Abstract: A method includes comparing a length of a first packet to a threshold, determining that the first packet is a short packet when the length of the first packet is less than the threshold, and determining that the first packet is a long packet when the length of the first packet is greater than or equal to the threshold. The method also includes when the first packet is a long packet placing the first packet in a long packet container and transmitting the long packet container to a photonic switch. Additionally, the method includes when the first packet is a short packet placing a first portion of the first packet in a first short packet container, where the first short packet container includes a sequence number, a source top-of-rack switch (TOR) address, and a destination TOR address and transmitting the first short packet container to an electronic switch.

Abstract: A method includes obtaining a first packet, where the first packet has a length and comparing the length of the first packet to a length threshold. The method also includes when the length of the first packet is greater than or equal to the length threshold, placing the first packet in a long packet container and transmitting the long packet container to a first photonic switch and when the length of the first packet is less than the length threshold, placing the first packet in a first short packet container and transmitting the first short packet container to a second photonic switch.

Abstract: A method includes receiving a first packet payload, and where the first packet payload originates from a first top-of-rack switch (TOR) and receiving a second packet payload, where the second packet payload originates from a second TOR. The method also includes placing the first packet payload in a transport container and placing the second packet payload in the transport container. Additionally, the method includes transmitting the transport container to a photonic switch.

Abstract: A photonic switching structure includes a first macromodule, where the first macromodule includes an array of switch matrix photonic integrated circuit (PIC) nodes having a first row, a second row, a first column, and a second column and a first optical splitter optically coupled to PIC nodes in the first row. The first macromodule also includes a second optical splitter optically coupled to PIC nodes in the second row and a first output selector optically coupled to PIC nodes in the first column. Additionally, the first macromodule includes a second output selector optically coupled to PIC nodes in the second column and a first collision detector coupled to PIC nodes in the first column. Also, the first macromodule includes a second collision detector coupled to PIC nodes in the second column.

Abstract: A bond inspection system may include a material that reacts to applied activation energy by creating a compression wave, the material positioned adjacent a surface of a structure having a bond to be inspected and shaped in a predetermined pattern, such that reaction of the material causes compression waves to travel through the surface and structure; a source of activation energy capable of directing the activation energy at the material; and a controller programmed to actuate the source of activation energy to direct the activation energy at discrete portions of the predetermined pattern of material in a predetermined sequence selected to create a plurality of the compression waves so that the compression waves reflect from an opposite side of the structure as a plurality of tension waves that combine at substantially the same time at a bondline of the structure to be inspected.

Abstract: A method and apparatus for inspecting a structure. In one illustrative embodiment, an apparatus comprises a laser system located outside of an area that includes a region of a structure to be inspected, a mobile platform located within the area to be inspected, and a projection system associated with the mobile platform. The laser system is configured to generate a laser beam. The projection system receives the laser beam and projects the laser beam onto a surface of the region of the structure. The laser beam causes a number of ultrasonic waves to form within the structure.

Abstract: A method and apparatus for inspecting a test object with a non-planar feature. A pattern of light is transmitted from a first array of optical fibers associated with a sensor structure onto a surface of the test object at a location of the non-planar feature. The pattern of light is configured to cause sound waves in the test object when the pattern of light encounters the test object. A response to the sound waves is detected using a second array of optical fibers associated with the sensor structure. A determination is made as to whether an inconsistency is present in the test object at the location of the non-planar feature from the response to the sound waves detected using the second array of optical fibers.

Abstract: In one embodiment, micro-electro-mechanical-system (MEMS) mirror structure includes an electrode plate including a first deflection electrode and a second deflection electrode, where the second deflection electrode is opposite the first deflection electrode, where the first deflection electrode is configured to receive a first drive voltage, and where the second deflection electrode is configured to receive a second drive voltage. The MEMS mirror structure also includes a mirror support pillar disposed on the electrode plate, where the mirror support pillar has a bearing surface and a mirror disposed above the bearing surface of the support pillar, where the mirror has a deflection angle, and where the first voltage is nonzero when the deflection angle is zero.

Abstract: A method and apparatus for testing a bond interface is provided. The method comprises directing laser energy at a first surface of a first material connected to a second material by an adhesive at a bond interface. The first surface is opposite the bond interface. A first acoustic impedance of the first material is greater than a second acoustic impedance of the second material. The method also determines whether an inconsistency is present in the bond interface after directing the laser energy.

Abstract: In one embodiment, a method of controlling a micro-electro-mechanical-system (MEMS) photonic switch includes applying a voltage to an electrode of an initial mirror of a first mirror array of the MEMS photonic switch and illuminating a control beam. The method also includes reflecting the control beam off the initial mirror to form a control beam spot on a second mirror array of the MEMS photonic switch and detecting an initial location of the control beam spot to produce an initial optical response. Additionally, the method includes adjusting the voltage in accordance with the initial optical response while the control beam spot has a nonzero velocity.

Abstract: In one embodiment, a method of aligning mirrors of a micro-electro-mechanical system (MEMS) photonic switch includes illuminating a first group of photodiodes associated with a first mirror of a first mirror array of the MEMS photonic switch by a first control beam during a first period of time and illuminating a second group of photodiodes associated with a second mirror of the first mirror array by a second control beam during a second period of time, where the second control beam is off during the first period of time, where the first control beam is off during the second period of time, and where the second period of time is after the first period of time. The method also includes illuminating the first group of photodiodes by the first control beam during a third period of time, where the second control beam is off during the third period of time, and where the third period of time is after the second period of time.

Abstract: In one embodiment, a method includes reflecting, by a first mirror of a first mirror array of a micro-electro-mechanical system (MEMS) photonic switch, an optical control beam to produce an optical control beam spot on a second mirror array of the MEMS photonic switch and cyclic dithering of the first mirror to effective enlargement of a size of the optical control beam spot. The method also includes detecting, by a first photodiode having a first location on the second mirror array, a first intensity of the optical control beam spot.

Abstract: A method and a system of integrating a new robot into a work environment are provided. A controller receives a signal indicating a presence of a new robot in the work environment. The controller then establishes a negotiation channel between the controller and the new robot and begins to negotiate with the new robot a set of robotic functions controllable by the controller. Based on a comparison between a set of function attributes the new robot and interface attributes of the controller, the controller generates a new robot user interface for controlling the set of robotic functions of the new robot.

Abstract: In one embodiment, photonic switching fabric includes an input photonic commutator switch configured to receive a photonic frame stream including a plurality of containerized photonic packets and a first high port count photonic switch coupled to the input photonic commutator switch. The photonic switching fabric also includes a second high port count photonic switch coupled to the input photonic commutator switch, where the input photonic commutator switch is configured to route the photonic frame to either the first high port count photonic switch or the second high port count photonic switch and an output photonic commutator switch coupled to the first high port count photonic switch and the second high port count photonic switch, where the output photonic commutator switch is configured to output a switched photonic frame.

Abstract: A method and apparatus for smoothing a material having wrinkles. The material is positioned on a vacuum table having a group of segments. A smoothing device is moved across a surface of the material to form a substantially smooth section of the material. A vacuum is progressively applied to a portion of the group of segments in the vacuum table corresponding to the substantially smooth section of the material to pull the substantially smooth section of the material against the vacuum table.

Abstract: In one embodiment, a photonic switching fabric includes a first stage including a plurality of first switches and a second stage including a plurality of second switches, where the second stage is optically coupled to the first stage. The photonic switching fabric also includes a third stage including a plurality of third switches, where the third stage is optically coupled to the second stage, where the photonic switching fabric is configured to receive a packet having a destination address, where the destination address includes a group destination address, and where the second stage is configured to be connected in accordance with the group destination address.

Abstract: In one embodiment, a cloud radio access network (C-RAN) includes a first plurality of antennas and a first plurality of radio remote units (RRUs) coupled to the plurality of antennas. The C-RAN also includes a first plurality of broadband base units (BBUs) and a first photonic switch optically coupled between the first plurality of RRUs and the first plurality of BBUs.

Abstract: A method and apparatus for inspecting a test object. The apparatus comprises an inspection vehicle, a sensor structure, a first array of optical fibers, and a second array of optical fibers. The inspection vehicle is configured to move on a surface of the test object. The sensor structure is associated with the inspection vehicle. The first array of optical fibers is associated with the sensor structure. The first array of optical fibers is configured to transmit a pattern of light towards the surface of the test object and the pattern of light is configured to cause sound waves in the test object when the pattern of light encounters the test object. The second array of optical fibers is associated with the sensor structure. The second array of optical fibers is configured to detect a response to the sound waves.

Abstract: In one embodiment, a micro-electro-mechanical-system (MEMS) photonic switch includes a first plurality of collimators and a first mirror array optically coupled to the first plurality of collimators. The first mirror array includes a first plurality of first MEMS mirrors integrated on a first substrate and a first plurality of first photodiodes integrated on the first substrate, where the photodiodes are disposed in interstitial spaces between the MEMS mirrors.

Abstract: In one embodiment, a micro-electro-mechanical-system (MEMS) photonic switch includes a first plurality of collimators and a first minor array optically coupled to the first plurality of collimators, where the first minor array includes a first plurality of minors, and where a first minor of the first plurality of minors includes a first plurality of photodiodes integrated on the first mirror.