Patents by Inventor Alan J. O'Donnell

Alan J. O'Donnell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vertically integrated systems
    Patent number: 8853799
    Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: October 7, 2014
    Assignee: Analog Devices, Inc.
    Inventors: Alan J. O'Donnell, Santiago Iriarte, Mark J. Murphy, Colin G. Lyden, Gary Casey, Eoin Edward English
  • System with recessed sensing or processing elements
    Patent number: 8779532
    Abstract: Backside recesses in a base member host components, such as sensors or circuits, to allow closer proximity and efficient use of the surface space and internal volume of the base member. Recesses may include covers, caps, filters and lenses, and may be in communication with circuits on the frontside of the base member, or with circuits on an active backside cap. An array of recessed components may a form complete, compact sensor system.
    Type: Grant
    Filed: February 14, 2013
    Date of Patent: July 15, 2014
    Assignee: Analog Devices, Inc.
    Inventors: Alan J. O'Donnell, Michael J. Cusack, Rigan F. McGeehan, Garrett A. Griffin
  • VERTICALLY INTEGRATED SYSTEMS
    Publication number: 20140175524
    Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.
    Type: Application
    Filed: February 25, 2014
    Publication date: June 26, 2014
    Applicant: ANALOG DEVICES, INC.
    Inventors: Alan J. O'DONNELL, Santiago IRIARTE, Mark J. MURPHY, Colin G. LYDEN, Gary CASEY, Eoin Edward ENGLISH
  • VERTICALLY INTEGRATED SYSTEMS
    Publication number: 20140175600
    Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.
    Type: Application
    Filed: February 25, 2014
    Publication date: June 26, 2014
    Applicant: Analog Devices, Inc.
    Inventors: Alan J. O'DONNELL, Santiago IRIARTE, Mark J. MURPHY, Colin G. LYDEN, Gary CASEY, Eoin Edward ENGLISH
  • VERTICALLY INTEGRATED SYSTEMS
    Publication number: 20140035630
    Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.
    Type: Application
    Filed: September 30, 2013
    Publication date: February 6, 2014
    Applicant: ANALOG DEVICES, INC.
    Inventors: Alan J. O'DONNELL, Santiago IRIARTE, Mark J. MURPHY, Colin G. LYDEN, Gary CASEY, Eoin Edward ENGLISH
  • VERTICALLY INTEGRATED SYSTEMS
    Publication number: 20140034104
    Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.
    Type: Application
    Filed: September 30, 2013
    Publication date: February 6, 2014
    Applicant: Analog Devices, Inc.
    Inventors: Alan J. O'DONNELL, Santiago IRIARTE, Mark J. MURPHY, Colin G. LYDEN, Gary CASEY, Eoin Edward ENGLISH
  • VERTICALLY INTEGRATED SYSTEMS
    Publication number: 20140026649
    Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.
    Type: Application
    Filed: September 30, 2013
    Publication date: January 30, 2014
    Applicant: ANALOG DEVICES, INC.
    Inventors: Alan J. O'DONNELL, Santiago IRIARTE, Mark J. MURPHY, Colin G. LYDEN, Gary CASEY, Eoin Edward ENGLISH
  • System with recessed sensing or processing elements
    Patent number: 8390083
    Abstract: Backside recesses in a base member host components, such as sensors or circuits, to allow closer proximity and efficient use of the surface space and internal volume of the base member. Recesses may include covers, caps, filters and lenses, and may be in communication with circuits on the frontside of the base member, or with circuits on an active backside cap. An array of recessed components may a form complete, compact sensor system.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: March 5, 2013
    Assignee: Analog Devices, Inc.
    Inventors: Alan J. O'Donnell, Michael J. Cusack, Rigan F. McGeehan, Garrett A. Griffin
  • System with Recessed Sensing or Processing Elements
    Publication number: 20110057273
    Abstract: Backside recesses in a base member host components, such as sensors or circuits, to allow closer proximity and efficient use of the surface space and internal volume of the base member. Recesses may include covers, caps, filters and lenses, and may be in communication with circuits on the frontside of the base member, or with circuits on an active backside cap. An array of recessed components may a form complete, compact sensor system.
    Type: Application
    Filed: September 4, 2009
    Publication date: March 10, 2011
    Applicant: ANALOG DEVICES, INC.
    Inventors: Alan J. O'Donnell, Michael J. Cusack, Rigan F. McGeehan, Garrett A. Griffin