Abstract: An embodiment of a method for producing traceable integrated circuits includes forming on a wafer of semiconductor material functional regions for implementing specific functionalities of corresponding integrated circuits, forming at least one seal ring around each functional region of the corresponding integrated circuit, and forming on each integrated circuit at least one marker indicative of information of the integrated circuit. Forming on each integrated circuit at least one marker may include forming the at least one marker on at least a portion of the respective seal ring that is visible.

Abstract: A detection device is formed in a body of semiconductor material having a first face, a second face, and a cavity. A detection area formed in the cavity, and a gas pump is integrated in the body and configured to force movement of gas towards the detection area. A detection system of an optical type or a detector of alpha particles is arranged at least in part in the detection area.

Abstract: An integrated electronic circuit having probe indentations filled by a hard covering substance. The integrated circuit device results from a process of manufacture including forming a substrate comprising a plurality of functional components of the electronic circuit, creating a plurality of conductive layers on such substrate to form an electric contact region with high hardness equal to or greater than a first hardness value of about 300 HV, contacting the electric contact region with a probe thereby causing an indentation. In an embodiment, the process further comprises, after the test run, creating a covering conductive layer on at least one part of the electric contact region contacted by the probe to fill the indentation.

Abstract: An integrated circuit on a substrate including at least one peripheral portion that surrounds an active area and is realized close to at least one scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in its peripheral portion on different planes starting from the substrate and realizes an integrated antenna for the circuit.

Abstract: An integrated electronic device 1 for detecting at least one parameter related to humidity and/or presence of water and/or acidity/basicity of an environment surrounding the device is described. Such device 1 comprises a separation layer 14 from the surrounding environment, comprising at least one portion of insulating material 14, and further comprises a first conductive member 11 and a second conductive member 12, made of an electrically conductive material, arranged inside the separation layer 14, with respect to the surrounding environment, and separated from the surrounding environment by the separation layer 14. The device 1 also comprises a measurement module 15, having two measurement terminals 151, 152, electrically connected with the first 11 and the second 12 conductive members, respectively; the measurement module 15 is configured to provide an electric potential difference between the first 11 and the second 12 conductive members.

Abstract: The integrated electronic device detects the pressure related to a force applied in a predetermined direction within a solid structure. The device includes an integrated element that is substantially orthogonal to the direction of application of the force. First and second conductive elements are configured to face an operating surface. A measure module includes first and second measurement terminals which are electrically connected to the first and second conductive elements, respectively. A detecting element is arranged in the predetermined direction such that the operating surface is sandwiched between the first and second conductive elements and this detecting element. An insulating layer galvanically insulates the first and second conductive elements.

Abstract: The present invention relates to a new method for isolating ingenol (C20H28O5) from mixtures of diterpenoid esters and ingenol esters in a single step. Ingenol isolated by means of this method can be used as a precursor for the synthesis of biologically active ingenol derivatives, such as ingenol-3-angelate and ingenol-3-tigliate.

Abstract: An embodiment, in a single structure, combines a pad including a connection terminal suitable for coupling the circuit elements integrated in a chip to circuits outside of the chip itself and at least one capacitor. By combining a connection pad and a capacitor in a single structure, it may be possible to reduce the overall area of the chip that otherwise in common integrated circuits would be greater due to the presence of the capacitor itself. In this way, the costs and size of the chip can be reduced.

Abstract: A magnetic relay device having a substrate of semiconductor material houses two through magnetic vias of electrically conductive ferromagnetic material. At least one coil is arranged underneath a first surface of the substrate in proximity of at least one between the first and second magnetic vias, and a contact structure, of ferromagnetic material, is arranged over a second surface of the substrate and is controlled by the magnetic field generated by the coil so as to switch between an open position, wherein the contact structure electrically disconnects the first and second magnetic vias, and a close position, wherein the contact structure electrically connects the first and second magnetic vias.

Abstract: An integrated electronic device, delimited by a first surface and by a second surface and including: a body made of semiconductor material, formed inside which is at least one optoelectronic component chosen between a detector and an emitter; and an optical path which is at least in part of a guided type and extends between the first surface and the second surface, the optical path traversing the body. The optoelectronic component is optically coupled, through the optical path, to a first portion of free space and a second portion of free space, which are arranged, respectively, above and underneath the first and second surfaces.

Abstract: An electrical check executed on wafer tests for the correct positioning or alignment of the probes of a probe card on the pads or bumps of the electronic devices integrated on the wafer. A signal is applied to cause a current to circulate in at least part of a seal ring of at least one of the electronic devices. In a case where the current flows between and through multiple electronic devices, the seal rings of those electronic devices are suitably interconnected to each other by electronic structures that extend through the scribe line between electronic devices.

Abstract: An embodiment of a method is proposed for producing cantilever probes for use in a test apparatus of integrated electronic circuits; the probes are configured to contact during the test corresponding terminals of the electronic circuits to be tested. An embodiment comprises forming probe bodies of electrically conductive materials. In an embodiment, the method further includes forming on a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.

Abstract: An embodiment of a method for producing traceable integrated circuits includes forming on a wafer of semiconductor material functional regions for implementing specific functionalities of corresponding integrated circuits, forming at least one seal ring around each functional region of the corresponding integrated circuit, and forming on each integrated circuit at least one marker indicative of information of the integrated circuit. Forming on each integrated circuit at least one marker may include forming the at least one marker on at least a portion of the respective seal ring that is visible.

Abstract: A packaged semiconductor device includes a communication pad formed in a side surface, which is operatively coupled to a communication circuit so as to enable the establishing of a wireless communication channel to an adjacently positioned packaged semiconductor device. The communication pad may be formed upon cutting a block including the packaged semiconductor device and an appropriately positioned and dimensioned conductor.

Abstract: A testing system for carrying out electrical testing of at least one first through via forms an insulated via structure extending only part way through a substrate of a first body of semiconductor material. The testing system has a first electrical test circuit integrated in the first body and electrically coupled to the insulated via structure. The first electrical test circuit enables detection of at least one electrical parameter of the insulated via structure.

Abstract: An integrated magnetic sensor formed by a semiconductor chip having a surface and accommodating a magnetic via and a sensing coil. The magnetic via is formed by a cylindrical layer of ferromagnetic material that extends perpendicular to the surface of the first chip and has in cross-section an annular shape of a circular or elliptical or curvilinear type. The sensing coil surrounds the magnetic via at a distance and is connected to an electronic circuit.

Abstract: An integrated electronic device, delimited by a first surface and by a second surface and including: a body made of semiconductor material, formed inside which is at least one optoelectronic component chosen between a detector and an emitter; and an optical path which is at least in part of a guided type and extends between the first surface and the second surface, the optical path traversing the body. The optoelectronic component is optically coupled, through the optical path, to a first portion of free space and a second portion of free space, which are arranged, respectively, above and underneath the first and second surfaces.

Abstract: An electronic communications device includes a body of semiconductor material with an integrated electronic circuit, an inductive element, and a capacitive element. The capacitive element is formed by a first electrode and a second electrode positioned between the inductive element and the integrated electronic circuit. Tuning of the device circuitry is accomplished by energizing the inductive/capacitive elements, determining resonance frequency, and using a laser trimming operation to alter the structure of one or more of the first electrode, second electrode or inductive element and change the resonance frequency.

Abstract: An integrated circuit on a substrate including at least one peripheral portion that surrounds an active area and is realized close to at least one scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in its peripheral portion on different planes starting from the substrate and realizes an integrated antenna for the circuit.

Abstract: An embodiment of a RF identification device is formed by a tag and by a reader. The tag is formed by a processing circuit and a first antenna, which has the function both of transmitting and of receiving data. The reader is formed by a control circuit and by a second antenna, which has the function both of transmitting and of receiving data. The processing circuit is formed by a resonance capacitor, a modulator, a rectifier circuit, a charge-pump circuit and a detection circuit. The antenna of the tag and the processing circuit are integrated in a single structure in completely monolithic form. The first antenna has terminals connected to the input of the rectifier circuit, the output of which is connected to the charge-pump circuit. The charge-pump circuit has an output connected to the detection circuit.