Abstract: A method includes forming a resonator comprising a plurality of switched impedances spatially distributed within the resonator, selecting a resonant frequency for the resonator, and distributing two or more transconductance elements within the resonator based on the selected resonant frequency. Distributing the two or more transconductance elements may include non-uniformly distributing the two or more transconductance elements within the resonator.

Abstract: Variable gain amplifiers and methods of designing the same include a first amplifying transistor configured to receive a first input signal and to provide a first amplified output signal based on the first input signal. A phase compensating resistor is connected to the first amplifying transistor and has a resistance that compensates for a phase dependence of the first amplifying transistor, such that an output phase of the amplified output signal is dependent only on a phase of the input signal and is independent of an amplification of the first amplifying transistor.

Abstract: A method for phased array tapering includes setting a gain at a phase-invariant variable gain amplifier in each of a plurality of front-ends of a phased array transceiver to perform tapering of beam pattern side lobes. A resistance in the phase-invariant variable gain amplifier is set to provide a phase shift that is independent of gain.

Abstract: Methods and systems for tag-based identification include reading a counterfeit-proof identification tag using a sensor in a user device. Features of the identification tag are extracted in accordance with a feature extraction function, using a processor, to generate a tag bit sequence. A challenge function is applied to the extracted features to generate a result. The result is transmitted to a remote server to authenticate the identification tag.

Abstract: An apparatus includes a first conductive path comprising a first set of inductive elements connected in series, a second conductive path comprising a second set of inductive elements connected in series, each inductive element of the second set of inductive elements inductively coupled to, and having a mutual capacitance with, a corresponding inductive element of the first set of inductive elements. In some embodiments, the apparatus further includes a first amplifier having an amplifier input and an amplifier output, the amplifier output electrically connected to a proximal end of the first conductive path or the second conductive path. The described apparatus delays a signal according to the gain of the input amplifier. A method that uses the described apparatus is also disclosed herein.

Abstract: A millimeter-wave (MMW) communication system may include an antenna array structure operating within a MMW band, having both a first antenna coupling point and a second antenna coupling point, whereby the first and the second location of the antenna coupling points are within a coplanar surface on which the antenna array structure is formed. The system may further include a single MMW transmitter device having a power splitter that splits a data modulated MMW signal into a first MMW data modulated signal and a second MMW data modulated signal identical to the first MMW data modulated signal, such that the first data modulated MMW signal is coupled to the first antenna coupling point for radio propagation at a first direction, and the second data modulated MMW signal is coupled to the second antenna coupling point for radio propagation at a second direction.

Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.

Abstract: Transmit/receive switches and methods for radio control include connecting a first reactive impedance in parallel with a power amplifier on a transmit path during reception to neutralize a reactive impedance of the power amplifier and to prevent received signals from entering the transmit path. The first reactive impedance is disconnected during transmission.

Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.

Abstract: A plate varactor includes a dielectric substrate and a first electrode embedded in a surface of the substrate. A capacitor dielectric layer is disposed over the first electrode, and a layer of graphene is formed over the dielectric layer to contribute a quantum capacitance component to the dielectric layer. An upper electrode is formed on the layer of graphene. Other embodiments and methods for fabrication are also included.

Abstract: A reconfigurable bandstop filter and methods of designing and reconfiguring the bandstop filter are disclosed. The reconfigurable bandstop filter includes a plurality of transmission lines each including a phase shifter. The reconfigurable bandstop filter further includes a signal input port having a phase shifter and a signal output port having a phase shifter. The signal input port and the signal output port is coupled to the plurality of transmission lines.

Abstract: A switched capacitor is provided. The switched capacitor includes a pair of parallel component stacks. Each stack is connected to a common top node and a common bottom node. Each stack includes a BJT. Each stack further includes a first resistor in series with the BJT and having a first side connected to a collector of the BJT at an intermediate node in a same one of the stacks and a second side connected to the common top node. Each stack also includes a capacitor having a first side connected to the intermediate node and a second side for providing an impedance. Each stack additionally includes a second resistor having a first side connected to a base of the BJT to prevent base-current surge in the BJT and a second side connected to a switch base control signal that selectively turns the BJT on or off.

Abstract: Methods and systems for phase shifting include a hybrid quadrature coupler having an input, an output, and two termination loads. Each termination load includes multiple terminations, each termination having a varactor; and one or more transmission lines separating the terminations. A control module is configured to determine a phase shift and gain to apply to the input and to independently control a capacitance of each varactor such that the output of the hybrid quadrature coupler is shifted by the determined phase shift relative to the input with the determined gain.

Abstract: A system and method for treating water or sewage is provided. The system can include a screening tank, a septic tank, a flocculant and mixing reactor, a primary clarifier, a secondary clarifier, a sludge dewatering tank, a surge tank, one or more filter tanks and a disinfection tank. The method can include the steps of receiving water or sewage to be treated and passing it through a screening tank and septic tank, a flocculant reactor, a primary clarifier, a secondary clarifier, a sludge dewatering tank, a surge tank, one or more filter tanks and a disinfection tank.

Abstract: Transmit/receive switches and methods for radio control include connecting a first reactive impedance in parallel with a power amplifier on a transmit path during reception to neutralize a reactive impedance of the power amplifier and to prevent received signals from entering the transmit path. The first reactive impedance is disconnected during transmission.

Abstract: Systems, methods, devices and apparatuses directed to transceiver devices are disclosed. In accordance with one method, a first set of antenna positions in a first section of a set of sections of a circuit layout for the circuit package is selected. The method further includes selecting another set of antenna positions in another section of the circuit layout such that an arrangement of selected antenna positions of the other set is different from an arrangement of selected antenna positions of a previously selected set of antenna positions. The selecting another set of positions in another section is iterated until selections have been made for a total number of antennas. The selecting the other set is performed such that consecutive unselected positions in the other section do not exceed a predetermined number of positions. In addition, antenna elements are formed at the selected positions to fabricate the circuit package.

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract: Methods and systems for controlling variable gain amplifiers include setting a phase at a phase shifter in each of multiple of front-ends of a phased array transceiver, accounting for a constant phase shift of a phase-invariant variable gain amplifier. A gain is set at the phase-invariant variable gain amplifier in each of the multiple front-ends to perform tapering of beam pattern side lobes. A resistance in the phase-invariant variable gain amplifier is set to provide a phase shift that is independent of gain.

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract: Methods for frequency multiplying include receiving a signal having an input frequency at a frequency multiplier comprising a pair of transistors; and selecting a harmonic in the signal by connecting the transistors to a common impedance through a respective collector impedance, wherein an output frequency at the harmonic between the collector impedances and the common impedance is an even integer multiple of an input frequency.