Abstract: The disclosed technology relates generally to semiconductor devices and manufacturing methods thereof, and more particularly to field-effect transistors operating at different voltages and methods for integrating the same.

Abstract: The disclosed technology generally relates to a memory selector and to a memory device including the memory selector, and more particularly to the memory selector and the memory device implemented in a crossbar memory architecture. In one aspect, a memory selector for a crossbar memory architecture comprises a metal bottom electrode, a metal top electrode and an intermediate layer stack between and in contact with the metal top and bottom electrodes. A bottom Schottky barrier having a bottom Schottky barrier height (?B) is formed at the interface between the metal bottom electrode and the intermediate layer stack. A top Schottky barrier having a top Schottky barrier height (?T) is formed at the interface between the metal top electrode and the intermediate layer stack. The disclosed technology further relates to a random access memory (RAM) and a memory cell including the memory selector.

Abstract: A system and method of simulating device aging based on a digital waveform representative of a workload of an electronic device are disclosed. In one aspect, the method comprises grouping contiguous sets of cycles into segments, each set corresponding to a segment. Each segment has values for a combination of segment parameters that are unique from each of the other segments and a start point that is separated from a start point of an adjacent segment by a pre-defined distance criterion. Grouping the sets into the segments comprises, for each segment: sampling one or more sequential cycles of the workload, generating the segment based on the sampled contiguous cycles having a period exceeding a threshold period, and determining the values for the combination of segment parameters. The method further comprises applying an aging model to the segments to simulate the aging. The segments are a representation of the digital waveform.

Abstract: A method for forming airgaps within an integrated electronic circuit implements a conformal layer and a nanosheet both of boron nitride. The method has advantages for the circuit due to special properties of boron nitride material. In particular, mechanical strength and heat dissipation are increased whereas electro-migration is limited. The method may be applied to the first interconnect layer of the integrated circuit, for reducing additionally capacitive interactions existing between gate electrode structures and source or drain contact structures.

Abstract: The disclosed technology generally relates to semiconductor devices and methods of manufacturing semiconductor devices such as both logic and memory semiconductor devices. In one aspect, a semiconductor device includes a semiconductor substrate having a channel region between a source and a drain region, a gate structure arranged to control the channel region and a dielectric structure arranged between the channel region and the gate structure. The dielectric structure includes a high-k dielectric layer or a high-k ferroelectric layer and at least one two dimensional (2D) hexagonal boron-nitride (h-BN) layer in direct contact with the high-k dielectric layer or the high-k ferroelectric layer.

Abstract: The disclosed technology is generally directed to semiconductor integrated circuit devices and more particularly to a three-transistor random access memory (3T RAM) device, and a method of fabricating and operating the same. In one aspect, a 3T RAM cell includes a ferroelectric-based field effect transistor (FeFET) having a first gate connected as a storage node and a second transistor connected between the FeFET and a read bit line having a second gate connected to a read word line. The 3T RAM cell also includes a third transistor connected between the storage node and a write bit line having a third gate connected to a write word line.

Abstract: The disclosed technology relates generally to semiconductor devices and manufacturing methods thereof, and more particularly to field-effect transistors operating at different voltages and methods for integrating the same.

Abstract: Embodiments disclosed herein may relate to adjusting an aspect of a programming pulse for one or more memory cells, such as based at least in part on one or more detected programmed resistance values for the one or more memory cells.

Abstract: The disclosed technology generally relates to semiconductor devices and methods of manufacturing semiconductor devices such as both logic and memory semiconductor devices. In one aspect, a semiconductor device includes a semiconductor substrate having a channel region between a source and a drain region, a gate structure arranged to control the channel region and a dielectric structure arranged between the channel region and the gate structure. The dielectric structure includes a high-k dielectric layer or a high-k ferroelectric layer and at least one two dimensional (2D) hexagonal boron-nitride (h-BN) layer in direct contact with the high-k dielectric layer or the high-k ferroelectric layer.

Abstract: A method for forming airgaps within an integrated electronic circuit implements a conformal layer and a nanosheet both of boron nitride. The method has advantages for the circuit due to special properties of boron nitride material. In particular, mechanical strength and heat dissipation are increased whereas electro-migration is limited. The method may be applied to the first interconnect layer of the integrated circuit, for reducing additionally capacitive interactions existing between gate electrode structures and source or drain contact structures.

Abstract: The disclosed technology is generally directed to semiconductor integrated circuit devices and more particularly to a three-transistor random access memory (3T RAM) device, and a method of fabricating and operating the same. In one aspect, a 3T RAM cell includes a ferroelectric-based field effect transistor (FeFET) having a first gate connected as a storage node and a second transistor connected between the FeFET and a read bit line having a second gate connected to a read word line. The 3T RAM cell also includes a third transistor connected between the storage node and a write bit line having a third gate connected to a write word line.

Abstract: The disclosed technology generally relates to a memory selector and to a memory device including the memory selector, and more particularly to the memory selector and the memory device implemented in a crossbar memory architecture. In one aspect, a memory selector for a crossbar memory architecture comprises a metal bottom electrode, a metal top electrode and an intermediate layer stack between and in contact with the metal top and bottom electrodes. A bottom Schottky barrier having a bottom Schottky barrier height (?B) is formed at the interface between the metal bottom electrode and the intermediate layer stack. A top Schottky barrier having a top Schottky barrier height (?T) is formed at the interface between the metal top electrode and the intermediate layer stack. The disclosed technology further relates to a random access memory (RAM) and a memory cell including the memory selector.

Abstract: Embodiments disclosed herein may relate to adjusting an aspect of a programming pulse for one or more memory cells, such as based at least in part on one or more detected programmed resistance values for the one or more memory cells.

Abstract: The disclosed technology generally relates to semiconductor devices, and more particularly to transistor devices such as metal-oxide-semiconductor (MOS) transistor devices. In one aspect, a transistor device comprises a channel region in a substrate partially delimited by a source and a drain junction at a main surface of the substrate. A first dielectric layer stack is arranged on the channel region, such that an orthogonal projection of the first dielectric layer stack on the main surface defining a first area is between and does not overlap the junctions and. A second dielectric layer stack is formed laterally adjacent to and in contact with the first dielectric layer stack, such that an orthogonal projection of the second dielectric layer stack overlaps the junction and defines a second area. A metal gate layer is formed on the first and second dielectric layer stacks, where an orthogonal projection of the metal gate layer on the main surface overlaps the first area and the second area.

Abstract: Embodiments disclosed herein may relate to adjusting an aspect of a programming pulse for one or more memory cells, such as based at least in part on one or more detected programmed resistance values for the one or more memory cells.

Abstract: According to one aspect, a ferroelectric field effect transistor (FeFET) memory device and a method of programming the device is disclosed. The FeFET is configured such that a ferroelectric memory region of the FeFET is programmable by an electric field applied between a gate structure and a source region and a drain region through the ferroelectric region.

Abstract: Embodiments disclosed herein may relate to adjusting an aspect of a programming pulse for one or more memory cells, such as based at least in part on one or more detected programmed resistance values for the one or more memory cells.

Abstract: Embodiments disclosed herein may relate to adjusting an aspect of a programming pulse for one or more memory cells, such as based at least in part on one or more detected programmed resistance values for the one or more memory cells.

Abstract: Embodiments disclosed herein may relate to adjusting an aspect of a programming pulse for one or more memory cells, such as based at least in part on one or more detected programmed resistance values for the one or more memory cells.

Abstract: Embodiments disclosed herein may relate to adjusting an aspect of a programming pulse for one or more memory cells, such as based at least in part on one or more detected programmed resistance values for the one or more memory cells.