glass body, and forming electrically conductive vias through the glass body from the intermediate surface to the lower surface.

Abstract: A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.

Abstract: A method of manufacturing a fiber ferrule assembly that includes inserting an exposed end portion of a plurality of optical fibers including a core and a cladding into an array of insertion holes disposed in a glass ferrule plate. The glass ferrule plate includes a glass material that differs from a glass material of both the core and the cladding. The method further includes chemically etching the glass ferrule plate and the exposed end portion of the plurality of optical fibers using a chemical etchant for an etching time period. The glass ferrule plate etches at a first etching rate, the exposed end portion etches at a second etching rate, and the first etching rate is faster than the second etching rate such that, after the etching time period, the exposed end portion of each of the plurality of optical fibers protrude from a second surface of the glass ferrule plate.

Abstract: Optical fiber photonic integrated chip connector interfaces and photonic integrated chip assemblies utilizing low-profile optical fibers and methods thereof are disclosed. In one embodiment, an optical fiber photonic integrated chip (PIC) connector interface includes at least one low-profile optical fiber having an end face, at least one core, and a cladding layer, wherein the end face is non-rotationally symmetric with respect to the at least one core, and the cladding layer includes at least one minimum perimeter point that is a minimum distance from the at least one core as compared to remaining perimeter points of the cladding. The PIC connector interface further includes an interconnect substrate including a fiber mounting surface, and a mechanical coupling surface. The at least one low-profile optical fiber is disposed on the fiber mounting surface such that one or more surfaces of the cladding defining the at least one minimum perimeter point faces away from the fiber mounting surface.

Abstract: A method of manufacturing a fiber ferrule assembly that includes inserting an exposed end portion of a plurality of optical fibers including a core and a cladding into an array of insertion holes disposed in a glass ferrule plate. The glass ferrule plate includes a glass material that differs from a glass material of both the core and the cladding. The method further includes chemically etching the glass ferrule plate and the exposed end portion of the plurality of optical fibers using a chemical etchant for an etching time period. The glass ferrule plate etches at a first etching rate, the exposed end portion etches at a second etching rate, and the first etching rate is faster than the second etching rate such that, after the etching time period, the exposed end portion of each of the plurality of optical fibers protrude from a second surface of the glass ferrule plate.

Abstract: An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.

Abstract: A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.