Abstract: An optical-electrical substrate for providing electrical and optical connections to a photonic integrated circuit (PIC) includes a glass body with glass optical waveguides along an upper surface, and electrically conductive vias extending through a portion of the glass body from an intermediate surface to a lower surface. The intermediate surface is arranged at an elevation positioned between the upper and lower surfaces, and may optionally support redistribution layers and an electrical integrated circuit. An optical-electrical substrate may be fabricated by defining glass optical waveguides along an upper surface of a glass body, and forming electrically conductive vias through the glass body from the intermediate surface to the lower surface.

Abstract: A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.

Abstract: A method of manufacturing a fiber ferrule assembly that includes inserting an exposed end portion of a plurality of optical fibers including a core and a cladding into an array of insertion holes disposed in a glass ferrule plate. The glass ferrule plate includes a glass material that differs from a glass material of both the core and the cladding. The method further includes chemically etching the glass ferrule plate and the exposed end portion of the plurality of optical fibers using a chemical etchant for an etching time period. The glass ferrule plate etches at a first etching rate, the exposed end portion etches at a second etching rate, and the first etching rate is faster than the second etching rate such that, after the etching time period, the exposed end portion of each of the plurality of optical fibers protrude from a second surface of the glass ferrule plate.

Abstract: Optical fiber photonic integrated chip connector interfaces and photonic integrated chip assemblies utilizing low-profile optical fibers and methods thereof are disclosed. In one embodiment, an optical fiber photonic integrated chip (PIC) connector interface includes at least one low-profile optical fiber having an end face, at least one core, and a cladding layer, wherein the end face is non-rotationally symmetric with respect to the at least one core, and the cladding layer includes at least one minimum perimeter point that is a minimum distance from the at least one core as compared to remaining perimeter points of the cladding. The PIC connector interface further includes an interconnect substrate including a fiber mounting surface, and a mechanical coupling surface. The at least one low-profile optical fiber is disposed on the fiber mounting surface such that one or more surfaces of the cladding defining the at least one minimum perimeter point faces away from the fiber mounting surface.

Abstract: A method of manufacturing a fiber ferrule assembly that includes inserting an exposed end portion of a plurality of optical fibers including a core and a cladding into an array of insertion holes disposed in a glass ferrule plate. The glass ferrule plate includes a glass material that differs from a glass material of both the core and the cladding. The method further includes chemically etching the glass ferrule plate and the exposed end portion of the plurality of optical fibers using a chemical etchant for an etching time period. The glass ferrule plate etches at a first etching rate, the exposed end portion etches at a second etching rate, and the first etching rate is faster than the second etching rate such that, after the etching time period, the exposed end portion of each of the plurality of optical fibers protrude from a second surface of the glass ferrule plate.

Abstract: An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.

Abstract: A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.

Abstract: This invention comprises a method of attracting customers to retail businesses by conducting lucky number drawings on the business premises every ten minutes. Visitors can enter the drawings without purchasing or paying anything by scanning the 2D barcodes on their photo-ID documents, which can be issued by the merchant. System software uses the date of each scan and the decoded identification information represented by the barcode to prevent visitors from entering drawings more often than once a day. Entrants can select multiple four-digit numbers at selection stations. All entrants whose selected numbers become matched by the next randomly generated winning number receive valuable prizes if their faces match their photo-IDs.

Abstract: Waveguide substrates, waveguide substrate assemblies, and methods for fabricating waveguide substrates are disclosed. In one embodiment, a waveguide substrate includes an input edge, an output edge, and at least one waveguide within the waveguide substrate. The waveguide substrate further includes at least one input alignment feature within the input edge adjacent to the input end of the at least one waveguide, wherein the at least one input alignment feature is fabricated from a material of the waveguide substrate. The waveguide substrate may also include at least one output alignment feature within the input edge adjacent to the output end of the at least one waveguide, wherein the at least one output alignment feature is fabricated from the material of the waveguide substrate.

Abstract: Waveguide substrate, waveguide substrate assemblies and methods of fabricating waveguide substrates having various waveguide routing schemes are disclosed. In one embodiment, a waveguide substrate includes a first surface and a second surface, and a plurality of waveguides within the waveguide substrate. The plurality of waveguides defines a plurality of inputs at the first surface. A subset of the plurality of waveguides extends to the second surface to at least partially define a plurality of outputs at the second surface. In one waveguide routing scheme, at least one branching waveguide extends between one of the first surface and the second surface to a surface other than the first surface and the second surface. Another waveguide routing scheme arranges the plurality of waveguides into optical receive-transmit pairs for duplex pairing of optical signals.

Abstract: A method and apparatus for smoothing a material having wrinkles. The material is positioned on a vacuum table having a group of segments. A smoothing device is moved across a surface of the material to form a substantially smooth section of the material. A vacuum is progressively applied to a portion of the group of segments in the vacuum table corresponding to the substantially smooth section of the material to pull the substantially smooth section of the material against the vacuum table.

Abstract: Detachable optical connectors including a connector support for optical chips and methods of their fabrication are disclosed. In one embodiment, an optical assembly includes an optical chip including a surface, an edge extending from the surface, and at least one chip waveguide proximate the surface and terminating at the edge. The optical assembly further includes a waveguide support having a chip coupling surface, and at least one waveguide disposed within the waveguide support and terminating at the chip coupling surface, wherein the chip coupling surface is coupled to the edge of the optical chip such that the at least one waveguide within the waveguide support is optically coupled to the at least one chip waveguide of the optical chip. The optical assembly further includes a connector support having a first portion coupled to the optical chip, and a second portion coupled to the waveguide support.

Abstract: Optical assemblies, interconnection substrates and methods of forming optical links are disclosed. In one embodiment, an optical assembly includes a first waveguide substrate, a second waveguide substrate, and an interconnection substrate having a first end face, a second end face, and a laser written waveguide. The first waveguide substrate is coupled to the first end face of the interconnection substrate, and the first waveguide is optically coupled to the laser written waveguide. The laser written waveguide terminates at the second end face of the interconnection substrate. The second waveguide substrate is coupled to the second end face of the interconnection substrate such that the second waveguide is optically coupled to the laser written waveguide at the second end face.

Abstract: The methods disclosed herein include forming an expanded core in an optical fiber with a glass core having a core dopant and a core outer surface, and a glass cladding immediately surrounding the core and having a flat glass-portion surface closest to the core outer surface at a first core spacing S1. The methods include applying heat to a section of the optical fiber to cause the glass core to expand toward the flat glass-portion surface due to thermal diffusion of the core dopant. The methods also include terminating the application of heat to define the expanded core in the heated section of the optical fiber. The expanded core defines an evanescent coupling region having a second core spacing 0?S2<S1 and an adiabatic transition region between the core and the evanescent coupling region of the expanded core.

Abstract: A fiber to waveguide coupler is provided that includes an optical fiber having a core and a cladding. The cladding includes an inner cladding and an outer cladding with a polymer. At least one of the core and inner cladding defines a substantially flat surface parallel with an axis of the optical fiber. The optical fiber defines a stripped portion substantially free of outer cladding configured to expose the at least one substantially flat surface of the core or inner cladding. A waveguide is configured to be evanescently coupled with the exposed at least one substantially flat surface of the core or inner cladding.

Abstract: The glass-based ferrules include a glass substrate and two spaced-apart guide tubes, which can also be made of glass. The guide tubes include bores sized to receive guide pins from another ferrule. The ferrule can be used to form an optical interconnection device in the form of a waveguide connector that includes a planar lightwave circuit that supports multiple waveguides. The ferrule can also be used to form an optical interconnection device in the form of a fiber connector that includes a support substrate and an array of optical fibers supported thereby. The waveguide connector and fiber connector when mated form an integrated photonic device. Methods of forming the ferrule components, the ferrules and the optical interconnection devices are also disclosed.

Abstract: An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.

Abstract: An optical coupler that provides evanescent optical coupling includes an optical fiber and a waveguide. The optical fiber has a glass core, a glass inner cladding surrounding the glass core, and a polymeric outer cladding surrounding the glass inner cladding. The glass core and glass inner cladding define for the fiber a glass portion, which can be exposed at one end of the fiber by removing a portion of the polymeric outer cladding. The glass portion has a glass-portion surface. The waveguide has a waveguide core and a surface, and can be part of a photonic device. The glass portion of the fiber is interfaced with the waveguide to establish evanescent coupling between the fiber and the waveguide. Alignment features are used to facilitate aligning the fiber core to the waveguide core during the interfacing process to ensure suitable efficiency of the evanescent coupling.

Abstract: An optical interface device for a photonic integrated system includes a plug and a receptacle. The receptacle is operably arranged on a PIC that supports waveguides. The plug operably supports optical fibers. The receptacle and plug are configured to operably engage to establish optical communication between the optical fibers and the waveguides. A tab on the receptacle is configured to constrain longitudinal motion while allowing for lateral motion of the receptacle to adjust its position relative to the PIC to optimize alignment. The plug can include a spacer sized to fit within a recess defined by the tab to further facilitate alignment. The plug can also include lenses to establish the optical communication between the optical fibers and the waveguides. The receptacle and plug can be engaged and disengaged in a manner similar to conventional electrical connectors.

Abstract: The glass-based ferrules include a glass substrate and two spaced-apart guide tubes, which can also be made of glass. The guide tubes include bores sized to receive guide pins from another ferrule. The ferrule can be used to form an optical interconnection device in the form of a waveguide connector that includes a planar lightwave circuit that supports multiple waveguides. The ferrule can also be used to form an optical interconnection device in the form of a fiber connector that includes a support substrate and an array of optical fibers supported thereby. The waveguide connector and fiber connector when mated form an integrated photonic device. Methods of forming the ferrule components, the ferrules and the optical interconnection devices are also disclosed.