Abstract: Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a discrete array component including a pattern formed on the PCB which is a merger of a set of via pads and a discrete array component; wherein the pattern is generated by a pin mapping between the discrete array component and a via grid array on the PCB; and wherein the pattern is formed of a metal etched during a manufacturing process of the PCB.

Abstract: A printed circuit board (PCB) having a layout aligned with a Ball Grid Array (BGA) package, the PCB including a plurality of victim vias arranged in the PCB, at least one aggressor via arranged in the PCB having a transition with at least one victim via, wherein the transition is a space in the PCB between a victim via and an aggressor via along a row direction or a column direction, and the victim via is not positioned next to more than one transition.

Abstract: Disclosed is a socket apparatus for ball grid array (BGA) balls, including a base member of electrically insulative material, a plurality of electrical contact members disposed in row and column configuration attached to the electrically insulative material, a plate member extending in a row direction, and a plurality of extension members connected to the plate member and configured to press BGA balls of a mounted BGA into the plurality of electrical contact members when the plate member is pulled in a first direction.

Abstract: A printed circuit board (PCB) having a layout aligned with a Ball Grid Array (BGA) package, the PCB including a plurality of victim vias arranged in the PCB, at least one aggressor via arranged in the PCB having a transition with at least one victim via, wherein the transition is a space in the PCB between a victim via and an aggressor via along a row direction or a column direction, and the victim via is not positioned next to more than one transition.

Abstract: Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a discrete array component including a pattern formed on the PCB which is a merger of a set of via pads and a discrete array component; wherein the pattern is generated by a pin mapping between the discrete array component and a via grid array on the PCB; and wherein the pattern is formed of a metal etched during a manufacturing process of the PCB.

Abstract: A method of laying out electrical connections on a printed circuit board (PCB) including: establishing primary design axes X and Y of the PCB respectively parallel to the weave of the fiberglass fibers in the PCB; selecting a non-zero routing angle ?; defining routing axes X? and Y? that are rotated by +? from axes X and Y; defining routing axes X? and Y? that are rotated by ?? from axes X and Y; determining a shortest route between a first point and a second point to be electrically connected, wherein the route traverses a path constrained to extend along the X?, Y?, X? and Y? axes.

Abstract: Disclosed is a socket apparatus for ball grid array (BGA) balls, including a base member of electrically insulative material, a plurality of electrical contact members disposed in row and column configuration attached to the electrically insulative material, a plate member extending in a row direction, and a plurality of extension members connected to the plate member and configured to press BGA balls of a mounted BGA into the plurality of electrical contact members when the plate member is pulled in a first direction.

Abstract: An apparatus configured to temporarily support a Ball Grid Array (BGA) component against a printed circuit board (PCB) during a manufacturing reflow operation, the apparatus including a support plate sized to fit over the BGA and having one or more mounting holes external to the periphery of the Ball Grid Array component, a retaining member for each mounting hole, passing through said mounting hole, a resilient biasing member for each retaining member, wherein the resilient biasing member urges the support plate against the BGA component from below the BGA component such that the BGA component is urged against the PCB.

Abstract: An underlying recess is provided for component placement beneath Ball Grid Arrays allowing closer proximity for decoupling capacitors and other components. The underlying recess placement of components assists in minimizing reliability issues concerning surface mount components and provides closer proximity placement of components. The underlying recess placement of components is particularly useful for overcoming the problem of parasitic inductance of more distant component placements known in the art.

Abstract: Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a discrete array component including a pattern formed on the PCB which is a merger of a set of via pads and a discrete array component; wherein the pattern is generated by a pin mapping between the discrete array component and a via grid array on the PCB; and wherein the pattern is formed of a metal etched during a manufacturing process of the PCB.

Abstract: Disclosed is a socket apparatus for gripping the balls of a ball grid array (BGA), including a base member of electrically insulative material, an array of pairs of electrical contacts disposed in the base member in a configuration corresponding to a terminal ball configuration of said BGA to be mated with the socket apparatus, a first plate member disposed for slidable movement on said base member and having a plurality of parallel extension members extending therefrom and configured to pass through the array of pairs of electrical contacts, a second plate member disposed for slidable movement on said base member and having a plurality of parallel extension members extending therefrom and configured to pass through the array of pairs of electrical contacts, the plurality of parallel extension members of said first plate member disposed between the plurality of parallel extension members of said second plate member, a plurality of insulative nodules disposed on each extension member with nodules forming an ar

Abstract: A method and apparatus for cross-modal matching with polarimetric thermal image data is provided. According to one embodiment, the method comprises receiving a plurality of polarimetric thermal images of a face acquired by a polarimetric thermal imaging camera, extracting features of the face from each of the plurality of images to generate a plurality of feature vectors for each of the plurality of images, compositing the feature vectors for each of the plurality of images together to form composite feature vectors and cross-modally matching the composite feature vectors with other feature vectors, in order to determine whether the face matches a face represented by the other feature vectors.

Abstract: Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a surface mount component including: a plurality of metal pads on the surface of one side of the PCB corresponding to connection points on the component, wherein at least a portion of the plurality of metal pads have stubs which extend outside the boundary of the surface mount component when the surface mount component is mounted to the PCB; and wherein the stubs have sufficient thermal conductivity to facilitate at least one of the set of dismounting and reattaching of the surface mount component.

Abstract: A relieved component pad for 0201 component use between vias on a tight-pitch Ball Grid Array is disclosed herein. The relieved component pad for 0201 component use between vias provides substantially rectangular component pads having a relieved section at a point of closest approach to a via pad. The relieved component pad for 0201 component use is particularly useful for overcoming the problem of 0201 component placement on tight-pitch arrays known in the art.

Abstract: A relieved component pad for 0201 component use between vias on a tight-pitch Ball Grid Array is disclosed herein. The relieved component pad for 0201 component use between vias provides substantially rectangular component pads having a relieved section at a point of closest approach to a via pad.

Abstract: A method and apparatus for cross-modal matching with polarimetric thermal image data is provided. According to one embodiment, the method comprises receiving a plurality of polarimetric thermal images of a face acquired by a polarimetric thermal imaging camera, extracting features of the face from each of the plurality of images to generate a plurality of feature vectors for each of the plurality of images, compositing the feature vectors for each of the plurality of images together to form composite feature vectors and cross-modally matching the composite feature vectors with other feature vectors, in order to determine whether the face matches a face represented by the other feature vectors.

Abstract: A printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array is disclosed. The printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array provides component landing pads sized to accommodate an 0204 surface mount component within a 1.2 mm by 1.0 mm rectangular spacing. The printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array is particularly useful for overcoming the problem of component placement on tight-pitch arrays known in the art.

Abstract: Disclosed is a printed circuit board (PCB) having backdrill reliability anchors comprising nonfunctional pads to provide mechanical reinforcement for signal pads on backdrilled plated through hole (PTH) vias, as well as associated method and machine readable storage medium.

Abstract: Disclosed is a printed circuit board (PCB) having backdrill reliability anchors comprising nonfunctional pads to provide mechanical reinforcement for signal pads on backdrilled plated through hole (PTH) vias, as well as associated method and machine readable storage medium.

Abstract: An apparatus and method for temperature induced warpage compensation in an integrated circuit package is disclosed. The apparatus consists of bonded layers of material having different thermal coefficients of expansion. The bonded layers are bonded to the top of the integrated circuit package. By appropriate choice of temperature coefficients the layers of material can compensate for either convex or concave warpage. In some embodiments, the layers of material have apertures therein allowing compensation for more complex warpages. As well, in some embodiments the top layer of material does not have a planar cross-section. A method is also disclosed for manufacturing an integrated circuit package assembly. The apparatus and method provide an alternative to methods of dealing with IC package warpage known in the art.