Abstract: A technique relates to a semiconductor device. A source/drain layer is formed. Fins with gate stacks are formed in a fill material, a dummy fin template including at least one fin of the fins and at least one gate stack of the gate stacks, the fins being formed on the source/drain layer. A trench is formed through the fill material by removing the dummy fin template, such that a portion of the source/drain layer is exposed in the trench. A source/drain metal contact is formed on the portion of the source/drain layer in the trench.

Abstract: A technique relates to a semiconductor device. A source/drain layer is formed. Fins with gate stacks are formed in a fill material, a dummy fin template including at least one fin of the fins and at least one gate stack of the gate stacks, the fins being formed on the source/drain layer. A trench is formed through the fill material by removing the dummy fin template, such that a portion of the source/drain layer is exposed in the trench. A source/drain metal contact is formed on the portion of the source/drain layer in the trench.

Abstract: A technique relates to a semiconductor device. A source/drain layer is formed. Fins with gate stacks are formed in a fill material, a dummy fin template including at least one fin of the fins and at least one gate stack of the gate stacks, the fins being formed on the source/drain layer. A trench is formed through the fill material by removing the dummy fin template, such that a portion of the source/drain layer is exposed in the trench. A source/drain metal contact is formed on the portion of the source/drain layer in the trench.

Abstract: A technique relates to a semiconductor device. A source/drain layer is formed. Fins with gate stacks are formed in a fill material, a dummy fin template including at least one fin of the fins and at least one gate stack of the gate stacks, the fins being formed on the source/drain layer. A trench is formed through the fill material by removing the dummy fin template, such that a portion of the source/drain layer is exposed in the trench. A source/drain metal contact is formed on the portion of the source/drain layer in the trench.

Abstract: A solar module (and its fabrication method) is presented where a supporting substrate comprises a network of finger traces connected to bus bars. Photo-active layer portions and upper electrode layer portions are deposited on the substrate thereby forming a network of cells. The cells are connected in series by connecting the bus bar of one cell to the upper electrode layer of the adjacent cell, and the bus bars of two adjacent cells are coupled through a bypass element for protecting the cell array.

Abstract: An electronic module for a system for neural applications comprising a housing and a filtering element that form a closed, miniaturized Faraday cage a corresponding lead, active lead can, a controller and systems.

Abstract: A lead for brain applications, comprises at least one distal section and at least one electrode, whereby the at least one electrode is arranged in the distal section and whereby the at least one electrode is connected directly and/or indirectly with at least one first connecting trace and at least one second connecting trace. Furthermore, in some examples, the lead relates to a deep brain stimulation (DBS) system.

Abstract: In some examples, a medical device system a thin film including at least one electrically conductive track extending between at least one electrode and at least one electrical contact, a first and second polymer layer; wherein, at a portion of the thin film between the at least one electrode and the at least one electrical contact, the first polymer layer and second polymer layer surround the at least one electrically conductive track; and at least one discrete ceramic member located between the first and second polymer layers at a portion of the thin film between the at least one electrode and the at least one electrical contact, wherein the at least one discrete ceramic member does not surround the at least one conductive track, and wherein the at least one discrete ceramic member is configured to increase adhesion between the first polymer layer and second polymer layer.

Abstract: A thin film for a lead for brain applications includes at least one section comprising a high conductive metal and a low conductive metal, whereby the low conductive metal is a biocompatible metal and has a lower electrical conductivity than the high conductive metal and whereby the high conductive metal is at least partially encapsulated by the low conductive metal. Furthermore, the present invention relates to a method of manufacturing a thin film for a lead for brain applications and a deep brain stimulation system.

Abstract: The present invention relates to a probe comprising at least one lead and an Advanced Lead Connector (ALC) element, the lead comprising at least one thin film, whereby the thin film comprises a proximal end and a distal end, the lead further comprising a plurality of electrodes on the distal end of the thin film, the ALC element comprising electronic means to address the plurality of electrodes and at least one ALC connecting means, whereby the proximal end of the thin film and the ALC connecting means are connected by an interposing means so as to form at least an electric and/or electronic connection between the electrodes and the ALC element. Furthermore, the present invention relates to a neurostimulation and/or neurorecording system, an interposing means, an assembly comprising at least one thin film for a lead of a probe and an ALC element and a method of manufacturing a probe.

Abstract: In some examples, the present disclosure relates to an implantable medical lead and medical device systems employing such leads for medical applications, such as, e.g., neural stimulation, deep brain stimulation, and/or sensing of bioelectrical signals. In one example, the lead includes a thin film configured to be secured to at least a portion of a carrier core, wherein the thin film has a distal end, a proximal end, and at least one electrode between the proximal end and the distal end; and at least one fixation element configured to secure the distal end of the thin film to the carrier core, wherein the fixation element comprises at least one of a distal extension portion of the thin film at least partially wrapped around the carrier core distal to the at least one electrode or a jacket tube located around the carrier core and the thin film.

Abstract: An apparatus is described for coating a flexible substrate with at least a first organic layer and a first inorganic layer. The apparatus comprises a first and a second chamber and an atmosphere decoupling slot between the first and the second chamber. A printing facility is arranged in the first chamber, for printing the flexible substrate with a mixture comprising at least one precursor for a polymer, oligomer or a polymer network and a polymerization initiator. A curing facility is arranged in the first chamber, for curing the deposited mixture, therewith forming the at least first organic layer. A vapor deposition facility is arranged in the second chamber, for depositing the at least first inorganic layer at the substrate provided with the at least first organic layer. The apparatus comprises a facility for guiding the flexible substrate along the printing facility, along the curing facility and via the atmosphere decoupling slot along the vapor deposition facility.

Abstract: An electronic module (500) for a system for neural applications (100) comprising a housing (530) and a filtering element (567) that form a closed, miniaturized Faraday cage a corresponding lead, active lead can, a controller and systems.

Abstract: An opto-electric device includes an opto-electric layer structure having an anode and a cathode layer and an opto-electric layer arranged between the anode and cathode layers, and having a light-transmission side. A dual electrically conductive layer structure is arranged at a side of the opto-electric layer structure opposite the light-transmission side, the dual electrically conductive layer structure having a first and a second electrically conductive layer mutually insulated by a first electrically insulating layer. A second electrically insulating layer is arranged between the light emitting layer structure and the dual electrically conductive layer structure, wherein the first electrically conductive layer is electrically connected by at least a first transverse electrical conductor with the anode layer and the second electrically conductive layer is electrically connected by at least a second transverse electrical conductor with the cathode layer.

Abstract: An opto-electrical device is provided that comprises a cover (10), a barrier structure (20), an opto-electrical structure (30) and a plurality of transverse electrical conductors (40).

Abstract: A system is disclosed for protecting a network against malicious attacks or attempts for unauthorized access. A network is connected to an external network by a number of firewalls. Inspectors detect packets blocked by the firewalls and some or all of the packets are detected to a labyrinth configured to emulated an operational network and response to the packets in order to engage an attacker. Blocked packets may be detected by comparing packets entering and exiting a firewall. Packets for which a corresponding packets are not received within a transit delay may be identified as blocked. Entering and exiting packets may be compared by comparing only header information. A central module may receive information from the inspectors and generate statistical information and generate instructions for the inspectors, such as blacklists of addresses known to be used by attackers.

Abstract: A lead for use in neural stimulation comprises a core section having a proximal end and a distal end. A plurality of electrodes is coupled to the core section proximate the distal end. At least one contact is coupled to the core section proximate the proximal end. At least one thin film is wound around the core section from the proximal end to the distal end and electrically coupling the at least one contact and the plurality of electrodes. The at least one thin film forms a curved substantially planar shape in a relaxed state before being wound around the core section.

Abstract: In some examples, a medical device system a thin film including at least one electrically conductive track extending between at least one electrode and at least one electrical contact, a first and second polymer layer; wherein, at a portion of the thin film between the at least one electrode and the at least one electrical contact, the first polymer layer and second polymer layer surround the at least one electrically conductive track; and at least one discrete ceramic member located between the first and second polymer layers at a portion of the thin film between the at least one electrode and the at least one electrical contact, wherein the at least one discrete ceramic member does not surround the at least one conductive track, and wherein the at least one discrete ceramic member is configured to increase adhesion between the first polymer layer and second polymer layer.

Abstract: In some examples, the present disclosure relates to an implantable medical lead and medical device systems employing such leads for medical applications, such as, e.g., neural stimulation, deep brain stimulation, and/or sensing of bioelectrical signals. In one example, the lead includes a thin film configured to be secured to at least a portion of a carrier core, wherein the thin film has a distal end, a proximal end, and at least one electrode between the proximal end and the distal end; and at least one fixation element configured to secure the distal end of the thin film to the carrier core, wherein the fixation element comprises at least one of a distal extension portion of the thin film at least partially wrapped around the carrier core distal to the at least one electrode or a jacket tube located around the carrier core and the thin film.

Abstract: An organic light-emitting device is provided comprising a stack of layers including —an electro-optical layer structure (10) having a light emissive surface (12), —a light extraction structure (20) adjacent the light emissive surface, the light extraction structure has a nanostructured layer (22); and a backfill layer (24) comprising a material having a second index of refraction different from the first index of refraction, wherein the backfill layer (24) forms a planarizing layer over the nanostructured layer (22). The light emitting device includes a barrier film that comprises a first and a second inorganic layer (22, 26) and an organic layer (24) arranged between said inorganic layers. The one (22) of the inorganic layers of the barrier film closest to the electro-optical layer structure forms the nanostructured layer and the organic layer (24) between the inorganic layers forms the backfill layer.