Abstract: A commutating circuit includes a single-ended mixer and a passive network. The single-ended mixer includes a differential local oscillator terminal. The passive network includes a plurality of inductors and a capacitor. The plurality of inductors can be coupled to the differential local oscillator terminal. The plurality of inductors can provide an impedance in accordance with a common mode or a differential mode. The commutating circuit can be implemented via a device, a system and/or a method.

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract: Variable gain amplifiers and methods of designing the same include a first amplifying transistor configured to receive a first input signal and to provide a first amplified output signal based on the first input signal. A phase compensating resistor is connected to the first amplifying transistor and has a resistance calibrated as: R e = ? b C be , par where ?b is the base transit time of the first amplifying transistor and Cbe,par is the gain-independent part of the base-emitter capacitance of the first amplifying transistor.

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract: An amplifier circuit including a substrate layer and a plurality of lateral bipolar junction transistors positioned entirely above the substrate. The lateral bipolar junction transistors include a plurality of monolithic emitter-collector regions coplanar to each other. Each of the emitter-collector regions is both an emitter region of a first bipolar junction transistor a collector region of a second bipolar junction transistor from the lateral bipolar junction transistors. Accordingly, the lateral bipolar junction transistors are electrically coupled in series circuit at the emitter-collector regions.

Abstract: Variable gain amplifiers and methods of designing the same include a first amplifying transistor configured to receive a first input signal and to provide a first amplified output signal based on the first input signal. A phase compensating resistor is connected to the first amplifying transistor and has a resistance that compensates for a phase dependence of the first amplifying transistor, such that an output phase of the amplified output signal is dependent only on a phase of the input signal and is independent of an amplification of the first amplifying transistor.

Abstract: An apparatus for decoding a data modulated signal includes a signal receiver that receives a data modulated signal that is encoded with phase-shift keying (PSK) and provides an amplified signal corresponding to the data modulated signal, a tunable phase shifter that receives a local reference signal and a selected phase shift, applies the selected phase shift to the local reference signal to produce a phase shifted reference signal, a summing unit that sums the amplified signal and the phase shifted reference signal to produce a summed signal, an amplitude detector that determines an amplitude of the summed signal, and a symbol detector that varies the selected phase shift and determines a current symbol within the data modulated signal based on the amplitude of the summed signal as the selected phase shift is varied. A corresponding method is also disclosed herein.

Abstract: A voltage controlled oscillator comprises a negative resistance, a first inductor, a fixed capacitor, and a frequency control component. The frequency control component comprises at least one varactor and at least a second inductor connected in series with the at least one varactor. A magnitude of an inductance of the second inductor is selected such that the frequency control component has an effective capacitance range larger than a capacitance range of the at least one varactor.

Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.

Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.

Abstract: An apparatus for calibrating a multi-antenna system includes an unmanned aerial vehicle (UAV). The UAV includes one or more millimeter-wave (mm-wave) single channel radios that can transmit and receive a mm-wave signal to or from a multi-antenna system under test; at least one directional antenna connected to the one or more radios; sensors that determine a position of the UAV; an omni-directional mobile or Wi-Fi transceiver that communicates with an operator; and a digital microprocessor unit connected to the one or more mm-wave single channel radios, the sensors, and the omni-directional mobile or Wi-Fi transceiver. The digital microprocessor unit can control motion of the UAV and analyze signals received from the one or more mm-wave single channel radios and the at least one directional antenna using position information received from the sensors.

Abstract: An apparatus comprises a digitally controlled circuit having a variable capacitance and a controller configured to adjust a magnitude of the variable capacitance of the digitally controlled circuit. The digitally controlled circuit comprises a plurality of gain elements, the plurality of gain elements comprising one or more positive voltage-to-frequency gain elements and one or more negative voltage-to-frequency gain elements. The controller is configured to adjust the magnitude of the capacitance by adjusting the gain provided by respective ones of the gain elements in an alternating sequence of the positive voltage-to-frequency gain elements and the negative voltage-to-frequency gain elements.

Abstract: A millimeter-wave (MMW) communication system may include an antenna array structure operating within a MMW band, having both a first antenna coupling point and a second antenna coupling point, whereby the first and the second location of the antenna coupling points are within a coplanar surface on which the antenna array structure is formed. The system may further include a first MMW transmitter that couples a first data modulated MMW signal to the first antenna coupling point and a second MMW transmitter that couples a second data modulated MMW signal to the second antenna coupling point. Coupling the first data modulated MMW signal to the first antenna coupling point generates a first MMW radio signal transmitted at a first propagation direction and coupling the second data modulated MMW signal to the second antenna coupling point generates a second MMW radio signal transmitted at a second propagation direction.

Abstract: A voltage controlled oscillator (VCO), a method of designing a voltage controlled oscillator, and a design structure comprising a semiconductor substrate including a voltage controlled oscillator are disclosed. In one embodiment, the VCO comprises an LC tank circuit for generating an oscillator output at an oscillator frequency, and an oscillator core including cross-coupled semiconductor devices to provide feedback to the tank circuit. The VCO further comprises a supply node, a tail node, and a noise by-pass circuit connected to the supply and tail nodes, in parallel with the tank circuit and the oscillator core. The by-pass circuit forms a low-impedance path at a frequency approximately twice the oscillator frequency to at least partially immunize the oscillator core from external noise and to reduce noise contribution from the cross-coupled semiconductor devices.

Abstract: A method includes forming a resonator comprising a plurality of switched impedances spatially distributed within the resonator, selecting a resonant frequency for the resonator, and distributing two or more transconductance elements within the resonator based on the selected resonant frequency. Distributing the two or more transconductance elements may include non-uniformly distributing the two or more transconductance elements within the resonator.

Abstract: A method includes forming a resonator comprising a plurality of switched impedances spatially distributed within the resonator, selecting a resonant frequency for the resonator, and distributing two or more transconductance elements within the resonator based on the selected resonant frequency. Distributing the two or more transconductance elements may include non-uniformly distributing the two or more transconductance elements within the resonator.

Abstract: A composition, and its method of manufacture, is provided for the settling of solids suspended in liquids passing through a reactor housing containing the composition whereupon the composition can dissolve and enter into the liquid and then contact the suspended solids in the liquid. A system and method of for treating water or sewage is further provided. The system can include a screening tank, a septic tank, a flocculant and mixing reactor, a primary clarifier, a secondary clarifier, a sludge dewatering tank, a surge tank, one or more filter tanks and a disinfection tank. The method can include the steps of receiving water or sewage to be treated and passing it through a screening tank and septic tank, a flocculant reactor, a primary clarifier, a secondary clarifier, a sludge dewatering tank, a surge tank, one or more filter tanks and a disinfection tank.

Abstract: A plate varactor includes a dielectric substrate and a first electrode embedded in a surface of the substrate. A capacitor dielectric layer is disposed over the first electrode, and a layer of graphene is formed over the dielectric layer to contribute a quantum capacitance component to the dielectric layer. An upper electrode is formed on the layer of graphene. Other embodiments and methods for fabrication are also included.

Abstract: Transmit/receive switches and methods for radio control include connecting a first reactive impedance in parallel with a power amplifier on a transmit path during reception to neutralize a reactive impedance of the power amplifier and to prevent received signals from entering the transmit path. The first reactive impedance is disconnected during transmission.

Abstract: A voltage controlled oscillator (VCO), a method of designing a voltage controlled oscillator, and a design structure comprising a semiconductor substrate including a voltage controlled oscillator are disclosed. In one embodiment, the VCO comprises an LC tank circuit for generating an oscillator output at an oscillator frequency, and an oscillator core including cross-coupled semiconductor devices to provide feedback to the tank circuit. The VCO further comprises a supply node, a tail node, and a noise by-pass circuit connected to the supply and tail nodes, in parallel with the tank circuit and the oscillator core. The by-pass circuit forms a low-impedance path at a frequency approximately twice the oscillator frequency to at least partially immunize the oscillator core from external noise and to reduce noise contribution from the cross-coupled semiconductor devices.