Abstract: Systems for detecting unexpected program flow may include a hardware program flow monitor to generate an interrupt signal if a software program flow value does not match an incrementally updated hardware value when a processor executes a program flow check instruction. In some examples, a program of instructions may include a number of program flow check instructions. When a program flow check instruction is executed, the processor may send the software value to be compared to the hardware register value. In an illustrative example, program execution causes the hardware value to be incremented in a hardware register. Upon execution of a program flow check instruction, the hardware value is compared to a software value associated with the program flow check instruction to determine if the program instructions have been executed in an expected sequence (e.g., according to an expected program flow).

Abstract: An apparatus including a semiconductor substrate is disclosed. A first semiconductor die is disposed on the semiconductor substrate. A first bond out pad is disposed on the semiconductor substrate adjacent to the first semiconductor die. A first sawn semiconductor die is disposed on the semiconductor substrate adjacent to the first semiconductor die and the first bond out pad.

Abstract: A method and system for utilizing a semiconductor wafer is disclosed. The wafer comprises a plurality of semiconductor die and a plurality of scribe areas interspersed between. The method and system comprises forming bond out pads in the scribe areas such that the bond out pads are disposed on the semiconductor wafer between the plurality of semiconductor die. Additionally, the method and system comprises separating the semiconductor wafer into individual die such that when the semiconductor wafer is separated in a first manner at least one product die is provided. Furthermore, when the semiconductor wafer is separated in a second manner at least one test die is provided.

Abstract: A method and system for utilizing a semiconductor wafer is disclosed. The wafer comprises a plurality of semiconductor die and a plurality of scribe areas interspersed between. The method and system comprises forming bond out pads in the scribe areas such that the bond out pads are disposed on the semiconductor wafer between the plurality of semiconductor die. Additionally, the method and system comprises separating the semiconductor wafer into individual die such that when the semiconductor wafer is separated in a first manner at least one product die is provided. Furthermore, when the semiconductor wafer is separated in a second manner at least one test die is provided.

Abstract: Systems for detecting unexpected program flow may include a hardware program flow monitor to generate an interrupt signal if a software program flow value does not match an incrementally updated hardware value when a processor executes a program flow check instruction. In some examples, a program of instructions may include a number of program flow check instructions. When a program flow check instruction is executed, the processor may send the software value to be compared to the hardware register value. In an illustrative example, program execution causes the hardware value to be incremented in a hardware register. Upon execution of a program flow check instruction, the hardware value is compared to a software value associated with the program flow check instruction to determine if the program instructions have been executed in an expected sequence (e.g., according to an expected program flow).