Abstract: A magnetic memory device includes a first electrode, a second electrode, and a layer stack located between the first electrode and the second electrode. The layer stack includes a reference layer, a tunnel barrier layer, a free layer, and a magnetoelectric multiferroic layer including at least one crystalline grain. The magnetization of the magnetoelectric multiferroic layer may be axial, canted, or in-plane. For axial or canted magnetization of the magnetoelectric multiferroic layer, a deterministic switching of the free layer may be achieved through coupling with the axial component of magnetization of the magnetoelectric multiferroic layer. Alternatively, the in-plane magnetization of the magnetoelectric multiferroic layer may be employed to induce precession of the magnetization angle of the free layer.

Abstract: A magnetic memory device includes a first electrode, a second electrode, and a layer stack located between the first electrode and the second electrode. The layer stack includes a reference layer, a tunnel barrier layer, a free layer, and a magnetoelectric multiferroic layer including at least one crystalline grain. The magnetization of the magnetoelectric multiferroic layer may be axial, canted, or in-plane. For axial or canted magnetization of the magnetoelectric multiferroic layer, a deterministic switching of the free layer may be achieved through coupling with the axial component of magnetization of the magnetoelectric multiferroic layer. Alternatively, the in-plane magnetization of the magnetoelectric multiferroic layer may be employed to induce precession of the magnetization angle of the free layer.

Abstract: A magnetic device includes a first electrode, a second electrode, a plurality of magnetic junctions each containing a ferromagnetic reference layer and a ferromagnetic free layer located between the first electrode and the second electrode, and a plurality of magnetoelectric multiferroic portions having different structural defect densities located between the first electrode and the second electrode. Each of the plurality of magnetoelectric multiferroic portions is magnetically coupled to the ferromagnetic free layer of a respective one of the plurality of magnetic junctions.

Abstract: A magnetoresistive memory device includes a first electrode, a second electrode, and a layer stack located between the first electrode and the second electrode. The layer stack may include a ferroelectric material layer and a metamagnetic tunnel junction containing a metamagnetic material layer, an insulating barrier layer, and a metallic material layer. Alternatively, the layer stack may include a multiferroic material layer, the metamagnetic material layer, the insulating barrier layer, and a reference magnetization layer.

Abstract: A ferroelectric memory device includes a two-dimensional electron gas channel, a gate electrode, and a ferroelectric element located between the gate electrode and the two-dimensional electron gas channel.

Abstract: A magnetoresistive memory device includes a first electrode, a second electrode, and a layer stack located between the first electrode and the second electrode. The layer stack may include a ferroelectric material layer and a metamagnetic tunnel junction containing a metamagnetic material layer, an insulating barrier layer, and a metallic material layer. Alternatively, the layer stack may include a multiferroic material layer, the metamagnetic material layer, the insulating barrier layer, and a reference magnetization layer.

Abstract: A magnetoresistive memory device includes a first electrode, a second electrode, and a layer stack located between the first electrode and the second electrode. The layer stack may include a ferroelectric material layer and a metamagnetic tunnel junction containing a metamagnetic material layer, an insulating barrier layer, and a metallic material layer. Alternatively, the layer stack may include a multiferroic material layer, the metamagnetic material layer, the insulating barrier layer, and a reference magnetization layer.

Abstract: A magnetoresistive memory device includes a first electrode, a second electrode, and a layer stack located between the first electrode and the second electrode. The layer stack may include a ferroelectric material layer and a metamagnetic tunnel junction containing a metamagnetic material layer, an insulating barrier layer, and a metallic material layer. Alternatively, the layer stack may include a multiferroic material layer, the metamagnetic material layer, the insulating barrier layer, and a reference magnetization layer.

Abstract: Magnetoelectric or magnetoresistive memory cells may include a plurality of reference layers and optionally a plurality of free layers to enhance the tunneling magnetoresistance (TMR) ratio.

Abstract: A data storage drive includes a magnetic recording media comprising a ferroelectric layer between a bottom electrode layer and a top electrode layer. An applied voltage to the ferroelectric layer generates a strain that is transferred to a ferromagnetic recording layer formed proximate to the ferroelectric layer. The change in strain transferred to the recording layer changes the magnetic properties of the recording layer. A voltage can be selectively applied to all or part of the ferroelectric layer to place the ferromagnetic recording layer in a low coercivity state to assist in writing data. Voltage-assisted magnetic recording (VAMR) is provided based upon control of a magnetic recording media comprising a ferroelectric layer between a bottom electrode layer and a top electrode layer.

Abstract: A magnetic device includes a first electrode, a second electrode, a plurality of magnetic junctions each containing a ferromagnetic reference layer and a ferromagnetic free layer located between the first electrode and the second electrode, and a plurality of magnetoelectric multiferroic portions having different structural defect densities located between the first electrode and the second electrode. Each of the plurality of magnetoelectric multiferroic portions is magnetically coupled to the ferromagnetic free layer of a respective one of the plurality of magnetic junctions.

Abstract: A magnetoresistive memory device includes a first electrode, a second electrode, and a layer stack containing an electric field-modulated magnetic transition layer and a ferroelectric insulator layer located between the first electrode and the second electrode, The electric field-modulated magnetic transition layer includes a non-metallic magnetic material having a ferromagnetic state and a non-ferromagnetic state with a state transition therebetween that depends on an external electric field.

Abstract: Magnetoelectric or magnetoresistive memory cells include at least one of a high dielectric constant dielectric capping layer and/or a nonmagnetic metal dust layer located between the free layer and the dielectric capping layer.

Abstract: A magnetoresistive memory device includes a magnetic tunnel junction comprising a free layer, a reference layer, and an insulating tunnel barrier layer located between the free layer and the reference layer, a perpendicular magnetic anisotropy (PMA) ferromagnetic layer that is vertically spaced from the free layer, an electrically conductive, non-magnetic interlayer exchange coupling layer located between the free layer and the PMA ferromagnetic layer. The magnetoresistive memory device is a hybrid magnetoresistive memory device which is programmed by a combination of a spin-torque transfer effect and a voltage-controlled exchange coupling effect.

Abstract: Magnetoelectric or magnetoresistive memory cells include at least one of a high dielectric constant dielectric capping layer and/or a nonmagnetic metal dust layer located between the free layer and the dielectric capping layer.

Abstract: Magnetoelectric or magnetoresistive memory cells include at least one of a high dielectric constant dielectric capping layer and/or a nonmagnetic metal dust layer located between the free layer and the dielectric capping layer.

Abstract: A magnetoresistive memory device includes a first electrode, a second electrode, and a layer stack containing an electric field-modulated magnetic transition layer and a ferroelectric insulator layer located between the first electrode and the second electrode, The electric field-modulated magnetic transition layer includes a non-metallic magnetic material having a ferromagnetic state and a non-ferromagnetic state with a state transition therebetween that depends on an external electric field.

Abstract: Magnetoelectric or magnetoresistive memory cells include at least one of a high dielectric constant dielectric capping layer and/or a nonmagnetic metal dust layer located between the free layer and the dielectric capping layer.

Abstract: Magnetoelectric or magnetoresistive memory cells include at least one of a high dielectric constant dielectric capping layer and/or a nonmagnetic metal dust layer located between the free layer and the dielectric capping layer.

Abstract: A magnetoresistive memory device includes a first electrode, a second electrode, and a layer stack containing an electric field-modulated magnetic transition layer and a ferroelectric insulator layer located between the first electrode and the second electrode, The electric field-modulated magnetic transition layer includes a non-metallic magnetic material having a ferromagnetic state and a non-ferromagnetic state with a state transition therebetween that depends on an external electric field.